Chian Ping Huang

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Electrostatic chuck assembly having disassembling device
- Patent number 7,102,871
- Issue date Sep 5, 2006
- Taiwan Semiconductor Manufacturing Co,, Ltd.
- Cheng-Liang Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package having vertically mounted passive devices und...
- Patent number 6,781,222
- Issue date Aug 24, 2004
- Siliconware Precision Industries Co., Ltd.
- Chi Chuan Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electrostatic chuck assembly having disassembling device
- Publication number 20050094349
- Publication date May 5, 2005
- Cheng-Liang Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor package and fabricating method thereof
- Publication number 20020086500
- Publication date Jul 4, 2002
- Siliconware Precision Industries, Co., Ltd.
- Chi Chuan Wu
- H01 - BASIC ELECTRIC ELEMENTS