Chien-Cheng Wei

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Rubber resin material with high dielectric constant
- Patent number 11,920,036
- Issue date Mar 5, 2024
- Nan Ya Plastics Corporation
- Te-Chao Liao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Low-dielectric rubber resin material and low-dielectric metal subst...
- Patent number 11,859,083
- Issue date Jan 2, 2024
- Nan Ya Plastics Corporation
- Te-Chao Liao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fingerprint sensing device and method for producing the same
- Patent number 9,892,302
- Issue date Feb 13, 2018
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer circuit board and method for manufacturing the same
- Patent number 9,801,288
- Issue date Oct 24, 2017
- Tong Hsing Electronic Industries, Ltd.
- Chien-Cheng Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress-reduced circuit board and method for forming the same
- Patent number 9,468,091
- Issue date Oct 11, 2016
- Tong Hsing Electronic Industries, Ltd.
- Chien-Cheng Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POLYIMIDE RESIN
- Publication number 20230279226
- Publication date Sep 7, 2023
- Nan Ya Plastics Corporation
- Te-Chao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYPHENYLENE ETHER RESIN MODIFIED WITH BENZOXAZINE, METHOD FOR PRO...
- Publication number 20230089728
- Publication date Mar 23, 2023
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYPHENYLENE ETHER RESIN MODIFIED WITH TWO AMINO FUNCTIONAL GROUPS...
- Publication number 20230090736
- Publication date Mar 23, 2023
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYPHENYLENE ETHER RESIN MODIFIED WITH BISMALEIMIDE, METHOD FOR PR...
- Publication number 20230091594
- Publication date Mar 23, 2023
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION
- Publication number 20230072223
- Publication date Mar 9, 2023
- Nan Ya Plastics Corporation
- Te-Chao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RUBBER RESIN MATERIAL WITH HIGH DIELECTRIC CONSTANT AND METAL SUBST...
- Publication number 20230047133
- Publication date Feb 16, 2023
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- B32 - LAYERED PRODUCTS
Information Patent Application
LOW-DIELECTRIC RUBBER RESIN MATERIAL AND LOW-DIELECTRIC METAL SUBST...
- Publication number 20230046004
- Publication date Feb 16, 2023
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMOSETTING RESIN MATERIAL, PREPREG, AND METAL SUBSTRATE
- Publication number 20230002611
- Publication date Jan 5, 2023
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- B32 - LAYERED PRODUCTS
Information Patent Application
CHIP PACKAGING DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20190305024
- Publication date Oct 3, 2019
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Zzu-Chi CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSING DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20170083740
- Publication date Mar 23, 2017
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Chia-Shuai CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGERPRINT SENSING DEVICE AND METHOD FOR PRODUCING THE SAME
- Publication number 20170083736
- Publication date Mar 23, 2017
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Chien-Cheng WEI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERPOSER AND METHOD FOR PRODUCING THE SAME
- Publication number 20160247696
- Publication date Aug 25, 2016
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Shao-Pin RU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150319868
- Publication date Nov 5, 2015
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Chien-Cheng WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER AND METHOD FOR PRODUCING THE SAME
- Publication number 20150292099
- Publication date Oct 15, 2015
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Shao-Pin RU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
STRESS-REDUCED CIRCUIT BOARD AND METHOD FOR FORMING THE SAME
- Publication number 20140110159
- Publication date Apr 24, 2014
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Chien-Cheng Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC PLATE WITH REFLECTIVE FILM AND METHOD OF MANUFACTURING THE...
- Publication number 20120171510
- Publication date Jul 5, 2012
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Ta-Hsiang CHIANG
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
PERSONALIZED GOODS ASSEMBLY TRANSACTION SYSTEN
- Publication number 20110246327
- Publication date Oct 6, 2011
- CHIEN-HUA WEI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Low profile optoelectronic device package
- Publication number 20110057216
- Publication date Mar 10, 2011
- Tong Hsing Electric Industries Ltd.
- Ming-Kuen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF HIGH-LINEARITY AND HIGH-POWER CMOS STRUCTURE
- Publication number 20080318372
- Publication date Dec 25, 2008
- Hsien-Chin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-linearity and high-power CMOS structure and manufacturing meth...
- Publication number 20080157210
- Publication date Jul 3, 2008
- Chang Gung University
- Hsien-Chin Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Chien-Cheng Wei

Person

Patents Grantslast 30 patents

Rubber resin material with high dielectric constant

Low-dielectric rubber resin material and low-dielectric metal subst...

Fingerprint sensing device and method for producing the same

Multilayer circuit board and method for manufacturing the same

Stress-reduced circuit board and method for forming the same

Patents Applicationslast 30 patents

POLYIMIDE RESIN

POLYPHENYLENE ETHER RESIN MODIFIED WITH BENZOXAZINE, METHOD FOR PRO...

POLYPHENYLENE ETHER RESIN MODIFIED WITH TWO AMINO FUNCTIONAL GROUPS...

POLYPHENYLENE ETHER RESIN MODIFIED WITH BISMALEIMIDE, METHOD FOR PR...

RESIN COMPOSITION

RUBBER RESIN MATERIAL WITH HIGH DIELECTRIC CONSTANT AND METAL SUBST...

LOW-DIELECTRIC RUBBER RESIN MATERIAL AND LOW-DIELECTRIC METAL SUBST...

THERMOSETTING RESIN MATERIAL, PREPREG, AND METAL SUBSTRATE

CHIP PACKAGING DEVICE AND METHOD OF MAKING THE SAME

FINGERPRINT SENSING DEVICE AND METHOD FOR PRODUCING THE SAME

FINGERPRINT SENSING DEVICE AND METHOD FOR PRODUCING THE SAME

INTERPOSER AND METHOD FOR PRODUCING THE SAME

MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

INTERPOSER AND METHOD FOR PRODUCING THE SAME

STRESS-REDUCED CIRCUIT BOARD AND METHOD FOR FORMING THE SAME

CERAMIC PLATE WITH REFLECTIVE FILM AND METHOD OF MANUFACTURING THE...

PERSONALIZED GOODS ASSEMBLY TRANSACTION SYSTEN

Low profile optoelectronic device package

MANUFACTURING METHOD OF HIGH-LINEARITY AND HIGH-POWER CMOS STRUCTURE

High-linearity and high-power CMOS structure and manufacturing meth...