CHIA-TE LAI

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming a semiconductor die and a photoelectric device i...
- Patent number 12,334,487
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,334,425
- Issue date Jun 17, 2025
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including through substrate via barrier structure...
- Patent number 12,322,679
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,293,952
- Issue date May 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including through substrate via barrier structure...
- Patent number 12,278,167
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including substrate-embedded int...
- Patent number 12,272,724
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with warpage-relief trenches
- Patent number 12,261,133
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including power management die in a stack and...
- Patent number 12,230,607
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vertical semiconductor package including horizontally stacked dies...
- Patent number 12,230,613
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packages providing enhanced mechanical strength and methods...
- Patent number 12,224,268
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Authentication reject handling for SNPN-enabled UE
- Patent number 12,225,375
- Issue date Feb 11, 2025
- Mediatek Inc.
- Yuan-Chieh Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,218,049
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including MIM capacitor and resistor
- Patent number 12,211,838
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hsiang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
NID provisioning under UE mobility scenarios
- Patent number 12,207,219
- Issue date Jan 21, 2025
- Mediatek Inc.
- Chia-Lin Lai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing package structure
- Patent number 12,183,695
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-insulation multilayer planar transformer and circuit board int...
- Patent number 12,183,497
- Issue date Dec 31, 2024
- P-DUKE TECHNOLOGY CO., LTD.
- Lien-Hsing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using fiber to chip coupler and method of making
- Patent number 12,169,308
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sui-Ying Hsu
- G02 - OPTICS
Information Patent Grant
Method of making photonic device
- Patent number 12,153,255
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Ying Wu
- G02 - OPTICS
Information Patent Grant
Image sensors with dummy pixel structures
- Patent number 12,125,868
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including fuse structure and methods for forming...
- Patent number 12,107,078
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module, manufacturing method thereof and electronic pack...
- Patent number 12,100,648
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package comprising wire inside an electronic component
- Patent number 12,100,633
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including embedded integrated pa...
- Patent number 12,094,925
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded deep trench capacitor structure and methods of forming the...
- Patent number 12,094,868
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiber to chip coupler and method of using
- Patent number 12,072,534
- Issue date Aug 27, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Sui-Ying Hsu
- G02 - OPTICS
Information Patent Grant
Electronic package comprising multiple wires inside an electronic c...
- Patent number 12,068,211
- Issue date Aug 20, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including neighboring die contact and seal ri...
- Patent number 12,068,262
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof, and antenna mo...
- Patent number 12,068,535
- Issue date Aug 20, 2024
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and methods of forming the same
- Patent number 12,057,467
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeh-Hsun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,057,618
- Issue date Aug 6, 2024
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu Ke
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE...
- Publication number 20250210468
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...
- Publication number 20250203893
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...
- Publication number 20250167078
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING POWER MANAGEMENT DIE IN A STACK AND...
- Publication number 20250167177
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...
- Publication number 20250157997
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING MIM CAPACITOR AND RESISTOR
- Publication number 20250151376
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hsiang HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250140686
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGES PROVIDING ENHANCED MECHANICAL STRENGTH AND METHODS...
- Publication number 20250140754
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL COUPLING SYSTEM
- Publication number 20250110283
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sui-Ying HSU
- G02 - OPTICS
Information Patent Application
Methods And Apparatus For Enhancing Quality Of Service Based On Env...
- Publication number 20250106696
- Publication date Mar 27, 2025
- MEDIATEK INC.
- Chien-Sheng Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
UE ASSISTED INFORMATION FOR DUAL ACCESS/STEER FEATURE
- Publication number 20250088954
- Publication date Mar 13, 2025
- MEDIATEK INC.
- Chia-Lin Lai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DUAL ACCESS/STEER CAPABILITY INFORMATION FOR NETWORK AND DEVICES DU...
- Publication number 20250088950
- Publication date Mar 13, 2025
- Media Tek Inc.
- Tze Jie Tan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHOTONIC DEVICE AND METHOD OF MAKING
- Publication number 20250085476
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Ying WU
- G02 - OPTICS
Information Patent Application
Methods And Apparatus For Enhanced User Equipment Route Selection P...
- Publication number 20250088938
- Publication date Mar 13, 2025
- MEDIATEK INC.
- Chien-Sheng Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250070060
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE
- Publication number 20240407079
- Publication date Dec 5, 2024
- Siliconware Precision Industries Co., Ltd.
- Chien-Sheng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE
- Publication number 20240395639
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING POWER MANAGEMENT DIE IN A STACK AND...
- Publication number 20240387470
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...
- Publication number 20240387618
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...
- Publication number 20240379433
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379590
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Chu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379477
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...
- Publication number 20240371841
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensors With Dummy Pixel Structures
- Publication number 20240371910
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIBER TO CHIP COUPLER AND METHOD OF MAKING THE SAME
- Publication number 20240361532
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hao HUANG
- G02 - OPTICS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING EMBEDDED INTEGRATED PA...
- Publication number 20240363682
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Neighboring Die Contact Seal Ring a...
- Publication number 20240363554
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND ANTENNA MO...
- Publication number 20240364001
- Publication date Oct 31, 2024
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20240321933
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeh-Hsun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION C...
- Publication number 20240321654
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS

CHIA-TE LAI

Person

Patents Grantslast 30 patents

Method for forming a semiconductor die and a photoelectric device i...

Electronic package and manufacturing method thereof

Semiconductor die including through substrate via barrier structure...

Electronic package and manufacturing method thereof

Semiconductor die including through substrate via barrier structure...

Three-dimensional device structure including substrate-embedded int...

Interposer with warpage-relief trenches

Semiconductor device including power management die in a stack and...

Vertical semiconductor package including horizontally stacked dies...

Fan-out packages providing enhanced mechanical strength and methods...

Authentication reject handling for SNPN-enabled UE

Semiconductor structure and method for forming the same

Device including MIM capacitor and resistor

NID provisioning under UE mobility scenarios

Method of manufacturing package structure

High-insulation multilayer planar transformer and circuit board int...

Method of using fiber to chip coupler and method of making

Method of making photonic device

Image sensors with dummy pixel structures

Semiconductor die including fuse structure and methods for forming...

Electronic module, manufacturing method thereof and electronic pack...

Electronic package comprising wire inside an electronic component

Three-dimensional device structure including embedded integrated pa...

Shielded deep trench capacitor structure and methods of forming the...

Fiber to chip coupler and method of using

Electronic package comprising multiple wires inside an electronic c...

Semiconductor package including neighboring die contact and seal ri...

Electronic package and manufacturing method thereof, and antenna mo...

Image sensor device and methods of forming the same

Electronic package and fabrication method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE INCLUDING THROUGH SUBSTRATE VIA BARRIER STRUCTURE...

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...

SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...

SEMICONDUCTOR DEVICE INCLUDING POWER MANAGEMENT DIE IN A STACK AND...

VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...

DEVICE INCLUDING MIM CAPACITOR AND RESISTOR

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

FAN-OUT PACKAGES PROVIDING ENHANCED MECHANICAL STRENGTH AND METHODS...

OPTICAL COUPLING SYSTEM

Methods And Apparatus For Enhancing Quality Of Service Based On Env...

UE ASSISTED INFORMATION FOR DUAL ACCESS/STEER FEATURE

DUAL ACCESS/STEER CAPABILITY INFORMATION FOR NETWORK AND DEVICES DU...

PHOTONIC DEVICE AND METHOD OF MAKING

Methods And Apparatus For Enhanced User Equipment Route Selection P...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

CARRIER STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE

SEMICONDUCTOR DEVICE INCLUDING POWER MANAGEMENT DIE IN A STACK AND...

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...

CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...

Image Sensors With Dummy Pixel Structures

FIBER TO CHIP COUPLER AND METHOD OF MAKING THE SAME

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING EMBEDDED INTEGRATED PA...

Semiconductor Package Including Neighboring Die Contact Seal Ring a...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND ANTENNA MO...

IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION C...