Chia-Shing Chou

Person

Oak Park, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectromechanical device having a common ground plane layer an...
- Patent number 7,545,234
- Issue date Jun 9, 2009
- Wireless MEMS, Inc.
- Chia-Shing Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Balanced MEMS switch for next generation communication systems
- Patent number 7,466,215
- Issue date Dec 16, 2008
- Wireless MEMS, Inc.
- Chia-Shing Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Head electrode region for a reliable metal-to-metal contact micro-r...
- Patent number 7,352,266
- Issue date Apr 1, 2008
- Wireless MEMS, Inc.
- Chia-Shing Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planarized structure for a reliable metal-to-metal contact micro-re...
- Patent number 7,230,513
- Issue date Jun 12, 2007
- Wireless MEMS, Inc.
- Chia-Shing Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor devices employing at least one...
- Patent number 7,101,724
- Issue date Sep 5, 2006
- Wireless MEMS, Inc.
- Chia-Shing Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication method for making a planar cantilever, low surface leak...
- Patent number 6,962,832
- Issue date Nov 8, 2005
- Wireless MEMS, Inc.
- Chia-Shing Chou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for fabricating a CMOS-compatible MEMS device
- Publication number 20100035387
- Publication date Feb 11, 2010
- Chia-Shing Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Enablement of IC devices during assembly
- Publication number 20100013033
- Publication date Jan 21, 2010
- Chia-Shing Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microelectromechanical device having a common ground plane and meth...
- Publication number 20090215213
- Publication date Aug 27, 2009
- Chia-Shing Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Balanced MEMS switch for next generation communication systems
- Publication number 20070030104
- Publication date Feb 8, 2007
- Chia-Shing Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectromechanical device having a common ground plane layer an...
- Publication number 20060125031
- Publication date Jun 15, 2006
- Chia-Shing Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Planarized structure for a reliable metal-to-metal contact micro-re...
- Publication number 20060109069
- Publication date May 25, 2006
- Chia-Shing Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectromechanical device having a common ground plane layer an...
- Publication number 20050184836
- Publication date Aug 25, 2005
- Chia-Shing Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Head electrode region for a reliable metal-to-metal contact micro-r...
- Publication number 20050183938
- Publication date Aug 25, 2005
- Chia-Shing Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FABRICATION METHOD FOR MAKING A PLANAR CANTILEVER, LOW SURFACE LEAK...
- Publication number 20050170637
- Publication date Aug 4, 2005
- Chia-Shing Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of using a metal platform for making a highly reliable and r...
- Publication number 20050062565
- Publication date Mar 24, 2005
- Chia-Shing Chou
- H01 - BASIC ELECTRIC ELEMENTS

Chia-Shing Chou

Person

Patents Grantslast 30 patents

Microelectromechanical device having a common ground plane layer an...

Balanced MEMS switch for next generation communication systems

Head electrode region for a reliable metal-to-metal contact micro-r...

Planarized structure for a reliable metal-to-metal contact micro-re...

Method of fabricating semiconductor devices employing at least one...

Fabrication method for making a planar cantilever, low surface leak...

Patents Applicationslast 30 patents

Method for fabricating a CMOS-compatible MEMS device

Enablement of IC devices during assembly

Microelectromechanical device having a common ground plane and meth...

Balanced MEMS switch for next generation communication systems

Microelectromechanical device having a common ground plane layer an...

Planarized structure for a reliable metal-to-metal contact micro-re...

Microelectromechanical device having a common ground plane layer an...

Head electrode region for a reliable metal-to-metal contact micro-r...

FABRICATION METHOD FOR MAKING A PLANAR CANTILEVER, LOW SURFACE LEAK...

Method of using a metal platform for making a highly reliable and r...