Chiaki Yasumuro

Person

Nirasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Deposition device and deposition method
- Patent number 10,309,005
- Issue date Jun 4, 2019
- Tokyo Electron Limited
- Yasuhiko Kojima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper wiring forming method with Ru liner and Cu alloy fill
- Patent number 9,406,557
- Issue date Aug 2, 2016
- Tokyo Electron Limited
- Osamu Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing method and plasma processing apparatus
- Patent number 9,253,862
- Issue date Feb 2, 2016
- Tokyo Electron Limited
- Tatsuo Hirasawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Mounting table structure, film forming apparatus and raw material r...
- Patent number 8,992,686
- Issue date Mar 31, 2015
- Tokyo Electron Limited
- Atsushi Gomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming copper wiring and method and system for forming c...
- Patent number 8,859,422
- Issue date Oct 14, 2014
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Raw material recovery method and trapping mechanism for recovering...
- Patent number 8,408,025
- Issue date Apr 2, 2013
- Tokyo Electron Limited
- Atsushi Gomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming copper wiring and copper film, and film forming...
- Patent number 8,399,353
- Issue date Mar 19, 2013
- Tokyo Electron Limited
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
DEPOSITION DEVICE AND DEPOSITION METHOD
- Publication number 20160251746
- Publication date Sep 1, 2016
- Tokyo Electron Limited
- Yasuhiko KOJIMA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper Wiring Forming Method
- Publication number 20150004784
- Publication date Jan 1, 2015
- TOKYO ELECTRON LIMITED
- Osamu YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING C...
- Publication number 20140287163
- Publication date Sep 25, 2014
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20140090597
- Publication date Apr 3, 2014
- TOKYO ELECTRON LIMITED
- Tatsuo HIRASAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA PROCESSING APPARATUS AND CLEANING METHOD FOR REMOVING METAL...
- Publication number 20140060572
- Publication date Mar 6, 2014
- TOKYO ELECTRON LIMITED
- Chiaki YASUMURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM FORMING METHOD
- Publication number 20130252417
- Publication date Sep 26, 2013
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20130237053
- Publication date Sep 12, 2013
- TOKYO ELECTRON LIMITED
- Tadahiro Ishizaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING Cu WIRING
- Publication number 20120222782
- Publication date Sep 6, 2012
- TOKYO ELECTRON LIMITED
- Atsushi Gomi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING C...
- Publication number 20120196052
- Publication date Aug 2, 2012
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING COPPER WIRING AND COPPER FILM, AND FILM FORMING...
- Publication number 20120196437
- Publication date Aug 2, 2012
- TOKYO ELECTRON LIMITED
- Tadahiro ISHIZAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING CVD-RU FILM AND METHOD FOR MANUFACTURING SEMICON...
- Publication number 20120064717
- Publication date Mar 15, 2012
- TOKYO ELECTRON LIMITED
- Takara KATO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MOUNTING TABLE STRUCTURE, FILM FORMING APPARATUS AND RAW MATERIAL R...
- Publication number 20120055403
- Publication date Mar 8, 2012
- TOKYO ELECTRON LIMITED
- Atsushi GOMI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RAW MATERIAL RECOVERY METHOD AND TRAPPING MECHANISM FOR RECOVERING...
- Publication number 20110203310
- Publication date Aug 25, 2011
- TOKYO ELECTRON LIMITED
- Atsushi Gomi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Chiaki Yasumuro

Person

Patents Grantslast 30 patents

Deposition device and deposition method

Copper wiring forming method with Ru liner and Cu alloy fill

Plasma processing method and plasma processing apparatus

Mounting table structure, film forming apparatus and raw material r...

Method of forming copper wiring and method and system for forming c...

Raw material recovery method and trapping mechanism for recovering...

Methods of forming copper wiring and copper film, and film forming...

Patents Applicationslast 30 patents

DEPOSITION DEVICE AND DEPOSITION METHOD

Copper Wiring Forming Method

METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING C...

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

PLASMA PROCESSING APPARATUS AND CLEANING METHOD FOR REMOVING METAL...

THIN FILM FORMING METHOD

FILM FORMING METHOD AND FILM FORMING APPARATUS

METHOD FOR FORMING Cu WIRING

METHOD OF FORMING COPPER WIRING AND METHOD AND SYSTEM FOR FORMING C...

METHODS OF FORMING COPPER WIRING AND COPPER FILM, AND FILM FORMING...

METHOD FOR FORMING CVD-RU FILM AND METHOD FOR MANUFACTURING SEMICON...

MOUNTING TABLE STRUCTURE, FILM FORMING APPARATUS AND RAW MATERIAL R...

RAW MATERIAL RECOVERY METHOD AND TRAPPING MECHANISM FOR RECOVERING...