Chia-Wen KO

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Silicon substrates with compressive stress and methods for producti...
- Patent number 9,633,843
- Issue date Apr 25, 2017
- Global Wafers Co., Ltd
- Yao-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminar structure of semiconductor and manufacturing method thereof
- Patent number 9,620,461
- Issue date Apr 11, 2017
- GlobalWafers Co., Ltd.
- Wen-Ching Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SILICON SUBSTRATES WITH COMPRESSIVE STRESS AND METHODS FOR PRODUCTI...
- Publication number 20160307754
- Publication date Oct 20, 2016
- Global Wafers Co., Ltd
- Yao-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINAR STRUCTURE OF SEMICONDUCTOR AND MANUFACTURING METHOD THEREOF
- Publication number 20150357290
- Publication date Dec 10, 2015
- GLOBALWAFERS CO., LTD.
- Wen-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS