Chien Te Feng

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Exposed die package for direct surface mounting
- Patent number 8,470,644
- Issue date Jun 25, 2013
- Texas Instruments Incorporated
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having die bonded to the polymer side of...
- Patent number 8,456,021
- Issue date Jun 4, 2013
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed die package for direct surface mounting
- Patent number 8,304,871
- Issue date Nov 6, 2012
- Texas Instruments Incorporated
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package assembly with deflection-resistant leadf...
- Patent number 8,274,140
- Issue date Sep 25, 2012
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Delamination resistant packaged die having support and shaped die h...
- Patent number 8,058,706
- Issue date Nov 15, 2011
- Texas Instruments Incorporated
- Chien-Te Feng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Mold lock on heat spreader
- Patent number 8,039,955
- Issue date Oct 18, 2011
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package assembly method and apparatus for counte...
- Patent number 8,008,131
- Issue date Aug 30, 2011
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package assembly with deflection- resistant lead...
- Patent number 7,928,544
- Issue date Apr 19, 2011
- Texas Instruments Incorporated
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Exposed Die Package for Direct Surface Mounting
- Publication number 20130034937
- Publication date Feb 7, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Frank Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Assemblying a Semiconductor Chip Package with Deflection...
- Publication number 20120276692
- Publication date Nov 1, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED DIE PACKAGE FOR DIRECT SURFACE MOUNTING
- Publication number 20120256306
- Publication date Oct 11, 2012
- TEXAS INSTRUMENTS INCORPORATED
- FRANK YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...
- Publication number 20120126418
- Publication date May 24, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package Assembly with Deflection-Resistant Leadf...
- Publication number 20110163429
- Publication date Jul 7, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION RESISTANT PACKAGED DIE HAVING SUPPORT AND SHAPED DIE H...
- Publication number 20110057296
- Publication date Mar 10, 2011
- TEXAS INSTRUMENTS INCORPORATED
- CHIEN-TE FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CONDUCTIVE PLUG TO REPLACE SOLDER BALL
- Publication number 20100295168
- Publication date Nov 25, 2010
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD LOCK ON HEAT SPREADER
- Publication number 20100283142
- Publication date Nov 11, 2010
- Chien-Te FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package Assembly with Deflection- Resistant Lead...
- Publication number 20090283880
- Publication date Nov 19, 2009
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package Assembly Method and Apparatus for Counte...
- Publication number 20090243057
- Publication date Oct 1, 2009
- Chien-Te Feng
- H01 - BASIC ELECTRIC ELEMENTS

Chien Te Feng

Person

Patents Grantslast 30 patents

Exposed die package for direct surface mounting

Integrated circuit device having die bonded to the polymer side of...

Exposed die package for direct surface mounting

Semiconductor chip package assembly with deflection-resistant leadf...

Delamination resistant packaged die having support and shaped die h...

Mold lock on heat spreader

Semiconductor chip package assembly method and apparatus for counte...

Semiconductor chip package assembly with deflection- resistant lead...

Patents Applicationslast 30 patents

Exposed Die Package for Direct Surface Mounting

Method for Assemblying a Semiconductor Chip Package with Deflection...

EXPOSED DIE PACKAGE FOR DIRECT SURFACE MOUNTING

INTEGRATED CIRCUIT DEVICE HAVING DIE BONDED TO THE POLYMER SIDE OF...

Semiconductor Chip Package Assembly with Deflection-Resistant Leadf...

DELAMINATION RESISTANT PACKAGED DIE HAVING SUPPORT AND SHAPED DIE H...

SEMICONDUCTOR PACKAGE USING CONDUCTIVE PLUG TO REPLACE SOLDER BALL

MOLD LOCK ON HEAT SPREADER

Semiconductor Chip Package Assembly with Deflection- Resistant Lead...

Semiconductor Chip Package Assembly Method and Apparatus for Counte...