Chien-Wei CHANG

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,040,312
- Issue date Jul 16, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,424,212
- Issue date Aug 23, 2022
- Advanced Semiconductor Engineering, Inc.
- Chien-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device assembly structure and method of manufacturing the same
- Patent number 11,189,604
- Issue date Nov 30, 2021
- Advanced Semiconductor Engineering, Inc.
- Chao-Kai Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220399301
- Publication date Dec 15, 2022
- Advanced Semiconductor Engineering, Inc.
- Chien-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE ASSEMBLY STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210111165
- Publication date Apr 15, 2021
- Advanced Semiconductor Engineering, Inc.
- Chao-Kai HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210020597
- Publication date Jan 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Chien-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS