Chia-Peng Sun

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Zhubei, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of measuring voids in underfill package
- Patent number 11,521,903
- Issue date Dec 6, 2022
- Coretech System Co., Ltd.
- Chien-Ting Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of measuring underfill profile of underfill cavity having so...
- Patent number 11,355,361
- Issue date Jun 7, 2022
- Coretech System Co., Ltd.
- Yu-En Liang
- H01 - BASIC ELECTRIC ELEMENTS