Chia-Wen Tsao

Follow

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package and manufacturing method thereof, and substrate...
- Patent number 12,154,848
- Issue date Nov 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Wen Tsao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...
- Publication number 20250038097
- Publication date Jan 30, 2025
- Siliconware Precision Industries Co., Ltd.
- Chia-Wen TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20230343692
- Publication date Oct 26, 2023
- Siliconware Precision Industries Co., Ltd.
- Wen-Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20230253342
- Publication date Aug 10, 2023
- Siliconware Precision Industries Co., Ltd.
- Hsiu-Fang Chien
- H01 - BASIC ELECTRIC ELEMENTS