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Hsinchu Hsien, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Substrate structure for an image sensor package and method for manu...
Patent number
8,314,481
Issue date
Nov 20, 2012
Kingpak Technology Inc.
Chung Hsien Hsin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory module structure
Patent number
6,642,554
Issue date
Nov 4, 2003
Kingpak Technology, Inc.
Nai Hua Yeh
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor package structure having central leads and method for...
Patent number
6,501,187
Issue date
Dec 31, 2002
Nai Hua Yeh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Substrate structure for an image sensor package and method for manu...
Publication number
20060275943
Publication date
Dec 7, 2006
Chung Hsien Hsin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Jig structure for an integrated circuit package
Publication number
20030118680
Publication date
Jun 26, 2003
Chief Lin
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Memory module structure
Publication number
20030094628
Publication date
May 22, 2003
Nai Hua Yeh
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Structure of stacked integrated circuits and method for manufacturi...
Publication number
20020096762
Publication date
Jul 25, 2002
Wen Chuan Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE OF STACKED INTEGRATED CIRCUITS AND METHOD FOR MANUFACTURI...
Publication number
20020096761
Publication date
Jul 25, 2002
Wen Chuan Chen
H01 - BASIC ELECTRIC ELEMENTS