Chia-Sheng HSU

Person

Hsin-Chu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device with receiving function
- Patent number 12,253,879
- Issue date Mar 18, 2025
- Quanta Computer Inc.
- Chia-Jung Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Metallization structure
- Patent number 12,249,568
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and fabrication method thereof
- Patent number 12,245,519
- Issue date Mar 4, 2025
- United Microelectronics Corp.
- Chia-Chang Hsu
Information Patent Grant
Molding system for fabricating fiber reinforcement polymer composit...
- Patent number 12,235,614
- Issue date Feb 25, 2025
- Coretech System Co., Ltd.
- Chi-Hua Yu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Package structure and methods of manufacturing the same
- Patent number 12,237,277
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for direct bonding in semiconductor die manufac...
- Patent number 12,237,299
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Chia Jung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly for blocking unwanted light, camera module,...
- Patent number 12,225,660
- Issue date Feb 11, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Ying-Lin Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Memory cell of charge-trapping non-volatile memory
- Patent number 12,199,160
- Issue date Jan 14, 2025
- Ememory Technology Inc.
- Chia-Jung Hsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Dynamic loading neural network inference at DRAM/on-bus SRAM/serial...
- Patent number 12,197,926
- Issue date Jan 14, 2025
- Mediatek Inc.
- Chih-Hsiang Hsiao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method for semiconductor structure having a plurality...
- Patent number 12,191,401
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Ming Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical member driving mechanism
- Patent number 12,174,449
- Issue date Dec 24, 2024
- TDK TAIWAN CORP.
- Chih-Wei Weng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor die package with multi-lid structures and method for...
- Patent number 12,170,238
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor cell and structure thereof
- Patent number 12,170,283
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,154,888
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit packages and methods of formin...
- Patent number 12,154,896
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method
- Patent number 12,148,684
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of manufacturing same
- Patent number 12,148,746
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processor, operation method, and load-store device for implementati...
- Patent number 12,147,810
- Issue date Nov 19, 2024
- ANDES TECHNOLOGY CORPORATION
- Chia-Wei Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for fabricating semiconductor package
- Patent number 12,132,021
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Channel access priority class for signaling radio bearers in new ra...
- Patent number 12,127,253
- Issue date Oct 22, 2024
- MediaTek Singapore Pte Ltd.
- Abhishek Roy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
100BASE-TX transceiver with transmit clock selected from output clo...
- Patent number 12,120,213
- Issue date Oct 15, 2024
- Airoha Technology Corp.
- Chia-Hsing Hsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip package structure
- Patent number 12,113,033
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning method and overlay measurement method
- Patent number 12,106,962
- Issue date Oct 1, 2024
- United Microelectronics Corp.
- Yi Jing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,107,164
- Issue date Oct 1, 2024
- United Microelectronics Corp.
- Chia-Jhe Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,102,014
- Issue date Sep 24, 2024
- United Microelectronics Corp.
- Hui-Lin Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with curved conductive lines and method of for...
- Patent number 12,100,664
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 12,100,732
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Wei Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,094,956
- Issue date Sep 17, 2024
- United Microelectronics Corp.
- Chin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcing package using reinforcing patches
- Patent number 12,094,810
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eccentric via structures for stress reduction
- Patent number 12,094,828
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE
- Publication number 20250079246
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER GENERATING DEVICE AND POWER SUPPLYING METHOD THEREOF
- Publication number 20250079853
- Publication date Mar 6, 2025
- National Tsing-Hua University
- Chao-I Liu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ETHERNET PHYSICAL-LAYER TRANSCEIVER USING DIFFERENT PHASE COMBINATI...
- Publication number 20250080449
- Publication date Mar 6, 2025
- Airoha Technology Corp.
- Yi-Ching Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAPACITOR CELL AND STRUCTURE THEREOF
- Publication number 20250072108
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH VARIABLE SOLDER RESIST OPENING DIMENSION...
- Publication number 20250070033
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITIONS OF (Z)-ENDOXIFEN AND METHODS OF ENRICHMENT THEREOF
- Publication number 20250066286
- Publication date Feb 27, 2025
- ATOSSA THERAPEUTICS, INC.
- Steven C. Quay
- C07 - ORGANIC CHEMISTRY
Information Patent Application
OPTICAL MEMBER DRIVING MECHANISM
- Publication number 20250067954
- Publication date Feb 27, 2025
- TDK TAIWAN CORP.
- Chih-Wei WENG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH MULTI-LID STRUCTURES AND METHOD FOR...
- Publication number 20250069982
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING PACKAGE LID WITH A RECESS AND METHODS O...
- Publication number 20250070084
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for adaptive multi-window technology
- Publication number 20250053429
- Publication date Feb 13, 2025
- MEDIATEK INC.
- Chung-Yang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method And Apparatus For Reporting Aggregated Bandwidth Capability...
- Publication number 20250056327
- Publication date Feb 13, 2025
- MEDIATEK INC.
- Mu-Tai Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Auto-regressive system and Auto-regressive Method for a Large Langu...
- Publication number 20250053821
- Publication date Feb 13, 2025
- MEDIATEK SINGAPORE PTE LTD
- Jia Yao Christopher LIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR HANDLING ARTIFICIAL INTELLIGENCE M...
- Publication number 20250036977
- Publication date Jan 30, 2025
- MEDIATEK INC.
- Chia-Wei Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEALING STRUCTURE
- Publication number 20250019129
- Publication date Jan 16, 2025
- LITE-ON TECHNOLOGY CORPORATION
- Yun Hao Fan
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429316
- Publication date Dec 26, 2024
- UNITED MICROELECTRONICS CORP.
- Chia-Jhe Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRELESS NETWORK DEVICE AND SIGNAL TRANSMISSION METHOD
- Publication number 20240430955
- Publication date Dec 26, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- LI-KUAN CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COMMUNICATION DEVICE AND TRANSMISSION METHOD
- Publication number 20240422765
- Publication date Dec 19, 2024
- Realtek Semiconductor Corp.
- Chia-Yu Hsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240415026
- Publication date Dec 12, 2024
- UNITED MICROELECTRONICS CORP.
- Hui-Lin Wang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240395909
- Publication date Nov 28, 2024
- UNITED MICROELECTRONICS CORP.
- Chin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SNAPBACK ELECTROSTATIC DISCHARGE (ESD) CIRCUIT, SYSTEM AND METHOD O...
- Publication number 20240395799
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lin HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY CELL OF ARRAY STRUCTURE AND ASSOCIATED CONTROLL...
- Publication number 20240395342
- Publication date Nov 28, 2024
- EMEMORY TECHNOLOGY INC.
- Chia-Jung HSU
- G11 - INFORMATION STORAGE
Information Patent Application
CROSS-LAYER OPTIMIZATION FOR CONGESTION CONTROL AND TRAFFIC PRIORIT...
- Publication number 20240396846
- Publication date Nov 28, 2024
- MEDIATEK SINGAPORE PTE LTD
- Jozsef Gabor NEMETH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME
- Publication number 20240387515
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD
- Publication number 20240387339
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH DUMMY VIAS
- Publication number 20240387349
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME
- Publication number 20240387465
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387472
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microfluidic chip and use thereof for continuous monitoring of bact...
- Publication number 20240384321
- Publication date Nov 21, 2024
- National Health Research Institutes
- Chia-Hsien HSU
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMIN...
- Publication number 20240387519
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR DATA SCHEDULING
- Publication number 20240388974
- Publication date Nov 21, 2024
- MEDIATEK INC.
- Chi-Hsuan HSIEH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Chia-Sheng HSU

Person

Patents Grantslast 30 patents

Electronic device with receiving function

Metallization structure

Semiconductor memory device and fabrication method thereof

Molding system for fabricating fiber reinforcement polymer composit...

Package structure and methods of manufacturing the same

Systems and methods for direct bonding in semiconductor die manufac...

Circuit board assembly for blocking unwanted light, camera module,...

Memory cell of charge-trapping non-volatile memory

Dynamic loading neural network inference at DRAM/on-bus SRAM/serial...

Manufacturing method for semiconductor structure having a plurality...

Optical member driving mechanism

Semiconductor die package with multi-lid structures and method for...

Capacitor cell and structure thereof

Semiconductor package and method of manufacturing the same

Three-dimensional integrated circuit packages and methods of formin...

Package structure and method

Integrated circuit and method of manufacturing same

Processor, operation method, and load-store device for implementati...

Method for fabricating semiconductor package

Channel access priority class for signaling radio bearers in new ra...

100BASE-TX transceiver with transmit clock selected from output clo...

Chip package structure

Patterning method and overlay measurement method

Semiconductor device

Semiconductor device and method for fabricating the same

Semiconductor device with curved conductive lines and method of for...

Semiconductor device and method of manufacturing same

Semiconductor device and method for fabricating the same

Reinforcing package using reinforcing patches

Eccentric via structures for stress reduction

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE

POWER GENERATING DEVICE AND POWER SUPPLYING METHOD THEREOF

ETHERNET PHYSICAL-LAYER TRANSCEIVER USING DIFFERENT PHASE COMBINATI...

CAPACITOR CELL AND STRUCTURE THEREOF

SEMICONDUCTOR PACKAGE WITH VARIABLE SOLDER RESIST OPENING DIMENSION...

COMPOSITIONS OF (Z)-ENDOXIFEN AND METHODS OF ENRICHMENT THEREOF

OPTICAL MEMBER DRIVING MECHANISM

SEMICONDUCTOR DIE PACKAGE WITH MULTI-LID STRUCTURES AND METHOD FOR...

PACKAGE STRUCTURE INCLUDING PACKAGE LID WITH A RECESS AND METHODS O...

Method for adaptive multi-window technology

Method And Apparatus For Reporting Aggregated Bandwidth Capability...

Auto-regressive system and Auto-regressive Method for a Large Langu...

ELECTRONIC DEVICE AND METHOD FOR HANDLING ARTIFICIAL INTELLIGENCE M...

SEALING STRUCTURE

SEMICONDUCTOR DEVICE

WIRELESS NETWORK DEVICE AND SIGNAL TRANSMISSION METHOD

COMMUNICATION DEVICE AND TRANSMISSION METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SNAPBACK ELECTROSTATIC DISCHARGE (ESD) CIRCUIT, SYSTEM AND METHOD O...

NON-VOLATILE MEMORY CELL OF ARRAY STRUCTURE AND ASSOCIATED CONTROLL...

CROSS-LAYER OPTIMIZATION FOR CONGESTION CONTROL AND TRAFFIC PRIORIT...

INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME

PACKAGE STRUCTURE AND METHOD

CHIP PACKAGE STRUCTURE WITH DUMMY VIAS

INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Microfluidic chip and use thereof for continuous monitoring of bact...

THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMIN...

APPARATUS AND METHODS FOR DATA SCHEDULING