Chia-Sheng HSU

Person

Hsin-Chu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure
- Patent number 11,978,703
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ya-Chin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 11,978,714
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,973,001
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid storage tank
- Patent number 11,964,811
- Issue date Apr 23, 2024
- Delta Electronics, Inc.
- Yu-Jei Huang
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Low dropout regulator circuits, input/output device, and methods fo...
- Patent number 11,966,241
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huan-Neng Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package having improved thermal interface between sem...
- Patent number 11,967,570
- Issue date Apr 23, 2024
- Mediatek Inc.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acute kidney injury predicting system and method thereof
- Patent number 11,937,932
- Issue date Mar 26, 2024
- Taichung Veterans General Hospital
- Chieh-Liang Wu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor structure, electronic device, and method of manufactu...
- Patent number 11,942,467
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- I-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical mechanism
- Patent number 11,934,035
- Issue date Mar 19, 2024
- TDK TAIWAN CORP.
- Chien-Lun Huang
- G02 - OPTICS
Information Patent Grant
Synchronized hinges for foldable displays
- Patent number 11,927,991
- Issue date Mar 12, 2024
- Dell Products, L.P.
- Christopher A. Torres
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Gate structures in semiconductor devices
- Patent number 11,915,979
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei Ying Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having fin with all around gate
- Patent number 11,916,151
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chia-Ming Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a package
- Patent number 11,913,132
- Issue date Feb 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Chia Chun Hsu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Gear synchronized dual axis pivot hinge
- Patent number 11,907,027
- Issue date Feb 20, 2024
- Dell Products L.P.
- Christopher A. Torres
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Die corner removal for molding compound crack suppression in semico...
- Patent number 11,908,757
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of metal gate formation and structures formed by the same
- Patent number 11,908,749
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yi-Jing Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,908,800
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ya-Chin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,908,767
- Issue date Feb 20, 2024
- Mediatek Inc.
- Che-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and fabrication method thereof
- Patent number 11,895,927
- Issue date Feb 6, 2024
- United Microelectronics Corp.
- Chia-Chang Hsu
Information Patent Grant
Optical sensing device and optical sensing system thereof comprisin...
- Patent number 11,894,481
- Issue date Feb 6, 2024
- Epistar Corporation
- Yi-Chieh Lin
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method and apparatus for wireless reception
- Patent number 11,889,415
- Issue date Jan 30, 2024
- MediaTek Singapore Pte Ltd.
- Nathan Edward Tenny
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Floor types identifying device, dust suction device having the same...
- Patent number 11,882,986
- Issue date Jan 30, 2024
- TALENTONE HONG KONG LIMITED
- Chia-Chang Hsu
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Method of cutting fin
- Patent number 11,881,409
- Issue date Jan 23, 2024
- United Microelectronics Corp.
- Wei-Hao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a semiconductor device with interconnect part
- Patent number 11,881,453
- Issue date Jan 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Chia-Hsiang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
File versioning management method and file system
- Patent number 11,874,806
- Issue date Jan 16, 2024
- Qnap Systems, Inc.
- Chia-Hung Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for preparing semiconductor device structure with patterns h...
- Patent number 11,876,000
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Chia-Hsiang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit fin structure manufacturing method
- Patent number 11,861,282
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsiang Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages having conductive patterns of redistribution...
- Patent number 11,862,549
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,862,468
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuei-Lun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power clamp
- Patent number 11,855,452
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ken-Hao Fan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
Gate Structures in Semiconductor Devices
- Publication number 20240153823
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei Ying Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSING DEVICE AND OPTICAL SENSING SYSTEM THEREOF
- Publication number 20240136463
- Publication date Apr 25, 2024
- EPISTAR CORPORATION
- Yi-Chieh LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20240122078
- Publication date Apr 11, 2024
- UNITED MICROELECTRONICS CORP.
- Chia-Chang Hsu
Information Patent Application
ELECTROSTATIC DISCHARGE CIRCUIT AND METHOD OF OPERATING SAME
- Publication number 20240120735
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lin HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAY STATUS REPORT (DSR) FORMAT FOR XR SERVICE APPLICATION
- Publication number 20240114380
- Publication date Apr 4, 2024
- MEDIATEK INC.
- Ming-Yuan Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
BUFFER STATUS REPORT (BSR) TABLE AND BSR TRIGGER CONDITION FOR XR S...
- Publication number 20240114385
- Publication date Apr 4, 2024
- MEDIATEK INC.
- Ming-Yuan Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
AI-ML MODEL STORAGE IN OTT SERVER AND TRANSFER THROUGH UP TRAFFIC
- Publication number 20240114359
- Publication date Apr 4, 2024
- MEDIATEK INC.
- Ta-Yuan Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CIRCUIT PROTECTION DEVICE AND METHOD
- Publication number 20240113099
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lin HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPATIAL AND FREQUENCY DOMAIN BEAM MANAGEMENT USING TIME SERIES INFO...
- Publication number 20240106510
- Publication date Mar 28, 2024
- MEDIATEK INC.
- Abhishek Roy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ENHANCING WIRELESS COMMUNICATIONS EFFICIENCY IN 5G/6G NETWORKS THRO...
- Publication number 20240107597
- Publication date Mar 28, 2024
- MEDIATEK INC.
- Abhishek Roy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240096822
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHODS FOR FORMING THE SAME
- Publication number 20240099030
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT FIN STRUCTURE
- Publication number 20240086612
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsiang HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Die Structures and Methods of Forming the Same
- Publication number 20240079364
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Structures and Methods of Forming the Same
- Publication number 20240079391
- Publication date Mar 7, 2024
- Taiwan Semiconductor Mqanufacturing Co., Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Volume-less Fluorine Incorporation Method
- Publication number 20240071767
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsueh-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-PIECE TYPE STIFFENER STRUCTURE WITH BEVELED SURFACE FOR DELAMIN...
- Publication number 20240071949
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240063208
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Yen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...
- Publication number 20240063172
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Chia Jung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROGRAMMING METHOD OF NON-VOLATILE MEMORY CELL
- Publication number 20240055053
- Publication date Feb 15, 2024
- EMEMORY TECHNOLOGY INC.
- Chia-Jung HSU
- G11 - INFORMATION STORAGE
Information Patent Application
WEIGHING SYSTEM
- Publication number 20240053190
- Publication date Feb 15, 2024
- ASTEK TECHNOLOGY LTD.
- Ying-Li LEE
- G01 - MEASURING TESTING
Information Patent Application
Efficient Bandwidth Adaptation for a Wideband Carrier
- Publication number 20240056275
- Publication date Feb 15, 2024
- MEDIATEK INC.
- Pei-Kai Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING MAGNETIC TUNNEL JUNCTION STRUCTURE
- Publication number 20240049608
- Publication date Feb 8, 2024
- UNITED MICROELECTRONICS CORP.
- Chih-Wei Kuo
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240032440
- Publication date Jan 25, 2024
- UNITED MICROELECTRONICS CORP.
- Hui-Lin Wang
- G11 - INFORMATION STORAGE
Information Patent Application
UART-HUB DESIGN FOR MULTIPLE DATA TRANSMISSION
- Publication number 20240031438
- Publication date Jan 25, 2024
- MEDIATEK INC.
- Chia-Hung Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MODEM ASSISTED UL POWER SAVING
- Publication number 20240023074
- Publication date Jan 18, 2024
- MEDIATEK INC.
- Ming-Yuan Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240014180
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVING CIRCUIT FOR TOUCH DISPLAY PANEL
- Publication number 20240012500
- Publication date Jan 11, 2024
- NOVATEK MICROELECTRONICS CORP.
- Chia-Lun HSU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VECTOR PROCESSOR WITH VECTOR AND ELEMENT REDUCTION METHOD
- Publication number 20240004647
- Publication date Jan 4, 2024
- ANDES TECHNOLOGY CORPORATION
- Chia-Wei Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BACK SIDE ILLUMINATED IMAGE SENSOR DEVICE WITH SELECT DIELECTRIC LA...
- Publication number 20240006458
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Feng-Chien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Chia-Sheng HSU

Person

Patents Grantslast 30 patents

Semiconductor structure

Encapsulated package including device dies connected via interconne...

Semiconductor device and method of manufacture

Liquid storage tank

Low dropout regulator circuits, input/output device, and methods fo...

Semiconductor package having improved thermal interface between sem...

Acute kidney injury predicting system and method thereof

Semiconductor structure, electronic device, and method of manufactu...

Optical mechanism

Synchronized hinges for foldable displays

Gate structures in semiconductor devices

Semiconductor structure having fin with all around gate

Method for manufacturing a package

Gear synchronized dual axis pivot hinge

Die corner removal for molding compound crack suppression in semico...

Method of metal gate formation and structures formed by the same

Semiconductor structure

Semiconductor package structure

Semiconductor memory device and fabrication method thereof

Optical sensing device and optical sensing system thereof comprisin...

Method and apparatus for wireless reception

Floor types identifying device, dust suction device having the same...

Method of cutting fin

Method for preparing a semiconductor device with interconnect part

File versioning management method and file system

Method for preparing semiconductor device structure with patterns h...

Integrated circuit fin structure manufacturing method

Semiconductor packages having conductive patterns of redistribution...

Semiconductor device and method

Power clamp

Patents Applicationslast 30 patents

Gate Structures in Semiconductor Devices

OPTICAL SENSING DEVICE AND OPTICAL SENSING SYSTEM THEREOF

SEMICONDUCTOR MEMORY DEVICE AND FABRICATION METHOD THEREOF

ELECTROSTATIC DISCHARGE CIRCUIT AND METHOD OF OPERATING SAME

DELAY STATUS REPORT (DSR) FORMAT FOR XR SERVICE APPLICATION

BUFFER STATUS REPORT (BSR) TABLE AND BSR TRIGGER CONDITION FOR XR S...

AI-ML MODEL STORAGE IN OTT SERVER AND TRANSFER THROUGH UP TRAFFIC

INTEGRATED CIRCUIT PROTECTION DEVICE AND METHOD

SPATIAL AND FREQUENCY DOMAIN BEAM MANAGEMENT USING TIME SERIES INFO...

ENHANCING WIRELESS COMMUNICATIONS EFFICIENCY IN 5G/6G NETWORKS THRO...

PACKAGE STRUCTURE

CHIP PACKAGE AND METHODS FOR FORMING THE SAME

INTEGRATED CIRCUIT FIN STRUCTURE

Die Structures and Methods of Forming the Same

Die Structures and Methods of Forming the Same

Volume-less Fluorine Incorporation Method

TWO-PIECE TYPE STIFFENER STRUCTURE WITH BEVELED SURFACE FOR DELAMIN...

SEMICONDUCTOR PACKAGE AND METHOD

SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...

PROGRAMMING METHOD OF NON-VOLATILE MEMORY CELL

WEIGHING SYSTEM

Efficient Bandwidth Adaptation for a Wideband Carrier

SEMICONDUCTOR DEVICE INCLUDING MAGNETIC TUNNEL JUNCTION STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

UART-HUB DESIGN FOR MULTIPLE DATA TRANSMISSION

MODEM ASSISTED UL POWER SAVING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

DRIVING CIRCUIT FOR TOUCH DISPLAY PANEL

VECTOR PROCESSOR WITH VECTOR AND ELEMENT REDUCTION METHOD

BACK SIDE ILLUMINATED IMAGE SENSOR DEVICE WITH SELECT DIELECTRIC LA...