Chie SUGAMA

Person

Chiyoda-ku, Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing bonded object and semiconductor device and cop...
- Patent number 11,890,681
- Issue date Feb 6, 2024
- Resonac Corporation
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Member connection method
- Patent number 11,887,960
- Issue date Jan 30, 2024
- Resonac Corporation
- Motohiro Negishi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for manufacturing thermoelectric conversion module, thermoel...
- Patent number 11,575,076
- Issue date Feb 7, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Motohiro Negishi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper paste for pressureless bonding, bonded body and semiconducto...
- Patent number 11,532,588
- Issue date Dec 20, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hideo Nakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing joined body, and joining material
- Patent number 11,483,936
- Issue date Oct 25, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hideo Nakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,462,502
- Issue date Oct 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,370,066
- Issue date Jun 28, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper paste for joining, method for manufacturing joined body, and...
- Patent number 11,040,416
- Issue date Jun 22, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Dai Ishikawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper paste for pressureless bonding, bonded body and semiconducto...
- Patent number 10,930,612
- Issue date Feb 23, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Hideo Nakako
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Copper paste for joining, method for manufacturing joined body, and...
- Patent number 10,748,865
- Issue date Aug 18, 2020
- Hitachi Chemical Company, Ltd.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Assembly and semiconductor device
- Patent number 10,566,304
- Issue date Feb 18, 2020
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper paste for joining, method for producing joined body, and met...
- Patent number 10,363,608
- Issue date Jul 30, 2019
- Hitachi Chemical Company, Ltd.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20220371087
- Publication date Nov 24, 2022
- Motohiro NEGISHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR PRODUCING BONDED OBJECT AND SEMICONDUCTOR DEVICE AND COP...
- Publication number 20220028824
- Publication date Jan 27, 2022
- Showa Denko Materials Co., Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
MEMBER CONNECTION METHOD
- Publication number 20210351157
- Publication date Nov 11, 2021
- Hitachi Chemical Company, Ltd.
- Motohiro NEGISHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...
- Publication number 20210143121
- Publication date May 13, 2021
- Hideo NAKAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING JOINED BODY, AND JOINING MATERIAL
- Publication number 20200344893
- Publication date Oct 29, 2020
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE, THERMOEL...
- Publication number 20200295248
- Publication date Sep 17, 2020
- Hitachi Chemical Company, Ltd.
- Motohiro NEGISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20200176411
- Publication date Jun 4, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200130109
- Publication date Apr 30, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20200108471
- Publication date Apr 9, 2020
- Hitachi Chemical Company, Ltd.
- Dai ISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200075528
- Publication date Mar 5, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...
- Publication number 20190355690
- Publication date Nov 21, 2019
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY AND SEMICONDUCTOR DEVICE
- Publication number 20180342478
- Publication date Nov 29, 2018
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR PRODUCING JOINED BODY, AND MET...
- Publication number 20180250751
- Publication date Sep 6, 2018
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY

Chie SUGAMA

Person

Patents Grantslast 30 patents

Method for producing bonded object and semiconductor device and cop...

Member connection method

Method for manufacturing thermoelectric conversion module, thermoel...

Copper paste for pressureless bonding, bonded body and semiconducto...

Method for producing joined body, and joining material

Metal paste for joints, assembly, production method for assembly, s...

Metal paste for joints, assembly, production method for assembly, s...

Copper paste for joining, method for manufacturing joined body, and...

Copper paste for pressureless bonding, bonded body and semiconducto...

Copper paste for joining, method for manufacturing joined body, and...

Assembly and semiconductor device

Copper paste for joining, method for producing joined body, and met...

Patents Applicationslast 30 patents

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

METHOD FOR PRODUCING BONDED OBJECT AND SEMICONDUCTOR DEVICE AND COP...

MEMBER CONNECTION METHOD

COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...

METHOD FOR PRODUCING JOINED BODY, AND JOINING MATERIAL

METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE, THERMOEL...

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...

ASSEMBLY AND SEMICONDUCTOR DEVICE

COPPER PASTE FOR JOINING, METHOD FOR PRODUCING JOINED BODY, AND MET...