Chia-Yang Chang

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optical spacer including controlled located aperture and method of...
- Patent number 10,889,078
- Issue date Jan 12, 2021
- OmniVision Technologies, Inc.
- Tim Kao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Light-field camera and method using wafer-level integration process
- Patent number 10,868,945
- Issue date Dec 15, 2020
- OmniVision Technologies, Inc.
- Teng-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and chip-scale packaging for wafer-level camera
- Patent number 10,734,437
- Issue date Aug 4, 2020
- OmniVision Technologies, Inc.
- Teng-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Yardless lens assemblies and manufacturing methods
- Patent number 10,611,108
- Issue date Apr 7, 2020
- OmniVision Technologies, Inc.
- Mao-Chin Wang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Lens barrel, lens-barrel wafer, and associated method
- Patent number 10,459,189
- Issue date Oct 29, 2019
- OmniVision Technologies, Inc.
- Chia-Yang Chang
- G02 - OPTICS
Information Patent Grant
Interposer and chip-scale packaging for wafer-level camera
- Patent number 10,217,789
- Issue date Feb 26, 2019
- OmniVision Technologies, Inc.
- Teng-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cover-glass-free array camera with individually light-shielded cameras
- Patent number 10,204,947
- Issue date Feb 12, 2019
- OmniVision Technologies, Inc.
- Teng-Sheng Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Notched-spacer camera module and method for fabricating same
- Patent number 10,187,560
- Issue date Jan 22, 2019
- OmniVision Technologies, Inc.
- Teng-Sheng Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Trenched-bonding-dam device and manufacturing method for same
- Patent number 10,157,943
- Issue date Dec 18, 2018
- OmniVision Technologies, Inc.
- Teng-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective caps for small image sensor masking and mounting process
- Patent number 10,121,820
- Issue date Nov 6, 2018
- OmniVision Technologies, Inc.
- Teng-Sheng Chen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Trenched-substrate based lens manufacturing methods, and associated...
- Patent number 9,952,415
- Issue date Apr 24, 2018
- OmniVision Technologies, Inc.
- Shao Fan Kao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wafer-level methods for making apertured lenses involving sequentia...
- Patent number 9,921,393
- Issue date Mar 20, 2018
- OmniVision Technologies, Inc.
- Min Ching Kao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optical assemblies including dry adhesive layers and associated met...
- Patent number 9,627,559
- Issue date Apr 18, 2017
- OmniVision Technologies, Inc.
- Chun-Shan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for molding optical lense during a puddle disp...
- Patent number 9,151,878
- Issue date Oct 6, 2015
- OmniVision Technologies, Inc.
- Huiyan Neo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus and method for testing image sensor wafers to identify pi...
- Patent number 8,000,520
- Issue date Aug 16, 2011
- OmniVision Technologies, Inc.
- Chia-Lun Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
LIGHT-FIELD CAMERA AND METHOD USING WAFER-LEVEL INTEGRATION PROCESS
- Publication number 20200322507
- Publication date Oct 8, 2020
- OMNIVISION TECHNOLOGIES, INC.
- Teng-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer And Chip-Scale Packaging For Wafer-Level Camera
- Publication number 20190181179
- Publication date Jun 13, 2019
- OMNIVISION TECHNOLOGIES, INC.
- Teng-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
YARDLESS LENS ASSEMBLIES AND MANUFACTURING METHODS
- Publication number 20180095193
- Publication date Apr 5, 2018
- OMNIVISION TECHNOLOGIES, INC.
- Mao-Chin Wang
- G02 - OPTICS
Information Patent Application
LENS BARREL, LENS-BARREL WAFER, AND ASSOCIATED METHOD
- Publication number 20180095235
- Publication date Apr 5, 2018
- OMNIVISION TECHNOLOGIES, INC.
- Chia-Yang CHANG
- G02 - OPTICS
Information Patent Application
COVER-GLASS-FREE ARRAY CAMERA WITH INDIVIDUALLY LIGHT-SHIELDED CAMERAS
- Publication number 20180076246
- Publication date Mar 15, 2018
- OMNIVISION TECHNOLOGIES, INC.
- Teng-Sheng Chen
- G02 - OPTICS
Information Patent Application
Interposer And Chip-Scale Packaging For Wafer-Level Camera
- Publication number 20170294477
- Publication date Oct 12, 2017
- OMNIVISION TECHNOLOGIES, INC.
- Teng-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trenched-Bonding-Dam Device And Manufacturing Method For Same
- Publication number 20170213864
- Publication date Jul 27, 2017
- OMNIVISION TECHNOLOGIES, INC.
- Teng-Sheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Notched-Spacer Camera Module And Method For Fabricating Same
- Publication number 20170111560
- Publication date Apr 20, 2017
- OMNIVISION TECHNOLOGIES, INC.
- Teng-Sheng Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Optical Spacer Including Controlled Located Aperture and Method of...
- Publication number 20170036407
- Publication date Feb 9, 2017
- OMNIVISION TECHNOLOGIES, INC.
- Tim Kao
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Trenched-Substrate Based Lens Manufacturing Methods, And Associated...
- Publication number 20160313540
- Publication date Oct 27, 2016
- OMNIVISION TECHNOLOGIES, INC.
- Shao Fan Kao
- G02 - OPTICS
Information Patent Application
Optical Assemblies Including Dry Adhesive Layers And Associated Met...
- Publication number 20160276502
- Publication date Sep 22, 2016
- OMNIVISION TECHNOLOGIES, INC.
- Chun-Shan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Methods For Making Apertured Lenses And Associated Aper...
- Publication number 20160070089
- Publication date Mar 10, 2016
- OMNIVISION TECHNOLOGIES, INC.
- Min Ching Kao
- B32 - LAYERED PRODUCTS
Information Patent Application
Apparatus And Method For Molding Optical Lense During A Puddle Disp...
- Publication number 20150077856
- Publication date Mar 19, 2015
- OMNIVISION TECHNOLOGIES, INC.
- Huiyan Neo
- G02 - OPTICS
Information Patent Application
TEXTURED PHOTOVOLTAIC CELLS AND METHODS
- Publication number 20120160296
- Publication date Jun 28, 2012
- Olivier Laparra
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
APPARATUS AND METHOD FOR TESTING IMAGE SENSOR WAFERS TO IDENTIFY PI...
- Publication number 20090135414
- Publication date May 28, 2009
- OmniVision Technologies, Inc.
- Chia-Lun CHANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Chia-Yang Chang

Person

Patents Grantslast 30 patents

Optical spacer including controlled located aperture and method of...

Light-field camera and method using wafer-level integration process

Interposer and chip-scale packaging for wafer-level camera

Yardless lens assemblies and manufacturing methods

Lens barrel, lens-barrel wafer, and associated method

Interposer and chip-scale packaging for wafer-level camera

Cover-glass-free array camera with individually light-shielded cameras

Notched-spacer camera module and method for fabricating same

Trenched-bonding-dam device and manufacturing method for same

Protective caps for small image sensor masking and mounting process

Trenched-substrate based lens manufacturing methods, and associated...

Wafer-level methods for making apertured lenses involving sequentia...

Optical assemblies including dry adhesive layers and associated met...

Apparatus and method for molding optical lense during a puddle disp...

Apparatus and method for testing image sensor wafers to identify pi...

Patents Applicationslast 30 patents

LIGHT-FIELD CAMERA AND METHOD USING WAFER-LEVEL INTEGRATION PROCESS

Interposer And Chip-Scale Packaging For Wafer-Level Camera

YARDLESS LENS ASSEMBLIES AND MANUFACTURING METHODS

LENS BARREL, LENS-BARREL WAFER, AND ASSOCIATED METHOD

COVER-GLASS-FREE ARRAY CAMERA WITH INDIVIDUALLY LIGHT-SHIELDED CAMERAS

Interposer And Chip-Scale Packaging For Wafer-Level Camera

Trenched-Bonding-Dam Device And Manufacturing Method For Same

Notched-Spacer Camera Module And Method For Fabricating Same

Optical Spacer Including Controlled Located Aperture and Method of...

Trenched-Substrate Based Lens Manufacturing Methods, And Associated...

Optical Assemblies Including Dry Adhesive Layers And Associated Met...

Wafer-Level Methods For Making Apertured Lenses And Associated Aper...

Apparatus And Method For Molding Optical Lense During A Puddle Disp...

TEXTURED PHOTOVOLTAIC CELLS AND METHODS

APPARATUS AND METHOD FOR TESTING IMAGE SENSOR WAFERS TO IDENTIFY PI...