Chia-Wen Lien

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Taoyuan County, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for supporting semiconductor wafer and wafer supporting asse...
- Patent number 8,776,363
- Issue date Jul 15, 2014
- United Microelectronics Corp.
- Chang-Sheng Hsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thinned wafer and fabricating method thereof
- Patent number 8,754,504
- Issue date Jun 17, 2014
- United Microelectronics Corporation
- Chang-Sheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer with eutectic bonding carrier and method of manufacturing the...
- Patent number 8,536,709
- Issue date Sep 17, 2013
- United Microelectronics Corp.
- Chang-Sheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THINNED WAFER AND FABRICATING METHOD THEREOF
- Publication number 20130313691
- Publication date Nov 28, 2013
- UNITED MICROELECTRONICS CORPORATION
- Chang-Sheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SUPPORTING SEMICONDUCTOR WAFER AND WAFER SUPPORTING ASSE...
- Publication number 20130312246
- Publication date Nov 28, 2013
- Chang-Sheng Hsu
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS