Chih-Hsiang Hsu

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Pingtung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing an under-bump metallurgy layer
- Patent number 6,716,736
- Issue date Apr 6, 2004
- Advanced Semiconductor Engineering, Inc.
- Shih-Kuang Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Under bump structure and process for producing the same
- Publication number 20030141591
- Publication date Jul 31, 2003
- Chih-Hsiang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing an under-bump metallurgy layer
- Publication number 20030104683
- Publication date Jun 5, 2003
- Shih-Kuang Chen
- H01 - BASIC ELECTRIC ELEMENTS