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Chien-Te FENG
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Frisco, TX, US
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last 30 patents
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Patent Grant
Package comprising an integrated device with a back side metal layer
Patent number
12,100,649
Issue date
Sep 24, 2024
QUALCOMM Incorporated
Chien-Te Feng
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
ANTENNA MODULE HAVING ANTENNA IN MOLD LAYER, AND RELATED FABRICATIO...
Publication number
20240396227
Publication date
Nov 28, 2024
QUALCOMM Incorporated
Chien-Te Feng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING AN INTEGRATED DEVICE WITH A BACK SIDE METAL LAYER
Publication number
20230091182
Publication date
Mar 23, 2023
QUALCOMM Incorporated
Chien-Te FENG
H01 - BASIC ELECTRIC ELEMENTS