Chiaki Takubo

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 10,424,542
- Issue date Sep 24, 2019
- Kabushiki Kaisha Toshiba
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,852,995
- Issue date Dec 26, 2017
- Kabushiki Kaisha Toshiba
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device that includes dividin...
- Patent number 9,633,902
- Issue date Apr 25, 2017
- Kabushiki Kaisha Toshiba
- Satoshi Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,202,768
- Issue date Dec 1, 2015
- Kabushiki Kaisha Toshiba
- Hideo Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 9,142,477
- Issue date Sep 22, 2015
- Kabushiki Kaisha Toshiba
- Hideo Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, manufacturing method of semiconductor appa...
- Patent number 8,426,977
- Issue date Apr 23, 2013
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,338,904
- Issue date Dec 25, 2012
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and semiconductor manufacturi...
- Patent number 8,309,430
- Issue date Nov 13, 2012
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, through hole having expansion portion and thi...
- Patent number 8,237,285
- Issue date Aug 7, 2012
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-containing resin particle, resin particle, electronic circuit...
- Patent number 8,220,147
- Issue date Jul 17, 2012
- Kabushiki Kaisha Toshiba
- Naoko Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-containing resin particle, metal-containing resin layer, meth...
- Patent number 7,939,171
- Issue date May 10, 2011
- Kabushiki Kaisha Toshiba
- Hideo Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 7,932,605
- Issue date Apr 26, 2011
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state imaging device and method for manufacturing same, and s...
- Patent number 7,888,760
- Issue date Feb 15, 2011
- Kabushiki Kaisha Toshiba
- Hitoshi Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic circuit formed on a substrate
- Patent number 7,877,871
- Issue date Feb 1, 2011
- Kabushiki Kaisha Toshiba
- Hideo Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package having a semiconductor element with a...
- Patent number 7,608,911
- Issue date Oct 27, 2009
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having power semiconductor elements
- Patent number 7,531,876
- Issue date May 12, 2009
- Kabushiki Kaisha Toshiba
- Ichiro Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing electronic circuit, and electronic circuit subs...
- Patent number 7,486,921
- Issue date Feb 3, 2009
- Kabushiki Kaisha Toshiba
- Naoko Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a wiring board
- Patent number 7,469,941
- Issue date Dec 30, 2008
- Kabushiki Kaisha Toshiba
- Hideo Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical semiconductor module and semiconductor device including the...
- Patent number 7,438,481
- Issue date Oct 21, 2008
- Kabushiki Kaisha Toshiba
- Hideo Numata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image forming apparatus and method of manufacturing electronic circ...
- Patent number 7,433,637
- Issue date Oct 7, 2008
- Kabsushiki Kaisha Toshiba
- Hideo Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact sheet for testing electronic parts, apparatus for testing e...
- Patent number 7,414,417
- Issue date Aug 19, 2008
- Kabushiki Kaisha Toshiba
- Naoko Yamaguchi
- G01 - MEASURING TESTING
Information Patent Grant
Method of fabricating a semiconductor device package having a semic...
- Patent number 7,405,159
- Issue date Jul 29, 2008
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing optical coupling part and optical coupling...
- Patent number 7,401,983
- Issue date Jul 22, 2008
- Sumitomo Electric Industries, Ltd.
- Wataru Sakurai
- G02 - OPTICS
Information Patent Grant
Lead frame, optical coupling part using lead frame, and manufacturi...
- Patent number 7,364,369
- Issue date Apr 29, 2008
- Sumitomo Electric Industries, Ltd.
- Wataru Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 7,352,052
- Issue date Apr 1, 2008
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,259,046
- Issue date Aug 21, 2007
- Kabushiki Kaisha Toshiba
- Hideo Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method for the same
- Patent number 7,235,425
- Issue date Jun 26, 2007
- Kabushiki Kaisha Toshiba
- Hideo Numata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having a semiconductor element with resin
- Patent number 7,202,563
- Issue date Apr 10, 2007
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package member, and semiconduct...
- Patent number 7,095,112
- Issue date Aug 22, 2006
- Kabushiki Kaisha Toshiba
- Mitsuyoshi Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,071,576
- Issue date Jul 4, 2006
- Kabushiki Kaisha Toshiba
- Hideo Nakayoshi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180096944
- Publication date Apr 5, 2018
- Kabushiki Kaisha Toshiba
- Kentaro Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160268164
- Publication date Sep 15, 2016
- Kabushiki Kaisha Toshiba
- Satoshi MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160268165
- Publication date Sep 15, 2016
- Kabushiki Kaisha Toshiba
- Satoshi MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160079500
- Publication date Mar 17, 2016
- Kabushiki Kaisha Toshiba
- Hideo AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20140252588
- Publication date Sep 11, 2014
- Kabushiki Kaisha Toshiba
- Hideo AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20140252649
- Publication date Sep 11, 2014
- Kabushiki Kaisha Toshiba
- Hideo AOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURI...
- Publication number 20110217795
- Publication date Sep 8, 2011
- Kazumasa TANIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110073983
- Publication date Mar 31, 2011
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, MANUFACTURING METHOD OF SEMICONDUCTOR APPA...
- Publication number 20100038741
- Publication date Feb 18, 2010
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20100025860
- Publication date Feb 4, 2010
- Kabushiki Kaisha Toshiba
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-CONTAINING RESIN PARTICLE, RESIN PARTICLE, ELECTRONIC CIRCUIT...
- Publication number 20100000083
- Publication date Jan 7, 2010
- Kabushiki Kaisha Toshiba
- Naoko Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLID STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME, AND S...
- Publication number 20090096051
- Publication date Apr 16, 2009
- Kabushiki Kaisha Toshiba
- Hitoshi SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image forming apparatus and method of manufacturing electronic circ...
- Publication number 20090007426
- Publication date Jan 8, 2009
- Kabushiki Kaisha Toshiba
- Hideo Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20080265443
- Publication date Oct 30, 2008
- KABUSHIKI KAISHA TOSHIBA,
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20080017973
- Publication date Jan 24, 2008
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame, optical coupling part using lead frame, and manufacturi...
- Publication number 20070212001
- Publication date Sep 13, 2007
- Wataru Sakurai
- G02 - OPTICS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20070196956
- Publication date Aug 23, 2007
- Kabushiki Kaisha Toshiba
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing optical coupling part and optical coupling...
- Publication number 20070165986
- Publication date Jul 19, 2007
- Wataru Sakurai
- G02 - OPTICS
Information Patent Application
Wiring board and production method of wiring board
- Publication number 20070029107
- Publication date Feb 8, 2007
- Kabushiki Kaisha Toshiba
- Hideo Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer support plate, holding method of thin wafer, and manufacturin...
- Publication number 20060102290
- Publication date May 18, 2006
- Susumu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing semiconductor device
- Publication number 20060071271
- Publication date Apr 6, 2006
- Kabushiki Kaisha Toshiba
- Ichiro Omura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060055050
- Publication date Mar 16, 2006
- Hideo Numata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060055018
- Publication date Mar 16, 2006
- Masahiro Sekiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LSI package with interface module, transmission line package, and r...
- Publication number 20060050493
- Publication date Mar 9, 2006
- Hiroshi Hamasaki
- G02 - OPTICS
Information Patent Application
Optical semiconductor module and semiconductor device including the...
- Publication number 20060045434
- Publication date Mar 2, 2006
- Hideo Numata
- G02 - OPTICS
Information Patent Application
LSI package having interface function with exterior, circuit device...
- Publication number 20060035510
- Publication date Feb 16, 2006
- Hideo Numata
- G02 - OPTICS
Information Patent Application
Organic semiconductor element and manufacturing method thereof
- Publication number 20050279996
- Publication date Dec 22, 2005
- Chiaki Takubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20050253247
- Publication date Nov 17, 2005
- Takashi Imoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Toner for producing wiring board and method of producing wiring boa...
- Publication number 20050227158
- Publication date Oct 13, 2005
- Kabushiki Kaisha Toshiba
- Toshiaki Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Image forming apparatus and method of manufacturing electronic circ...
- Publication number 20050227161
- Publication date Oct 13, 2005
- Hideo Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Chiaki Takubo

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device

Method for manufacturing semiconductor device that includes dividin...

Semiconductor module

Semiconductor module

Semiconductor apparatus, manufacturing method of semiconductor appa...

Semiconductor device and method for manufacturing the same

Semiconductor manufacturing apparatus and semiconductor manufacturi...

Semiconductor device, through hole having expansion portion and thi...

Metal-containing resin particle, resin particle, electronic circuit...

Metal-containing resin particle, metal-containing resin layer, meth...

Semiconductor device and manufacturing method therefor

Solid state imaging device and method for manufacturing same, and s...

Method of manufacturing an electronic circuit formed on a substrate

Semiconductor device package having a semiconductor element with a...

Semiconductor device having power semiconductor elements

Method of producing electronic circuit, and electronic circuit subs...

Method of producing a wiring board

Optical semiconductor module and semiconductor device including the...

Image forming apparatus and method of manufacturing electronic circ...

Contact sheet for testing electronic parts, apparatus for testing e...

Method of fabricating a semiconductor device package having a semic...

Method for manufacturing optical coupling part and optical coupling...

Lead frame, optical coupling part using lead frame, and manufacturi...

Semiconductor device and manufacturing method therefor

Semiconductor device and manufacturing method thereof

Semiconductor device and fabrication method for the same

Semiconductor device package having a semiconductor element with resin

Semiconductor device, semiconductor package member, and semiconduct...

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURI...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR APPARATUS, MANUFACTURING METHOD OF SEMICONDUCTOR APPA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METAL-CONTAINING RESIN PARTICLE, RESIN PARTICLE, ELECTRONIC CIRCUIT...

SOLID STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME, AND S...

Image forming apparatus and method of manufacturing electronic circ...

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method therefor

Lead frame, optical coupling part using lead frame, and manufacturi...

Semiconductor device and method of manufacturing the same

Method for manufacturing optical coupling part and optical coupling...

Wiring board and production method of wiring board

Wafer support plate, holding method of thin wafer, and manufacturin...

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device

LSI package with interface module, transmission line package, and r...

Optical semiconductor module and semiconductor device including the...

LSI package having interface function with exterior, circuit device...

Organic semiconductor element and manufacturing method thereof

Semiconductor device and manufacturing method therefor

Toner for producing wiring board and method of producing wiring boa...

Image forming apparatus and method of manufacturing electronic circ...