Chie CHIKARA

Person

Kirishima-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Organic board, metal-clad laminate, and wiring board
- Patent number 11,661,495
- Issue date May 30, 2023
- Kyocera Corporation
- Chie Chikara
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminated uncured sheet
- Patent number 11,426,970
- Issue date Aug 30, 2022
- Kyocera Corporation
- Tadashi Nagasawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, prepreg, metal-clad laminate, and wiring board
- Patent number 10,887,984
- Issue date Jan 5, 2021
- Kyocera Corporation
- Kazumichi Uchida
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Organic insulating body, metal-clad laminate and wiring board
- Patent number 10,806,031
- Issue date Oct 13, 2020
- Kyocera Corporation
- Tadashi Nagasawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Organic insulator, metal-clad laminate and wiring board
- Patent number 10,772,198
- Issue date Sep 8, 2020
- Kyocera Corporation
- Tadashi Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition, prepreg, metal-clad laminated plate, and wiring...
- Patent number 10,316,187
- Issue date Jun 11, 2019
- Kyocera Corporation
- Chie Chikara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ORGANIC INSULATOR, METAL-CLAD LAMINATE SHEET, AND WIRING BOARD
- Publication number 20240215160
- Publication date Jun 27, 2024
- KYOCERA CORPORATION
- Chie CHIKARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INSULATOR AND WIRING BOARD
- Publication number 20230209708
- Publication date Jun 29, 2023
- KYOCERA CORPORATION
- Chie CHIKARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED UNCURED SHEET
- Publication number 20210260847
- Publication date Aug 26, 2021
- KYOCERA CORPORATION
- Tadashi NAGASAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
ORGANIC BOARD, METAL-CLAD LAMINATE, AND WIRING BOARD
- Publication number 20210214523
- Publication date Jul 15, 2021
- KYOCERA CORPORATION
- Chie CHIKARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ORGANIC INSULATOR, METAL-CLAD LAMINATE AND WIRING BOARD
- Publication number 20200128667
- Publication date Apr 23, 2020
- KYOCERA CORPORATION
- Tadashi NAGASAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
ORGANIC INSULATING BODY, METAL-CLAD LAMINATE AND WIRING BOARD
- Publication number 20200077514
- Publication date Mar 5, 2020
- KYOCERA CORPORATION
- Tadashi NAGASAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATED PLATE, AND WIRING...
- Publication number 20180051170
- Publication date Feb 22, 2018
- KYOCERA CORPORATION
- Chie CHIKARA
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD
- Publication number 20170354033
- Publication date Dec 7, 2017
- KYOCERA CORPORATION
- Kazumichi UCHIDA
- B32 - LAYERED PRODUCTS

Chie CHIKARA

Person

Patents Grantslast 30 patents

Organic board, metal-clad laminate, and wiring board

Laminated uncured sheet

Resin composition, prepreg, metal-clad laminate, and wiring board

Organic insulating body, metal-clad laminate and wiring board

Organic insulator, metal-clad laminate and wiring board

Resin composition, prepreg, metal-clad laminated plate, and wiring...

Patents Applicationslast 30 patents

ORGANIC INSULATOR, METAL-CLAD LAMINATE SHEET, AND WIRING BOARD

ORGANIC INSULATOR AND WIRING BOARD

LAMINATED UNCURED SHEET

ORGANIC BOARD, METAL-CLAD LAMINATE, AND WIRING BOARD

ORGANIC INSULATOR, METAL-CLAD LAMINATE AND WIRING BOARD

ORGANIC INSULATING BODY, METAL-CLAD LAMINATE AND WIRING BOARD

RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATED PLATE, AND WIRING...

RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD