Chia Yong Poo

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Interconnects for packaged semiconductor devices and methods for ma...
- Patent number 8,168,476
- Issue date May 1, 2012
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH LEADFRAMES, INCLUDING LEADFRAME-B...
- Publication number 20110215453
- Publication date Sep 8, 2011
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTS FOR PACKAGED SEMICONDUCTOR DEVICES AND METHODS FOR MA...
- Publication number 20100330749
- Publication date Dec 30, 2010
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated imager packaging
- Publication number 20090179290
- Publication date Jul 16, 2009
- Huang Shuangwu
- H01 - BASIC ELECTRIC ELEMENTS