CHIH-HANG TUNG

Person

HSINCHU, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor device and method of forming thereof
- Patent number 12,218,089
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package
- Patent number 12,132,074
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 12,125,794
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor component with a cooling structure
- Patent number 12,027,446
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, stacked semiconductor device and manufacturin...
- Patent number 12,002,761
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device including liquid-cooled lid and metho...
- Patent number 11,996,351
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Tsung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices and methods of forming the same
- Patent number 11,996,383
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including thermal interface structures and me...
- Patent number 11,955,405
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method of package components and bonding apparatus
- Patent number 11,955,378
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,901,263
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 11,688,685
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package
- Patent number 11,670,670
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,631,629
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and method of forming thereof
- Patent number 11,581,281
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor package with composite thermal inte...
- Patent number 11,569,147
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with cooling structure
- Patent number 11,515,233
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, stacked semiconductor device and manufacturin...
- Patent number 11,456,256
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method of package components and bonding apparatus
- Patent number 11,443,981
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device including liquid-cooled lid and metho...
- Patent number 11,410,910
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Tsung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,387,164
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and bump formation process
- Patent number 11,348,889
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,342,242
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding with pre-deoxide process and apparatus for performing the same
- Patent number 11,342,302
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,342,309
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded semiconductor devices and methods of forming the same
- Patent number 11,315,900
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device with integrated antenna and manufactur...
- Patent number 11,295,979
- Issue date Apr 5, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing interconnect structure
- Patent number 11,121,104
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with composite thermal interface material str...
- Patent number 11,107,747
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 11,101,195
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and method for forming the same
- Patent number 11,056,459
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240379569
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20240371916
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING COOLING STRUCTURE
- Publication number 20240312872
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Device Including Liquid-Cooled Lid and Metho...
- Publication number 20240249999
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Tsung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240145316
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Jung WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240136251
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING...
- Publication number 20240096825
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method
- Publication number 20240038718
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jeng-Nan Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling Cover and Packaged Semiconductor Device Including the Same
- Publication number 20230420337
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND FORMATION METHOD...
- Publication number 20230369156
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices and Methods of Forming the Same
- Publication number 20230361068
- Publication date Nov 9, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Sey-Ping Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND MANUFACTURING MET...
- Publication number 20230360993
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan-Out Package with 3D Magnetic Core Inductor
- Publication number 20230298993
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20230261037
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223318
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230207473
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Device and Method of Forming Thereof
- Publication number 20230170320
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR COMPONENT WITH A COOLING STRUCTURE
- Publication number 20230076466
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING THERMAL INTERFACE STRUCTURES AND ME...
- Publication number 20230007912
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Jen Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, STACKED SEMICONDUCTOR DEVICE AND MANUFACTURIN...
- Publication number 20220384352
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD OF PACKAGE COMPONENTS AND BONDING APPARATUS
- Publication number 20220367255
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Device Including Liquid-Cooled Lid and Metho...
- Publication number 20220310482
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Tsung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20220285323
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
- Publication number 20220285310
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220262705
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded Semiconductor Devices and Methods of Forming The Same
- Publication number 20220246574
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Device Including Liquid-Cooled Lid and Metho...
- Publication number 20220037231
- Publication date Feb 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Tsung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Device and Method of Forming Thereof
- Publication number 20210407942
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR PACKAGE WITH COMPOSITE THERMAL INTE...
- Publication number 20210384103
- Publication date Dec 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang SHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTR DEVICE, STACKED SEMICONDUCTOR DEVICE AND MANUFACTURING...
- Publication number 20210375766
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hang TUNG
- H01 - BASIC ELECTRIC ELEMENTS

CHIH-HANG TUNG

Person

Patents Grantslast 30 patents

Packaged semiconductor device and method of forming thereof

Package

Semiconductor device and manufacturing method of semiconductor device

Method for forming a semiconductor component with a cooling structure

Semiconductor device, stacked semiconductor device and manufacturin...

Packaged semiconductor device including liquid-cooled lid and metho...

Bonded semiconductor devices and methods of forming the same

Semiconductor package including thermal interface structures and me...

Bonding method of package components and bonding apparatus

Semiconductor device and manufacturing method thereof

Integrated fan-out package with 3D magnetic core inductor

Manufacturing method of package

Semiconductor device and manufacturing method thereof

Packaged semiconductor device and method of forming thereof

Method of forming semiconductor package with composite thermal inte...

Semiconductor component with cooling structure

Semiconductor device, stacked semiconductor device and manufacturin...

Bonding method of package components and bonding apparatus

Packaged semiconductor device including liquid-cooled lid and metho...

Semiconductor device and manufacturing method thereof

Semiconductor device and bump formation process

Semiconductor device and manufacturing method thereof

Bonding with pre-deoxide process and apparatus for performing the same

Semiconductor packages and methods of forming same

Bonded semiconductor devices and methods of forming the same

Semiconductor package device with integrated antenna and manufactur...

Method for manufacturing interconnect structure

Semiconductor package with composite thermal interface material str...

Package structure and method for forming the same

Chip package structure and method for forming the same

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PACKAGE

APPARATUS INCLUDING COOLING STRUCTURE

Packaged Semiconductor Device Including Liquid-Cooled Lid and Metho...

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

BOND HEAD WITH ELASTIC MATERIAL AROUND PERIMETER TO IMPROVE BONDING...

Semiconductor Package and Method

Cooling Cover and Packaged Semiconductor Device Including the Same

DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND FORMATION METHOD...

Packaged Semiconductor Devices and Methods of Forming the Same

DIE STACKING STRUCTURE, SEMICONDUCTOR PACKAGE AND MANUFACTURING MET...

Integrated Fan-Out Package with 3D Magnetic Core Inductor

PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Packaged Semiconductor Device and Method of Forming Thereof

METHOD FOR FORMING A SEMICONDUCTOR COMPONENT WITH A COOLING STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING THERMAL INTERFACE STRUCTURES AND ME...

SEMICONDUCTOR DEVICE, STACKED SEMICONDUCTOR DEVICE AND MANUFACTURIN...

BONDING METHOD OF PACKAGE COMPONENTS AND BONDING APPARATUS

Packaged Semiconductor Device Including Liquid-Cooled Lid and Metho...

Semiconductor Packages and Methods of Forming Same

Bonding with Pre-Deoxide Process and Apparatus for Performing the Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Bonded Semiconductor Devices and Methods of Forming The Same

Packaged Semiconductor Device Including Liquid-Cooled Lid and Metho...

Packaged Semiconductor Device and Method of Forming Thereof

METHOD OF FORMING SEMICONDUCTOR PACKAGE WITH COMPOSITE THERMAL INTE...

SEMICONDUCTR DEVICE, STACKED SEMICONDUCTOR DEVICE AND MANUFACTURING...