Chie Iino

Person

Ibaraki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Sealing sheet with separators on both surfaces, and method for manu...
- Patent number 10,128,131
- Issue date Nov 13, 2018
- Nitto Denko Corporation
- Goji Shiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing sheet
- Patent number 10,074,582
- Issue date Sep 11, 2018
- Nitto Denko Corporation
- Jun Ishii
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sheet for sealing and method for manufacturing semiconductor device...
- Patent number 9,754,894
- Issue date Sep 5, 2017
- Nitto Denko Corporation
- Chie Iino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally curable resin sheet for sealing semiconductor chip, and m...
- Patent number 9,659,883
- Issue date May 23, 2017
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUMP BASE REINFORCEMENT SHEET
- Publication number 20180304603
- Publication date Oct 25, 2018
- NITTO DENKO CORPORATION
- Chie Iino
- B32 - LAYERED PRODUCTS
Information Patent Application
SEALING SHEET
- Publication number 20170287800
- Publication date Oct 5, 2017
- NITTO DENKO CORPORATION
- Jun Ishii
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEALING SHEET, SEALING SHEET WITH SEPARATOR, SEMICONDUCTOR DEVICE,...
- Publication number 20170278716
- Publication date Sep 28, 2017
- NITTO DENKO CORPORATION
- Chie Iino
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20170125373
- Publication date May 4, 2017
- NITTO DENKO CORPORATION
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING SHEET PROVIDED WITH DOUBLE-SIDED SEPARATOR, AND METHOD FOR...
- Publication number 20170040187
- Publication date Feb 9, 2017
- Nitto Denko Corporation
- Chie Iino
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC COMPONENT DEVICE PRODUCTION METHOD AND ELECTRONIC COMPON...
- Publication number 20170040287
- Publication date Feb 9, 2017
- NITTO DENKO CORPORATION
- Goji Shiga
- B32 - LAYERED PRODUCTS
Information Patent Application
PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE
- Publication number 20170033076
- Publication date Feb 2, 2017
- NITTO DENKO CORPORATION
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE
- Publication number 20170032979
- Publication date Feb 2, 2017
- NITTO DENKO CORPORATION
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING SHEET WITH SEPARATORS ON BOTH SURFACES, AND METHOD FOR MANU...
- Publication number 20160300733
- Publication date Oct 13, 2016
- Nitto Denko Corporation
- Goji Shiga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CURABLE RESIN SHEET FOR SEALING SEMICONDUCTOR CHIP, AND M...
- Publication number 20160211228
- Publication date Jul 21, 2016
- Nitto Denko Corporation
- Kosuke Morita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET FOR SEALING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20160211217
- Publication date Jul 21, 2016
- NITTO DENKO CORPORATION
- Chie IINO
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Sealing sheet with separators on both surfaces, and method for manu...

Sealing sheet

Sheet for sealing and method for manufacturing semiconductor device...

Thermally curable resin sheet for sealing semiconductor chip, and m...

Patents Applicationslast 30 patents

BUMP BASE REINFORCEMENT SHEET

SEALING SHEET

SEALING SHEET, SEALING SHEET WITH SEPARATOR, SEMICONDUCTOR DEVICE,...

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

SEALING SHEET PROVIDED WITH DOUBLE-SIDED SEPARATOR, AND METHOD FOR...

ELECTRONIC COMPONENT DEVICE PRODUCTION METHOD AND ELECTRONIC COMPON...

PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE

PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGE

SEALING SHEET WITH SEPARATORS ON BOTH SURFACES, AND METHOD FOR MANU...

THERMALLY CURABLE RESIN SHEET FOR SEALING SEMICONDUCTOR CHIP, AND M...

SHEET FOR SEALING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...