Chien-Chia Chiu

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Thongli City, TW

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Patents Applicationslast 30 patents

Information Patent Application
3D ELECTRONIC PACKAGING STRUCTURE WITH ENHANCED GROUNDING PERFORMAN...
- Publication number 20080142941
- Publication date Jun 19, 2008
- Advanced Chip Engineering Technology Inc.
- Ming-Chih Yew
- H01 - BASIC ELECTRIC ELEMENTS