Chieh-Chen Fu

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Device for communication
- Patent number 11,474,301
- Issue date Oct 18, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang-Feng You
- G02 - OPTICS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,329,016
- Issue date May 10, 2022
- Advanced Semiconductor Engineering, Inc.
- Meng-Wei Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,930,627
- Issue date Feb 23, 2021
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,784,208
- Issue date Sep 22, 2020
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hsien Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,431,554
- Issue date Oct 1, 2019
- Advanced Semiconductor Engineering, Inc.
- I-Chia Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 9,871,005
- Issue date Jan 16, 2018
- Advanced Semiconductor Engineering, Inc.
- I-Chia Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages
- Patent number 9,269,673
- Issue date Feb 23, 2016
- Advanced Semiconductor Engineering, Inc.
- I-Chia Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,963,316
- Issue date Feb 24, 2015
- Advanced Semiconductor Engineering, Inc.
- Chih-Jing Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with embedded die and method of fabricating the same
- Patent number 8,120,148
- Issue date Feb 21, 2012
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240213205
- Publication date Jun 27, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240038712
- Publication date Feb 1, 2024
- Advanced Semiconductor Engineering, Inc.
- Jung Jui KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR COMMUNICATION
- Publication number 20220214488
- Publication date Jul 7, 2022
- Advanced Semiconductor Engineering, Inc.
- Chang-Feng YOU
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210249369
- Publication date Aug 12, 2021
- Advanced Semiconductor Engineering, Inc.
- Meng-Wei HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210167053
- Publication date Jun 3, 2021
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu LIN
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200212023
- Publication date Jul 2, 2020
- Advanced Semiconductor Engineering, Inc.
- Chang-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180158783
- Publication date Jun 7, 2018
- Advanced Semiconductor Engineering, Inc.
- I-Chia LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170200682
- Publication date Jul 13, 2017
- Advanced Semiconductor Engineering, Inc.
- I-Chia LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170077039
- Publication date Mar 16, 2017
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hsien Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130207260
- Publication date Aug 15, 2013
- Advanced Semiconductor Engineering, Inc.
- Chih-Jing Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Manufacturing Methods Thereof
- Publication number 20110127654
- Publication date Jun 2, 2011
- ADVANCED SEMICONDUCTOR ENGINEERING, INC..,
- Chaofu Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND PROCESS OF EMBEDDED CHIP PACKAGE
- Publication number 20100006330
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Chieh-Chen Fu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE WITH EMBEDDED DIE AND METHOD OF FABRICATING THE SAME
- Publication number 20090224378
- Publication date Sep 10, 2009
- Advanced Semiconductor Engineering, Inc.
- KUO-HUA CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Chieh-Chen Fu

Person

Patents Grantslast 30 patents

Device for communication

Semiconductor device package and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device packages

Semiconductor device and method for manufacturing the same

Package structure with embedded die and method of fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

DEVICE FOR COMMUNICATION

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Package and Manufacturing Methods Thereof

STRUCTURE AND PROCESS OF EMBEDDED CHIP PACKAGE

PACKAGE STRUCTURE WITH EMBEDDED DIE AND METHOD OF FABRICATING THE SAME