TREA

CHIENCHIH CHIU

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  • TAIPEI CITY, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Insert molded hinge
    • Patent number 10,768,672
    • Issue date Sep 8, 2020
    • Hewlett-Packard Development Company, L.P.
    • Yu-Chen So
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Casings of electronic devices
    • Patent number 10,588,225
    • Issue date Mar 10, 2020
    • Hewlett-Packard Development Compnay, L.P.
    • Arthur Lin
    • B32 - LAYERED PRODUCTS
  • Information Patent Grant

    Multilayer structures for electronic device housings
    • Patent number 10,543,657
    • Issue date Jan 28, 2020
    • Hewlett-Packard Development Company, L.P.
    • Hsiu-Pen Lin
    • G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

  • Information Patent Application

    Water-Based Anti-Corrosion Cutting Fluid for Electronic Device Hous...
    • Publication number 20220119971
    • Publication date Apr 21, 2022
    • Hewlett-Packard Development Company, L.P.
    • Kuan-Ting Wu
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    INSERT MOLDED HINGE
    • Publication number 20190064887
    • Publication date Feb 28, 2019
    • Hewlett-Packard Development Company, L.P.
    • Yu-Chen SO
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    CASINGS OF ELECTRONIC DEVICES
    • Publication number 20190053390
    • Publication date Feb 14, 2019
    • Hewlett-Packard Development Company, L.P.
    • Arthur LIN
    • G05 - CONTROLLING REGULATING
  • Information Patent Application

    MULTILAYER STRUCTURES FOR ELECTRONIC DEVICE HOUSINGS
    • Publication number 20190016082
    • Publication date Jan 17, 2019
    • Hewlett-Packard Development Company, L.P.
    • HSIU-PEN LIN
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    MOLDING COMPONENTS
    • Publication number 20180264694
    • Publication date Sep 20, 2018
    • Hewlett-Packard Development Company, L.P.
    • WEI-FENG YEN
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    CARBON FIBER COMPOSITE
    • Publication number 20180257275
    • Publication date Sep 13, 2018
    • Hewlett-Packard Development Company, L.P.
    • CHIENCHIH CHIU
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL