CHIA-TE LAI

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensors with dummy pixel structures
- Patent number 12,125,868
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including fuse structure and methods for forming...
- Patent number 12,107,078
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module, manufacturing method thereof and electronic pack...
- Patent number 12,100,648
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package comprising wire inside an electronic component
- Patent number 12,100,633
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including embedded integrated pa...
- Patent number 12,094,925
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded deep trench capacitor structure and methods of forming the...
- Patent number 12,094,868
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiber to chip coupler and method of using
- Patent number 12,072,534
- Issue date Aug 27, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Sui-Ying Hsu
- G02 - OPTICS
Information Patent Grant
Semiconductor package including neighboring die contact and seal ri...
- Patent number 12,068,262
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof, and antenna mo...
- Patent number 12,068,535
- Issue date Aug 20, 2024
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package comprising multiple wires inside an electronic c...
- Patent number 12,068,211
- Issue date Aug 20, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,057,618
- Issue date Aug 6, 2024
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device and methods of forming the same
- Patent number 12,057,467
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yeh-Hsun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiber to chip coupler and method of making the same
- Patent number 12,050,348
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hao Huang
- G02 - OPTICS
Information Patent Grant
Three-dimensional device structure including seal ring connection c...
- Patent number 12,040,242
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including guard ring structure and three-dimensio...
- Patent number 12,027,475
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stand-alone Non-Public Network as service provider
- Patent number 12,028,710
- Issue date Jul 2, 2024
- Mediatek Inc.
- Yuan-Chieh Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic package and antenna structure thereof
- Patent number 12,027,753
- Issue date Jul 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Chu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die and photoelectric device integrated in same package
- Patent number 12,021,069
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Network selection for supported standalone non-public network (S-SNPN)
- Patent number 12,022,386
- Issue date Jun 25, 2024
- Mediatek Inc.
- Chia-Lin Lai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Vertically stacked semiconductor device including a hybrid bond con...
- Patent number 12,015,010
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of electronic package comprising a wire within...
- Patent number 12,014,967
- Issue date Jun 18, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor package including horizontally stacked dies...
- Patent number 12,009,349
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor including a compact contact region and method...
- Patent number 12,009,405
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including trench capacitor
- Patent number 11,996,439
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Feng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with warpage-relief trenches
- Patent number 11,973,040
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an image sensor with sidewall protection
- Patent number 11,961,866
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiao-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical integrated circuit structure including edge coupling protec...
- Patent number 11,940,659
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,940,662
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- G02 - OPTICS
Information Patent Grant
Interconnect structures including a fin structure and a metal cap
- Patent number 11,929,314
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device structure including embedded integrated pa...
- Patent number 11,908,838
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING POWER MANAGEMENT DIE IN A STACK AND...
- Publication number 20240387470
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...
- Publication number 20240387618
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...
- Publication number 20240379433
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379590
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Chu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379477
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...
- Publication number 20240371841
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensors With Dummy Pixel Structures
- Publication number 20240371910
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIBER TO CHIP COUPLER AND METHOD OF MAKING THE SAME
- Publication number 20240361532
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hao HUANG
- G02 - OPTICS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING EMBEDDED INTEGRATED PA...
- Publication number 20240363682
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Neighboring Die Contact Seal Ring a...
- Publication number 20240363554
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND ANTENNA MO...
- Publication number 20240364001
- Publication date Oct 31, 2024
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20240321933
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yeh-Hsun Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION C...
- Publication number 20240321654
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE
- Publication number 20240312972
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING GUARD RING STRUCTURE AND THREE-DIMENSIO...
- Publication number 20240312931
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertically Stacked Semiconductor Device Including a Hybrid Bond Con...
- Publication number 20240304601
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITOR INCLUDING A COMPACT CONTACT REGION AND METHOD...
- Publication number 20240304700
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240290675
- Publication date Aug 29, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240290691
- Publication date Aug 29, 2024
- Siliconware Precision Industries Co., Ltd.
- Min-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240290674
- Publication date Aug 29, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH WARPAGE-RELIEF TRENCHES
- Publication number 20240282718
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And Apparatus For Enhancements On Automatic Stand-Alone Non-...
- Publication number 20240236903
- Publication date Jul 11, 2024
- MEDIATEK INC.
- Chia-Lin Lai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HANDLING FOR CLOSED ACCESS GROUP (CAG) VALIDITY NO LONGER MET
- Publication number 20240236824
- Publication date Jul 11, 2024
- Media Tek Inc.
- Yu-Hsin Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
OPTICAL INTEGRATED CIRCUIT STRUCTURE INCLUDING EDGE COUPLING PROTEC...
- Publication number 20240201458
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hao HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240192455
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- G02 - OPTICS
Information Patent Application
Method And Apparatus For Enhanced Closed Access Group Selection In...
- Publication number 20240196307
- Publication date Jun 13, 2024
- MEDIATEK INC.
- YUAN-CHIEH Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTERCONNECT STRUCTURES AND MANUFACTURING METHOD THEREOF
- Publication number 20240170381
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hsien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EQUIVALENT SNPNS AND GUTI INDICATED BY UE
- Publication number 20240163827
- Publication date May 16, 2024
- MEDIATEK INC.
- YUAN-CHIEH Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
URSP RULE REUSING PDN LEGGED MA PDU SESSION HANDLING
- Publication number 20240154871
- Publication date May 9, 2024
- MEDIATEK INC.
- YUAN-CHIEH Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CARBON-INTELLIGENT COMMUNICATION NETWORK
- Publication number 20240121685
- Publication date Apr 11, 2024
- MEDIATEK INC.
- Chien-Sheng Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

CHIA-TE LAI

Person

Patents Grantslast 30 patents

Image sensors with dummy pixel structures

Semiconductor die including fuse structure and methods for forming...

Electronic module, manufacturing method thereof and electronic pack...

Electronic package comprising wire inside an electronic component

Three-dimensional device structure including embedded integrated pa...

Shielded deep trench capacitor structure and methods of forming the...

Fiber to chip coupler and method of using

Semiconductor package including neighboring die contact and seal ri...

Electronic package and manufacturing method thereof, and antenna mo...

Electronic package comprising multiple wires inside an electronic c...

Electronic package and fabrication method thereof

Image sensor device and methods of forming the same

Fiber to chip coupler and method of making the same

Three-dimensional device structure including seal ring connection c...

Semiconductor die including guard ring structure and three-dimensio...

Stand-alone Non-Public Network as service provider

Electronic package and antenna structure thereof

Semiconductor die and photoelectric device integrated in same package

Network selection for supported standalone non-public network (S-SNPN)

Vertically stacked semiconductor device including a hybrid bond con...

Manufacturing method of electronic package comprising a wire within...

Vertical semiconductor package including horizontally stacked dies...

Deep trench capacitor including a compact contact region and method...

Integrated circuit including trench capacitor

Interposer with warpage-relief trenches

Method of making an image sensor with sidewall protection

Optical integrated circuit structure including edge coupling protec...

Semiconductor structure and method for forming the same

Interconnect structures including a fin structure and a metal cap

Three-dimensional device structure including embedded integrated pa...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING POWER MANAGEMENT DIE IN A STACK AND...

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...

CONDUCTIVE FEATURE FORMATION AND STRUCTURE USING BOTTOM-UP FILLING...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

VERTICAL SEMICONDUCTOR PACKAGE INCLUDING HORIZONTALLY STACKED DIES...

Image Sensors With Dummy Pixel Structures

FIBER TO CHIP COUPLER AND METHOD OF MAKING THE SAME

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING EMBEDDED INTEGRATED PA...

Semiconductor Package Including Neighboring Die Contact Seal Ring a...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND ANTENNA MO...

IMAGE SENSOR DEVICE AND METHODS OF FORMING THE SAME

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION C...

METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DIE INCLUDING GUARD RING STRUCTURE AND THREE-DIMENSIO...

Vertically Stacked Semiconductor Device Including a Hybrid Bond Con...

DEEP TRENCH CAPACITOR INCLUDING A COMPACT CONTACT REGION AND METHOD...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

INTERPOSER WITH WARPAGE-RELIEF TRENCHES

Method And Apparatus For Enhancements On Automatic Stand-Alone Non-...

HANDLING FOR CLOSED ACCESS GROUP (CAG) VALIDITY NO LONGER MET

OPTICAL INTEGRATED CIRCUIT STRUCTURE INCLUDING EDGE COUPLING PROTEC...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Method And Apparatus For Enhanced Closed Access Group Selection In...

INTERCONNECT STRUCTURES AND MANUFACTURING METHOD THEREOF

EQUIVALENT SNPNS AND GUTI INDICATED BY UE

URSP RULE REUSING PDN LEGGED MA PDU SESSION HANDLING

CARBON-INTELLIGENT COMMUNICATION NETWORK