CHIEN-CHIH LEE

Person

HSI-CHIH CITY, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Sensor package structure having ring-shaped solder mask frame
- Patent number 11,984,516
- Issue date May 14, 2024
- Tong Hsing Electronic Industries, Ltd.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,984,375
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EFEM robot auto teaching methodology
- Patent number 11,984,331
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Fa Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with warpage-relief trenches
- Patent number 11,973,040
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure having solder mask frame
- Patent number 11,967,652
- Issue date Apr 23, 2024
- Tong Hsing Electronic Industries, Ltd.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 11,968,844
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Min Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Impeller
- Patent number 11,965,522
- Issue date Apr 23, 2024
- Delta Electronics, Inc.
- Pei-Han Chiu
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Circuit board structure with waveguide and method for manufacturing...
- Patent number 11,963,293
- Issue date Apr 16, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chien-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure comprising buffer layer for reducing thermal stre...
- Patent number 11,961,777
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated inspection tool
- Patent number 11,961,770
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Han Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
First fire operation for ovonic threshold switch selector
- Patent number 11,955,173
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Elia Ambrosi
- G11 - INFORMATION STORAGE
Information Patent Grant
User equipment for beam failure detection and beam failure detectio...
- Patent number 11,950,112
- Issue date Apr 2, 2024
- Acer Incorporated
- Li-Chung Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Device and method for handling channel access procedure
- Patent number 11,950,283
- Issue date Apr 2, 2024
- Acer Incorporated
- Li-Chung Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Device and method for handling channel access procedure
- Patent number 11,950,282
- Issue date Apr 2, 2024
- Acer Incorporated
- Li-Chung Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Memory devices and methods of forming the same
- Patent number 11,944,019
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Feng Hsu
Information Patent Grant
Nanosheet semiconductor device and method for manufacturing the same
- Patent number 11,942,550
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Chang Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uninterruptible power apparatus and magnetic flux compensation meth...
- Patent number 11,936,238
- Issue date Mar 19, 2024
- Delta Electronics, Inc.
- Hsin-Chih Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
FinFET structure and method for manufacturing thereof
- Patent number 11,929,398
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a source/drain
- Patent number 11,929,401
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Wei Lee
- C30 - CRYSTAL GROWTH
Information Patent Grant
Equipment for beam failure reporting and beam failure reporting method
- Patent number 11,930,550
- Issue date Mar 12, 2024
- Acer Incorporated
- Li-Chung Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Power supply device
- Patent number 11,930,573
- Issue date Mar 12, 2024
- Power Forest Technology Corporation
- Rong-Jie Tu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
System and method for optimization of network function management a...
- Patent number 11,924,039
- Issue date Mar 5, 2024
- Chunghwa Telecom Co., Ltd.
- Yuan-Mao Hung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Three-dimensional device structure including embedded integrated pa...
- Patent number 11,908,838
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method of handling flexible duplexing
- Patent number 11,902,812
- Issue date Feb 13, 2024
- Acer Incorporated
- Wei-Chen Pao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Device of handling a HARQ retransmission
- Patent number 11,902,967
- Issue date Feb 13, 2024
- Acer Incorporated
- Chien-Min Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Photonic device and method of making same
- Patent number 11,892,678
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Ying Wu
- G02 - OPTICS
Information Patent Grant
Device and method of handling an uplink transmission with sounding...
- Patent number 11,894,952
- Issue date Feb 6, 2024
- Acer Incorporated
- Jen-Hsien Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fiber to chip coupler and method of making the same
- Patent number 11,892,681
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hao Huang
- G02 - OPTICS
Information Patent Grant
Semiconductor package with through vias and stacked redistribution...
- Patent number 11,894,341
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming target substrate and electronic device
- Patent number 11,868,040
- Issue date Jan 9, 2024
- Innolux Corporation
- Chien-Hsing Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240136376
- Publication date Apr 25, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- DONG-RU WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240136202
- Publication date Apr 25, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240136386
- Publication date Apr 25, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128232
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240111337
- Publication date Apr 4, 2024
- ACER INCORPORATED
- Wei-Chih Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR HANDLING A MULTI-CELL SCHEDULING AND USER EQUIPMENT
- Publication number 20240114523
- Publication date Apr 4, 2024
- ACER INCORPORATED
- Chien-Min Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Three-Dimensional Semiconductor Device and Method
- Publication number 20240105631
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jeng-An Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING TARGET SUBSTRATE
- Publication number 20240103356
- Publication date Mar 28, 2024
- InnoLux Corporation
- Chien-Hsing LEE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20240096812
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD
- Publication number 20240088179
- Publication date Mar 14, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- You-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240079346
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMORPHOUS PHASE MODIFICATION APPARATUS AND PROCESSING METHOD OF SIN...
- Publication number 20240075558
- Publication date Mar 7, 2024
- GLOBALWAFERS CO., LTD.
- Chien Chung Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240071999
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tseng Hsing Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20240063130
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Displays with Data Lines that Accommodate Openings
- Publication number 20240061298
- Publication date Feb 22, 2024
- Apple Inc.
- Shin-Hung Yeh
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240061037
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA STORAGE DEVICE AND NON-VOLATILE MEMORY CONTROL METHOD
- Publication number 20240053929
- Publication date Feb 15, 2024
- SILICON MOTION, INC.
- Hsu-Ping OU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20240055453
- Publication date Feb 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- JUI-HUNG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN HOUSING
- Publication number 20240052851
- Publication date Feb 15, 2024
- Delta Electronics, Inc.
- Yueh-Chih Hung
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME
- Publication number 20240055468
- Publication date Feb 15, 2024
- TAIWAN SEMICONDUCTOR MANUFACTRING CO., LTD.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESOURCE CANCELLATION METHOD AND USER EQUIPMENT
- Publication number 20240057115
- Publication date Feb 15, 2024
- ACER INCORPORATED
- Li-Chung Lo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR DIE HAVING THE MEMORY DEVICE
- Publication number 20240049477
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ying Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Chips Comprising Inductor-Vias and Methods Forming th...
- Publication number 20240047509
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240040802
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Wu
Information Patent Application
REAL-TIME MONITORING AND EARLY WARNING SYSTEM FOR BLOOD OXYGEN AND...
- Publication number 20240032874
- Publication date Feb 1, 2024
- NATIONAL TAIWAN UNIVERSITY HOSPITAL
- CHIEN-CHANG LEE
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
FAN
- Publication number 20240040740
- Publication date Feb 1, 2024
- Delta Electronics, Inc.
- Pei-Han Chiu
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240021618
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Yun Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20240021467
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240021738
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- ANHAO CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240015988
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Min Lee

CHIEN-CHIH LEE

Person

Patents Grantslast 30 patents

Sensor package structure having ring-shaped solder mask frame

Integrated circuit package and method

EFEM robot auto teaching methodology

Interposer with warpage-relief trenches

Sensor package structure having solder mask frame

Memory device

Impeller

Circuit board structure with waveguide and method for manufacturing...

Package structure comprising buffer layer for reducing thermal stre...

Automated inspection tool

First fire operation for ovonic threshold switch selector

User equipment for beam failure detection and beam failure detectio...

Device and method for handling channel access procedure

Device and method for handling channel access procedure

Memory devices and methods of forming the same

Nanosheet semiconductor device and method for manufacturing the same

Uninterruptible power apparatus and magnetic flux compensation meth...

FinFET structure and method for manufacturing thereof

Method of forming a source/drain

Equipment for beam failure reporting and beam failure reporting method

Power supply device

System and method for optimization of network function management a...

Three-dimensional device structure including embedded integrated pa...

Device and method of handling flexible duplexing

Device of handling a HARQ retransmission

Photonic device and method of making same

Device and method of handling an uplink transmission with sounding...

Fiber to chip coupler and method of making the same

Semiconductor package with through vias and stacked redistribution...

Method for forming target substrate and electronic device

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR PACKAGE

ELECTRONIC DEVICE

METHOD FOR HANDLING A MULTI-CELL SCHEDULING AND USER EQUIPMENT

Three-Dimensional Semiconductor Device and Method

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING TARGET SUBSTRATE

Semiconductor Device and Method of Manufacture

CHIP PACKAGING STRUCTURE AND CHIP PACKAGING METHOD

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

AMORPHOUS PHASE MODIFICATION APPARATUS AND PROCESSING METHOD OF SIN...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

Displays with Data Lines that Accommodate Openings

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

DATA STORAGE DEVICE AND NON-VOLATILE MEMORY CONTROL METHOD

SENSOR PACKAGE STRUCTURE

FAN HOUSING

PACKAGE WITH INTEGRATED VOLTAGE REGULATOR AND METHOD FORMING THE SAME

RESOURCE CANCELLATION METHOD AND USER EQUIPMENT

MEMORY DEVICE AND SEMICONDUCTOR DIE HAVING THE MEMORY DEVICE

Packages with Chips Comprising Inductor-Vias and Methods Forming th...

MEMORY DEVICE AND METHOD OF FORMING THE SAME

REAL-TIME MONITORING AND EARLY WARNING SYSTEM FOR BLOOD OXYGEN AND...

FAN

SEMICONDUCTOR DEVICE AND METHOD

Semiconductor Package and Method

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF