Chih-Chung Lilang

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Jiangsu, CN

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGING-BEFORE-ETCHING FLIP CHIP 3D SYSTEM-LEVEL METAL CIRCUIT BO...
- Publication number 20160163622
- Publication date Jun 9, 2016
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD
- Steve Xin Liang
- H01 - BASIC ELECTRIC ELEMENTS