Chih-Chiang He

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating electronic package with conductive pillars
- Patent number 10,916,526
- Issue date Feb 9, 2021
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with conductive pillars
- Patent number 10,643,974
- Issue date May 5, 2020
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226326
- Publication date Jul 10, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321769
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145403
- Publication date May 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240047374
- Publication date Feb 8, 2024
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC STRUCTURE WITH CONDUCTIVE ELEMENT...
- Publication number 20210351097
- Publication date Nov 11, 2021
- Siliconware Precision Industries Co., Ltd.
- Chih-Chiang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210005524
- Publication date Jan 7, 2021
- Siliconware Precision Industries Co., Ltd.
- Chih-Chiang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200251395
- Publication date Aug 6, 2020
- Siliconware Precision Industries Co., Ltd.
- Chih-Chiang He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE WITH CONDUCTIVE PILLARS
- Publication number 20200227390
- Publication date Jul 16, 2020
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180342484
- Publication date Nov 29, 2018
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Chih-Chiang He

Person

Patents Grantslast 30 patents

Method for fabricating electronic package with conductive pillars

Electronic package with conductive pillars

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR FABRICATING ELECTRONIC STRUCTURE WITH CONDUCTIVE ELEMENT...

ELECTRONIC STRUCTURE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR FABRICATING ELECTRONIC PACKAGE WITH CONDUCTIVE PILLARS

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME