Chien-Cheng Kuo

Person

Tainan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensor and manufacturing method thereof
- Patent number 12,218,159
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Lei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier used for preparing beverage and method for fabrication of t...
- Patent number 12,122,590
- Issue date Oct 22, 2024
- GOLDEN ARROW PRINTING TECHNOLOGY (KUNSHAN) CO., LTD.
- Chien-Kuan Kuo
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
Information Patent Grant
Semiconductor device package having metal thermal interface material
- Patent number 12,119,237
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and method of making
- Patent number 12,100,754
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FETs and methods of forming FETs
- Patent number 12,094,761
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ru Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor source/drain regions and methods of forming the same
- Patent number 12,080,759
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yan-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with inductor windings around a core above an...
- Patent number 12,057,468
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsien Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stick-shaped paper container
- Patent number 12,024,359
- Issue date Jul 2, 2024
- Golden Arrow Printing Technology Co., LTD.
- Chien-Kuan Kuo
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Semiconductor device
- Patent number 12,027,603
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jheng-Sheng You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme for pad openings and trenches
- Patent number 12,002,774
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain device and method of forming thereof
- Patent number 11,990,511
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-I Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pulp-molding process and in-line intelligently drying apparatus the...
- Patent number 11,976,422
- Issue date May 7, 2024
- GOLDEN ARROW PRINTING TECHNOLOGY (KUNSHAN) CO., LTD.
- Chien-Kuan Kuo
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
Information Patent Grant
Semiconductor device
- Patent number 11,948,999
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Ru Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanosheet semiconductor device and method for manufacturing the same
- Patent number 11,942,550
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Chang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating device for convective polymerase chain reaction
- Patent number 11,938,485
- Issue date Mar 26, 2024
- Industrial Technology Research Institute
- Chien-Chih Kuo
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 11,908,818
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Yu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,901,433
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jheng-Sheng You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Consistently-automated production machines and method for preparing...
- Patent number 11,825,879
- Issue date Nov 28, 2023
- GOLDEN ARROW PRINTING TECHNOLOGY (KUNSHAN) CO., LTD.
- Chien-Kuan Kuo
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES
Information Patent Grant
Source/drain regions of semiconductor devices and methods of formin...
- Patent number 11,804,487
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei Hao Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 11,749,711
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having metal thermal interface materia...
- Patent number 11,742,218
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FETS and methods of forming FETS
- Patent number 11,728,208
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ru Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and manufacturing method thereof
- Patent number 11,688,793
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hao Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low warpage high density trench capacitor
- Patent number 11,688,762
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyun-Ying Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and manufacturing method thereof
- Patent number 11,664,398
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Lei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,638,355
- Issue date Apr 25, 2023
- ABILITY ENTERPRISE CO., LTD.
- Chien-Tsun Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures and methods for reducing thermal expansion mismatch duri...
- Patent number 11,621,235
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuen-Shian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FETs and methods of forming FETs
- Patent number 11,600,715
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tzu-Ching Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Projecting apparatus and projecting calibration method
- Patent number 11,549,805
- Issue date Jan 10, 2023
- Industrial Technology Research Institute
- Kai-Shiang Gan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,532,750
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Li Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FETS and Methods of Forming FETS
- Publication number 20250006549
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ru Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...
- Publication number 20240421115
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240387576
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Lei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Source/Drain Contacts and Methods of Forming the Same
- Publication number 20240379781
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei Hao Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR SOURCE/DRAIN REGIONS
- Publication number 20240371930
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING
- Publication number 20240371987
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chi-Fu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE PACKAGE HAVING METAL THERMA...
- Publication number 20240371656
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Li KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20240355983
- Publication date Oct 24, 2024
- AUO Corporation
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING ELEMENT SUBSTRATE AND DISPLAY APPARATUS
- Publication number 20240355960
- Publication date Oct 24, 2024
- AUO Corporation
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE WITH INDUCTOR
- Publication number 20240347578
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsien Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING RING STRUCTURE ATTACHED BY HYBRID ADHES...
- Publication number 20240332212
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE MODULE WITH A MODULE STIFFENER AND METHODS OF FORMING THE SAME
- Publication number 20240297087
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Kai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...
- Publication number 20240290683
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES
- Publication number 20240282728
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source/Drain Device and Method of Forming Thereof
- Publication number 20240266398
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-I Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULP-MOLDED CUP LID WITH LEAKPROOF STRUCTURE
- Publication number 20240253869
- Publication date Aug 1, 2024
- Golden Arrow Printing Technology (Kunshan) Co., Ltd.
- CHIEN-KUAN KUO
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
Information Patent Application
PROJECTION DEVICE
- Publication number 20240204037
- Publication date Jun 20, 2024
- AUO Corporation
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240204084
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Ru LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSHEET SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240194788
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULP-MOLDING MOULD ASSEMBLY WITH HEATING DEVICE
- Publication number 20240158992
- Publication date May 16, 2024
- Golden Arrow Printing Technology (Kunshan) Co., Ltd.
- CHIEN-KUAN KUO
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
Information Patent Application
DISPLAY DEVICE
- Publication number 20240162402
- Publication date May 16, 2024
- AUO Corporation
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUNKEN-TYPE CUP LID
- Publication number 20240076105
- Publication date Mar 7, 2024
- Golden Arrow Printing Technology (Kunshan) Co., LTD.
- CHIEN-KUAN KUO
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
MULTI-DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240071854
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240071950
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-WAFER-ON-BOARD STRUCTURE USING SPACER DIE AND METHODS OF FO...
- Publication number 20230420429
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING METAL THERMAL INTERFACE MATERIAL
- Publication number 20230411173
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Li KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method Forming Same
- Publication number 20230411307
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method Forming Same
- Publication number 20230395461
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20230387101
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy through vias for Integrated Circuit Packages and Methods of F...
- Publication number 20230377905
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Chien-Cheng Kuo

Person

Patents Grantslast 30 patents

Image sensor and manufacturing method thereof

Carrier used for preparing beverage and method for fabrication of t...

Semiconductor device package having metal thermal interface material

Semiconductor arrangement and method of making

FETs and methods of forming FETs

Transistor source/drain regions and methods of forming the same

Semiconductor device with inductor windings around a core above an...

Stick-shaped paper container

Semiconductor device

Passivation scheme for pad openings and trenches

Source/drain device and method of forming thereof

Pulp-molding process and in-line intelligently drying apparatus the...

Semiconductor device

Nanosheet semiconductor device and method for manufacturing the same

Heating device for convective polymerase chain reaction

Semiconductor device

Semiconductor device

Consistently-automated production machines and method for preparing...

Source/drain regions of semiconductor devices and methods of formin...

Semiconductor device structure with magnetic element

Semiconductor device package having metal thermal interface materia...

FETS and methods of forming FETS

Integrated circuit structure and manufacturing method thereof

Low warpage high density trench capacitor

Image sensor and manufacturing method thereof

Electronic device

Structures and methods for reducing thermal expansion mismatch duri...

FETs and methods of forming FETs

Projecting apparatus and projecting calibration method

Semiconductor device and method of manufacture

Patents Applicationslast 30 patents

FETS and Methods of Forming FETS

HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

Backside Source/Drain Contacts and Methods of Forming the Same

TRANSISTOR SOURCE/DRAIN REGIONS

SEMICONDUCTOR ARRANGEMENT AND METHOD OF MAKING

METHOD FOR FORMING SEMICONDUCTOR DEVICE PACKAGE HAVING METAL THERMA...

DISPLAY APPARATUS

LIGHT EMITTING ELEMENT SUBSTRATE AND DISPLAY APPARATUS

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE WITH INDUCTOR

PACKAGE STRUCTURE INCLUDING RING STRUCTURE ATTACHED BY HYBRID ADHES...

PACKAGE MODULE WITH A MODULE STIFFENER AND METHODS OF FORMING THE SAME

PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...

PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES

Source/Drain Device and Method of Forming Thereof

PULP-MOLDED CUP LID WITH LEAKPROOF STRUCTURE

PROJECTION DEVICE

SEMICONDUCTOR DEVICE

NANOSHEET SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

PULP-MOLDING MOULD ASSEMBLY WITH HEATING DEVICE

DISPLAY DEVICE

SUNKEN-TYPE CUP LID

MULTI-DIE PACKAGE AND METHODS OF FORMATION

Integrated Circuit Packages and Methods of Forming the Same

CHIP-ON-WAFER-ON-BOARD STRUCTURE USING SPACER DIE AND METHODS OF FO...

SEMICONDUCTOR DEVICE PACKAGE HAVING METAL THERMAL INTERFACE MATERIAL

Semiconductor Device and Method Forming Same

Semiconductor Device and Method Forming Same

Integrated Circuit Packages and Methods of Forming the Same

Dummy through vias for Integrated Circuit Packages and Methods of F...