Chiang-Han Day

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
One-step bumping/bonding method for forming semiconductor packages
- Patent number 6,536,653
- Issue date Mar 25, 2003
- Industrial Technology Research Institute
- Hsing-Seng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip ball grid array package with a heat slug
- Patent number 6,166,435
- Issue date Dec 26, 2000
- Industrial Technology Research Institute
- Fang-Jun Leu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
One-step bumping/bonding method for forming semiconductor packages
- Publication number 20020092894
- Publication date Jul 18, 2002
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Hsing-Seng Wang
- H01 - BASIC ELECTRIC ELEMENTS