Chia-Wei LIN

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Hukou Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor package and packaging method thereof
- Patent number 11,670,622
- Issue date Jun 6, 2023
- Powertech Technology Inc.
- Yin-Huang Kung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED SEMICONDUCTOR PACKAGE AND PACKAGING METHOD THEREOF
- Publication number 20220165709
- Publication date May 26, 2022
- Powertech Technology Inc.
- Yin-Huang KUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER CUTTING METHOD FOR A WAFER
- Publication number 20210339338
- Publication date Nov 4, 2021
- Powertech Technology Inc.
- Chui-Liang CHIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR