Chien Ling Hwang

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Coreset configurations
- Patent number 12,317,287
- Issue date May 27, 2025
- Mediatek Inc.
- Yiju Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Aligning bumps in fan-out packaging process
- Patent number 12,300,659
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,300,571
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,176,279
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Yueh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 12,062,832
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-stage physical sidelink control channel (PSCCH) for sidelink co...
- Patent number 12,047,312
- Issue date Jul 23, 2024
- MediaTek Singapore Pte Ltd.
- Tao Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Package system and manufacturing method thereof
- Patent number 12,040,247
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,040,255
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,027,494
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages having support rings
- Patent number 11,990,381
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic carrier for high aspect ratio fanout
- Patent number 11,955,349
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PDCCH DMRS mapping and coreset resource allocation
- Patent number 11,902,063
- Issue date Feb 13, 2024
- Mediatek Inc.
- Yiju Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Physical downlink control channel design for NR systems
- Patent number 11,895,510
- Issue date Feb 6, 2024
- Chien-Hwa Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,764,127
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,756,872
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Yueh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,749,582
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Blind detection and CCE allocation for carrier aggregation
- Patent number 11,743,867
- Issue date Aug 29, 2023
- Mediatek Inc.
- Lung-Sheng Tsai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and system for thinning wafer thereof
- Patent number 11,721,555
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Ling Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Detection of beginning of a transmission session in new radio unlic...
- Patent number 11,672,012
- Issue date Jun 6, 2023
- Mediatek Inc.
- Jiann-Ching Guey
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for allocating wireless resources based on sensitivity to in...
- Patent number 11,658,760
- Issue date May 23, 2023
- HON LIN TECHNOLOGY CO., LTD.
- Chia-Jung Fan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Adaptation framework for UE power saving
- Patent number 11,659,430
- Issue date May 23, 2023
- Mediatek Inc.
- Chien-Hwa Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and apparatus for bonding semiconductor substrate
- Patent number 11,631,652
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Physical downlink control channel design for NR systems
- Patent number 11,622,284
- Issue date Apr 4, 2023
- Mediatek Inc.
- Chien-Hwa Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
On PDCCH DMRS mapping and coreset resource allocation
- Patent number 11,611,461
- Issue date Mar 21, 2023
- Mediatek Inc.
- Yiju Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of forming integrated circuit packages with mechanical braces
- Patent number 11,538,735
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with chamfered semiconductor device
- Patent number 11,532,551
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for selecting beamforming technique in multi-c...
- Patent number 11,522,593
- Issue date Dec 6, 2022
- HON LIN TECHNOLOGY CO., LTD.
- Chia-Jung Fan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit package and method
- Patent number 11,502,013
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,444,002
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for allocating wireless resources based on sensitivity to in...
- Patent number 11,438,085
- Issue date Sep 6, 2022
- HON LIN TECHNOLOGY CO., LTD.
- Chia-Jung Fan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087571
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Yueh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND METHOD
- Publication number 20250054798
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING APPARATUS AND DEVICE FORMED BY MOLDING APPARATUS
- Publication number 20250052965
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Ling Hwang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
APPARATUS AND METHOD FOR SUBSTRATE HANDLING
- Publication number 20240379404
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240371726
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240356199
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMIT COVARIANCE MATRIX FEEDBACK FOR MIMO CHANNEL STATE INFORMATION
- Publication number 20240340655
- Publication date Oct 10, 2024
- MEDIATEK INC.
- TSUNG-WEI CHIANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240332132
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20240312859
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATION APPARATUS AND METHOD
- Publication number 20240262096
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ting Chiu
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDCUTOR PACKAGES AND METHODS OF FORMING THEREOF
- Publication number 20230387039
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Yueh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230386974
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230378040
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Yueh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230268316
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Yueh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN OF CORESET CONFIGURATIONS
- Publication number 20230247641
- Publication date Aug 3, 2023
- MEDIATEK INC.
- Yiju Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD AND APPARATUS FOR BONDING SEMICONDUCTOR SUBSTRATE
- Publication number 20230215837
- Publication date Jul 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Jui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL DOWNLINK CONTROL CHANNEL DESIGN FOR NR SYSTEMS
- Publication number 20230209366
- Publication date Jun 29, 2023
- MEDIATEK INC.
- Chien-Hwa Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD AND APPARATUS FOR INCREASING TRANSMIT POWER IN A SUB-TERAHER...
- Publication number 20230180149
- Publication date Jun 8, 2023
- MEDIATEK INC.
- Chien-Hwa Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD AND APPARATUS FOR HYBRID BEAMFORMING WITH AUTONOMOUS BEAMFOR...
- Publication number 20230170959
- Publication date Jun 1, 2023
- MEDIATEK INC.
- Chien-Hwa Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
NETWORK DEVICE AND METHOD FOR BEAM ALIGNMENT
- Publication number 20230171612
- Publication date Jun 1, 2023
- MEDIATEK INC.
- Chien-Hwa Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD AND APPARATUS FOR JOINT COMMUNICATION AND SENSING IN A MOBIL...
- Publication number 20230171128
- Publication date Jun 1, 2023
- MEDIATEK INC.
- Chien-Hwa Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD AND BASE STATION FOR BEAM ALIGNMENT
- Publication number 20230170960
- Publication date Jun 1, 2023
- MEDIATEX INC.
- Chien-Hwa Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Integrated Circuit Packages Having Support Rings
- Publication number 20230103560
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20220367310
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220359343
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220359468
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20220359344
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Rong Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ALLOCATING WIRELESS RESOURCES BASED ON SENSITIVITY TO IN...
- Publication number 20220337332
- Publication date Oct 20, 2022
- HON LIN TECHNOLOGY CO., LTD.
- CHIA-JUNG FAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Anisotropic Carrier for High Aspect Ratio Fanout
- Publication number 20220328327
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR SUBSTRATE HANDLING
- Publication number 20220319903
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS

Chien Ling Hwang

Person

Patents Grantslast 30 patents

Coreset configurations

Aligning bumps in fan-out packaging process

Integrated circuit package and method

Package structure and manufacturing method thereof

Electronic device and manufacturing method thereof

Two-stage physical sidelink control channel (PSCCH) for sidelink co...

Package system and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Integrated circuit packages having support rings

Anisotropic carrier for high aspect ratio fanout

PDCCH DMRS mapping and coreset resource allocation

Physical downlink control channel design for NR systems

Semiconductor package and manufacturing method thereof

Package structure and manufacturing method thereof

Package structure

Blind detection and CCE allocation for carrier aggregation

Method and system for thinning wafer thereof

Detection of beginning of a transmission session in new radio unlic...

Method for allocating wireless resources based on sensitivity to in...

Adaptation framework for UE power saving

Method and apparatus for bonding semiconductor substrate

Physical downlink control channel design for NR systems

On PDCCH DMRS mapping and coreset resource allocation

Method of forming integrated circuit packages with mechanical braces

Semiconductor package with chamfered semiconductor device

Method and apparatus for selecting beamforming technique in multi-c...

Integrated circuit package and method

Package structure

Method for allocating wireless resources based on sensitivity to in...

Patents Applicationslast 30 patents

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

BONDING SYSTEM AND METHOD

MOLDING APPARATUS AND DEVICE FORMED BY MOLDING APPARATUS

APPARATUS AND METHOD FOR SUBSTRATE HANDLING

Integrated Circuit Package and Method

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

TRANSMIT COVARIANCE MATRIX FEEDBACK FOR MIMO CHANNEL STATE INFORMATION

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE SYSTEM AND MANUFACTURING METHOD THEREOF

LAMINATION APPARATUS AND METHOD

SEMICONDCUTOR PACKAGES AND METHODS OF FORMING THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

DESIGN OF CORESET CONFIGURATIONS

METHOD AND APPARATUS FOR BONDING SEMICONDUCTOR SUBSTRATE

PHYSICAL DOWNLINK CONTROL CHANNEL DESIGN FOR NR SYSTEMS

METHOD AND APPARATUS FOR INCREASING TRANSMIT POWER IN A SUB-TERAHER...

METHOD AND APPARATUS FOR HYBRID BEAMFORMING WITH AUTONOMOUS BEAMFOR...

NETWORK DEVICE AND METHOD FOR BEAM ALIGNMENT

METHOD AND APPARATUS FOR JOINT COMMUNICATION AND SENSING IN A MOBIL...

METHOD AND BASE STATION FOR BEAM ALIGNMENT

Integrated Circuit Packages Having Support Rings

PACKAGE SYSTEM AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Integrated Circuit Package and Method

METHOD FOR ALLOCATING WIRELESS RESOURCES BASED ON SENSITIVITY TO IN...

Anisotropic Carrier for High Aspect Ratio Fanout

APPARATUS AND METHOD FOR SUBSTRATE HANDLING