CHIEN-CHIH LEE

Person

HSI-CHIH CITY, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,211,836
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics card including multi-chip module
- Patent number 12,199,080
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and semiconductor device including the same
- Patent number 12,193,168
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Motor
- Patent number 12,191,719
- Issue date Jan 7, 2025
- Delta Electronics, Inc.
- Chih-Yu Chien
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Mixed reality production method using inertial measurement data and...
- Patent number 12,189,869
- Issue date Jan 7, 2025
- Institute for Information Industry
- Chi-Hsien Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low Ge isolated epitaxial layer growth over nano-sheet architecture...
- Patent number 12,191,393
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yan-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor lens assembly
- Patent number 12,189,152
- Issue date Jan 7, 2025
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Vacuum wafer chuck for manufacturing semiconductor devices
- Patent number 12,191,185
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Fa Lee
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,183,682
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor lens assembly having non-soldering configuration
- Patent number 12,174,446
- Issue date Dec 24, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Sensor package structure
- Patent number 12,177,996
- Issue date Dec 24, 2024
- Tong Hsing Electronic Industries, Ltd.
- Li-Chun Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic random access memory and manufacturing method thereof
- Patent number 12,178,051
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Hsien Wei
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of using fiber to chip coupler and method of making
- Patent number 12,169,308
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sui-Ying Hsu
- G02 - OPTICS
Information Patent Grant
System and method for ring frame cleaning and inspection
- Patent number 12,165,901
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Fa Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,165,941
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 12,156,479
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Lin Huang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of making photonic device
- Patent number 12,153,255
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Ying Wu
- G02 - OPTICS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage control in the packaging of integrated circuits
- Patent number 12,144,065
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan blade
- Patent number D1050401
- Issue date Nov 5, 2024
- Delta Electronics, Inc.
- Pei-Han Chiu
- D23 - Environmental heating and cooling
Information Patent Grant
Device of handling detection of a PDCCH
- Patent number 12,132,687
- Issue date Oct 29, 2024
- Acer Incorporated
- Chien-Min Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit structure
- Patent number 12,127,489
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-Yen Peng
Information Patent Grant
Fan blade
- Patent number D1047120
- Issue date Oct 15, 2024
- Delta Electronics, Inc.
- Pei-Han Chiu
- D23 - Environmental heating and cooling
Information Patent Grant
Sensor package structure
- Patent number 12,119,363
- Issue date Oct 15, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chien-Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cross-coupling structure for dielectric cavity filters
- Patent number 12,113,262
- Issue date Oct 8, 2024
- Universal Microwave Technology, Inc.
- Tung-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method
- Patent number 12,112,986
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kun-Mu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,114,512
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Min Lee
Information Patent Grant
Sensor package structure
- Patent number 12,113,082
- Issue date Oct 8, 2024
- Tong Hsing Electronic Industries, Ltd.
- Ya-Han Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor lens assembly having non-soldering configuration
- Patent number 12,108,517
- Issue date Oct 1, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MAGNETIC TUNNELING JUNCTION WITH SYNTHETIC FREE LAYER FOR SOT-MRAM
- Publication number 20250040447
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Min Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPELLER AND DIAGONAL FAN INCLUDING THE SAME
- Publication number 20250020138
- Publication date Jan 16, 2025
- Delta Electronics, Inc.
- Sheng-Chieh SU
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH COVER LAYERS
- Publication number 20250006564
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH IMPROVED METAL CAPPING LAYERS
- Publication number 20250006553
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DETACHABLE DEVICE, DETACHABLE DEVICE SET, AND LATCHING STRUCTURE
- Publication number 20240407505
- Publication date Dec 12, 2024
- WISTRON NEWEB CORPORATION
- Jing Wen CHEN
- A44 - HABERDASHERY JEWELLERY
Information Patent Application
Multi-Die Package Structures Including Redistribution Layers
- Publication number 20240404992
- Publication date Dec 5, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAGONAL FAN
- Publication number 20240392807
- Publication date Nov 28, 2024
- Delta Electronics, Inc.
- Pei-Han Chiu
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
FinFET Device and Method
- Publication number 20240395625
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kun-Mu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE
- Publication number 20240395639
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAGONAL FAN
- Publication number 20240392808
- Publication date Nov 28, 2024
- Delta Electronics, Inc.
- Pei-Han Chiu
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240387731
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240389472
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Lin Huang
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387457
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACE TRAP CHARGE DENSITY REDUCTION
- Publication number 20240387274
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Chi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20240387245
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER HAVING FIRST AND SECOND REDISTRIBUTION LAYERS AND METHOD...
- Publication number 20240387386
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...
- Publication number 20240387618
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-DIZZINESS DISPLAY METHOD, PROCESSING DEVICE, AND INFORMATION D...
- Publication number 20240379075
- Publication date Nov 14, 2024
- Industrial Technology Research Institute
- Hong-Ming Dai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Device and Manufacturing Method of Semiconductor Device
- Publication number 20240381788
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Min Lee
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20240379535
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDING COMPUTING DISPLAYS
- Publication number 20240370052
- Publication date Nov 7, 2024
- Hewlett-Packard Development Company, L.P.
- Chien-Kuo Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE MODULE INCLUDING A RECESSED UPPER SURFACE AND METHODS OF FO...
- Publication number 20240371774
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240373651
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Min Lee
Information Patent Application
INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...
- Publication number 20240363559
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIBER TO CHIP COUPLER AND METHOD OF MAKING THE SAME
- Publication number 20240361532
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hao HUANG
- G02 - OPTICS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING EMBEDDED INTEGRATED PA...
- Publication number 20240363682
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS MANAGEMENT SYSTEM AND PROCESS MANAGEMENT METHOD
- Publication number 20240353819
- Publication date Oct 24, 2024
- Industrial Technology Research Institute
- Po-Hsun WU
- G05 - CONTROLLING REGULATING
Information Patent Application
PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...
- Publication number 20240321759
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL WITH A BUFFER LAYER AND ITS FABRICATION PROCESS
- Publication number 20240324244
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsann Lin
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION C...
- Publication number 20240321654
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS

CHIEN-CHIH LEE

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Multi-die package structures including redistribution layers

Electronics card including multi-chip module

Circuit board and semiconductor device including the same

Motor

Mixed reality production method using inertial measurement data and...

Low Ge isolated epitaxial layer growth over nano-sheet architecture...

Sensor lens assembly

Vacuum wafer chuck for manufacturing semiconductor devices

Semiconductor package and manufacturing method thereof

Sensor lens assembly having non-soldering configuration

Sensor package structure

Magnetic random access memory and manufacturing method thereof

Method of using fiber to chip coupler and method of making

System and method for ring frame cleaning and inspection

Semiconductor device and method of manufacture

Memory device and manufacturing method thereof

Method of making photonic device

Semiconductor packages and methods of forming same

Warpage control in the packaging of integrated circuits

Fan blade

Device of handling detection of a PDCCH

Integrated circuit structure

Fan blade

Sensor package structure

Cross-coupling structure for dielectric cavity filters

FinFET device and method

Semiconductor device and manufacturing method thereof

Sensor package structure

Sensor lens assembly having non-soldering configuration

Patents Applicationslast 30 patents

MAGNETIC TUNNELING JUNCTION WITH SYNTHETIC FREE LAYER FOR SOT-MRAM

IMPELLER AND DIAGONAL FAN INCLUDING THE SAME

SEMICONDUCTOR STRUCTURES WITH COVER LAYERS

SEMICONDUCTOR STRUCTURES WITH IMPROVED METAL CAPPING LAYERS

DETACHABLE DEVICE, DETACHABLE DEVICE SET, AND LATCHING STRUCTURE

Multi-Die Package Structures Including Redistribution Layers

DIAGONAL FAN

FinFET Device and Method

SEMICONDUCTOR PACKAGE INCLUDING TEST LINE STRUCTURE

DIAGONAL FAN

SEMICONDUCTOR DEVICE AND METHOD

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

INTERFACE TRAP CHARGE DENSITY REDUCTION

Semiconductor Package and Method

INTERPOSER HAVING FIRST AND SECOND REDISTRIBUTION LAYERS AND METHOD...

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SUBSTRATE-EMBEDDED INT...

ANTI-DIZZINESS DISPLAY METHOD, PROCESSING DEVICE, AND INFORMATION D...

Semiconductor Device and Manufacturing Method of Semiconductor Device

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

FOLDING COMPUTING DISPLAYS

PACKAGE MODULE INCLUDING A RECESSED UPPER SURFACE AND METHODS OF FO...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...

FIBER TO CHIP COUPLER AND METHOD OF MAKING THE SAME

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING EMBEDDED INTEGRATED PA...

PROCESS MANAGEMENT SYSTEM AND PROCESS MANAGEMENT METHOD

PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBS...

MEMORY CELL WITH A BUFFER LAYER AND ITS FABRICATION PROCESS

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION C...