Chia-Sheng HSU

Person

Hsin-Chu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Optical member driving mechanism
- Patent number 12,174,449
- Issue date Dec 24, 2024
- TDK TAIWAN CORP.
- Chih-Wei Weng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor die package with multi-lid structures and method for...
- Patent number 12,170,238
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor cell and structure thereof
- Patent number 12,170,283
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,154,888
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit packages and methods of formin...
- Patent number 12,154,896
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method
- Patent number 12,148,684
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of manufacturing same
- Patent number 12,148,746
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processor, operation method, and load-store device for implementati...
- Patent number 12,147,810
- Issue date Nov 19, 2024
- ANDES TECHNOLOGY CORPORATION
- Chia-Wei Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for fabricating semiconductor package
- Patent number 12,132,021
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Channel access priority class for signaling radio bearers in new ra...
- Patent number 12,127,253
- Issue date Oct 22, 2024
- MediaTek Singapore Pte Ltd.
- Abhishek Roy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip package structure
- Patent number 12,113,033
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning method and overlay measurement method
- Patent number 12,106,962
- Issue date Oct 1, 2024
- United Microelectronics Corp.
- Yi Jing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,107,164
- Issue date Oct 1, 2024
- United Microelectronics Corp.
- Chia-Jhe Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,102,014
- Issue date Sep 24, 2024
- United Microelectronics Corp.
- Hui-Lin Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with curved conductive lines and method of for...
- Patent number 12,100,664
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 12,100,732
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Wei Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,094,956
- Issue date Sep 17, 2024
- United Microelectronics Corp.
- Chin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eccentric via structures for stress reduction
- Patent number 12,094,828
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcing package using reinforcing patches
- Patent number 12,094,810
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including magnetic tunnel junction structure
- Patent number 12,096,697
- Issue date Sep 17, 2024
- United Microelectronics Corp.
- Chih-Wei Kuo
Information Patent Grant
Driving circuit for providing control signals to touch display panel
- Patent number 12,086,339
- Issue date Sep 10, 2024
- Novatek Microelectronics Corp.
- Chia-Lun Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Non-volatile memory device and manufacturing method thereof
- Patent number 12,089,419
- Issue date Sep 10, 2024
- United Microelectronics Corp.
- Cheng-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having liquid-cooling lid
- Patent number 12,087,664
- Issue date Sep 10, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device convinient for replacement of camera module thereof
- Patent number 12,088,906
- Issue date Sep 10, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.
- Ye-Quang Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,080,638
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etchant compositions
- Patent number 12,074,034
- Issue date Aug 27, 2024
- Entegris, Inc.
- Chia-Jung Hsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor die package with ring structure and method for formin...
- Patent number 12,068,260
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,068,309
- Issue date Aug 20, 2024
- United Microelectronics Corp.
- Chih-Kai Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package structure
- Patent number 12,062,590
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,057,506
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ming Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429316
- Publication date Dec 26, 2024
- UNITED MICROELECTRONICS CORP.
- Chia-Jhe Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMUNICATION DEVICE AND TRANSMISSION METHOD
- Publication number 20240422765
- Publication date Dec 19, 2024
- Realtek Semiconductor Corp.
- Chia-Yu Hsu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240415026
- Publication date Dec 12, 2024
- UNITED MICROELECTRONICS CORP.
- Hui-Lin Wang
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240395909
- Publication date Nov 28, 2024
- UNITED MICROELECTRONICS CORP.
- Chin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY CELL OF ARRAY STRUCTURE AND ASSOCIATED CONTROLL...
- Publication number 20240395342
- Publication date Nov 28, 2024
- EMEMORY TECHNOLOGY INC.
- Chia-Jung HSU
- G11 - INFORMATION STORAGE
Information Patent Application
SNAPBACK ELECTROSTATIC DISCHARGE (ESD) CIRCUIT, SYSTEM AND METHOD O...
- Publication number 20240395799
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lin HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-LAYER OPTIMIZATION FOR CONGESTION CONTROL AND TRAFFIC PRIORIT...
- Publication number 20240396846
- Publication date Nov 28, 2024
- MEDIATEK SINGAPORE PTE LTD
- Jozsef Gabor NEMETH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE AND METHOD
- Publication number 20240387339
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH DUMMY VIAS
- Publication number 20240387349
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME
- Publication number 20240387515
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME
- Publication number 20240387465
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387472
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microfluidic chip and use thereof for continuous monitoring of bact...
- Publication number 20240384321
- Publication date Nov 21, 2024
- National Health Research Institutes
- Chia-Hsien HSU
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMIN...
- Publication number 20240387519
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR DATA SCHEDULING
- Publication number 20240388974
- Publication date Nov 21, 2024
- MEDIATEK INC.
- Chi-Hsuan HSIEH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240387405
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240379449
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei Ying LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20240379366
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Lun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE M...
- Publication number 20240379494
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER
- Publication number 20240379806
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-LAYER OPTIMIZATION IN XR-AWARE RAN TO LIMIT TEMPORAL ERROR PR...
- Publication number 20240380953
- Publication date Nov 14, 2024
- MEDIATEK SINGAPORE PTE LTD
- Jozsef Gabor NEMETH
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING
- Publication number 20240371854
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lin HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING CIRCUIT FOR TOUCH DISPLAY PANEL
- Publication number 20240370121
- Publication date Nov 7, 2024
- NOVATEK MICROELECTRONICS CORP.
- Chia-Lun HSU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240371925
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Wei HSU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240371855
- Publication date Nov 7, 2024
- UNITED MICROELECTRONICS CORP.
- Chih-Kai Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and manufacturing method thereof
- Publication number 20240371699
- Publication date Nov 7, 2024
- UNITED MICROELECTRONICS CORP.
- Ching-Ling Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CURVED CONDUCTIVE LINES AND METHOD OF FOR...
- Publication number 20240371783
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE AND METHOD FOR FORMIN...
- Publication number 20240363551
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240363483
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- TING-YU YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240363518
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- KUO-CHIANG TING
- H01 - BASIC ELECTRIC ELEMENTS

Chia-Sheng HSU

Person

Patents Grantslast 30 patents

Optical member driving mechanism

Semiconductor die package with multi-lid structures and method for...

Capacitor cell and structure thereof

Semiconductor package and method of manufacturing the same

Three-dimensional integrated circuit packages and methods of formin...

Package structure and method

Integrated circuit and method of manufacturing same

Processor, operation method, and load-store device for implementati...

Method for fabricating semiconductor package

Channel access priority class for signaling radio bearers in new ra...

Chip package structure

Patterning method and overlay measurement method

Semiconductor device

Semiconductor device and method for fabricating the same

Semiconductor device with curved conductive lines and method of for...

Semiconductor device and method of manufacturing same

Semiconductor device and method for fabricating the same

Eccentric via structures for stress reduction

Reinforcing package using reinforcing patches

Semiconductor device including magnetic tunnel junction structure

Driving circuit for providing control signals to touch display panel

Non-volatile memory device and manufacturing method thereof

Semiconductor package having liquid-cooling lid

Electronic device convinient for replacement of camera module thereof

Semiconductor device and method for manufacturing the same

Etchant compositions

Semiconductor die package with ring structure and method for formin...

Semiconductor device and method for fabricating the same

Method for manufacturing semiconductor package structure

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

COMMUNICATION DEVICE AND TRANSMISSION METHOD

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

NON-VOLATILE MEMORY CELL OF ARRAY STRUCTURE AND ASSOCIATED CONTROLL...

SNAPBACK ELECTROSTATIC DISCHARGE (ESD) CIRCUIT, SYSTEM AND METHOD O...

CROSS-LAYER OPTIMIZATION FOR CONGESTION CONTROL AND TRAFFIC PRIORIT...

PACKAGE STRUCTURE AND METHOD

CHIP PACKAGE STRUCTURE WITH DUMMY VIAS

INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME

INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Microfluidic chip and use thereof for continuous monitoring of bact...

THREE-DIMENSIONAL INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMIN...

APPARATUS AND METHODS FOR DATA SCHEDULING

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICES

HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE M...

SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER

CROSS-LAYER OPTIMIZATION IN XR-AWARE RAN TO LIMIT TEMPORAL ERROR PR...

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING

DRIVING CIRCUIT FOR TOUCH DISPLAY PANEL

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor structure and manufacturing method thereof

SEMICONDUCTOR DEVICE WITH CURVED CONDUCTIVE LINES AND METHOD OF FOR...

SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE AND METHOD FOR FORMIN...

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE