Chih-Hsien Ni

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Double-patterning method to improve sidewall uniformity
- Patent number 12,106,964
- Issue date Oct 1, 2024
- Winbond Electronics Corp.
- Chu-Chun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 12,087,619
- Issue date Sep 10, 2024
- Winbond Electronics Corp.
- Chi-Ching Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and the forming method thereof
- Patent number 11,839,075
- Issue date Dec 5, 2023
- Winbond Electronics Corp.
- Chih-Jung Ni
- G11 - INFORMATION STORAGE
Information Patent Grant
Optoelectronic element having reflective layer in contact with tran...
- Patent number 11,482,651
- Issue date Oct 25, 2022
- Epistar Corporation
- Cheng-Nan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and the forming method thereof
- Patent number 11,302,705
- Issue date Apr 12, 2022
- Winbond Electronics Corp.
- Chih-Jung Ni
- G11 - INFORMATION STORAGE
Information Patent Grant
Optoelectronic element
- Patent number 10,686,106
- Issue date Jun 16, 2020
- Epistar Corporation
- Cheng-Nan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic element
- Patent number 10,529,898
- Issue date Jan 7, 2020
- Epistar Corporation
- Cheng-Nan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device with metallized mounting support structure
- Patent number 10,217,904
- Issue date Feb 26, 2019
- Epistar Corporation
- Hung-Hsuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and method for manufacturing the same
- Patent number 9,929,207
- Issue date Mar 27, 2018
- Epistar Corporation
- Rong-Ren Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic element
- Patent number 9,893,244
- Issue date Feb 13, 2018
- Epistar Corporation
- Cheng-Nan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic element
- Patent number 9,741,905
- Issue date Aug 22, 2017
- Epistar Corporation
- Cheng-Nan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and method for manufacturing the same
- Patent number 9,312,303
- Issue date Apr 12, 2016
- Epistar Corporation
- Rong-Ren Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for making the same
- Patent number 9,159,660
- Issue date Oct 13, 2015
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic element and manufacturing method thereof
- Patent number 9,142,740
- Issue date Sep 22, 2015
- Epistar Corporation
- Cheng-Nan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic element and manufacturing method thereof
- Patent number 9,000,461
- Issue date Apr 7, 2015
- Epistar Corporation
- Cheng-Nan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and lead frame thereof
- Patent number 8,704,345
- Issue date Apr 22, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for making the same
- Patent number 8,658,466
- Issue date Feb 25, 2014
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 8,581,384
- Issue date Nov 12, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating shallow trench isolation structures
- Patent number 8,133,796
- Issue date Mar 13, 2012
- Winbond Electronics Corp.
- Chih-Jung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bonding pad opening
- Patent number 7,585,754
- Issue date Sep 8, 2009
- Winbond Electronics Corp.
- Wen-Shun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash memory cell and fabrication thereof
- Patent number 6,906,377
- Issue date Jun 14, 2005
- Winbond Electronics Corp.
- Chih-Jung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of spiking mixed acid liquid in reactor
- Patent number 6,852,641
- Issue date Feb 8, 2005
- Winbond Electronics Corp.
- Chih-Jung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing Si-needles of wafer
- Patent number 6,780,780
- Issue date Aug 24, 2004
- Winbond Electronics Corp.
- Chih-Jung Ni
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLASH MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230413546
- Publication date Dec 21, 2023
- WINBOND ELECTRONICS CORP.
- Chih-Jung NI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230129196
- Publication date Apr 27, 2023
- WINBOND ELECTRONICS CORP.
- Chi-Ching Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND THE FORMING METHOD THEREOF
- Publication number 20220189975
- Publication date Jun 16, 2022
- WINBOND ELECTRONICS CORP.
- Chih-Jung NI
- G11 - INFORMATION STORAGE
Information Patent Application
PATTERNING METHOD
- Publication number 20210391174
- Publication date Dec 16, 2021
- WINBOND ELECTRONICS CORP.
- Chu-Chun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20210287934
- Publication date Sep 16, 2021
- WINBOND ELECTRONICS CORP.
- Chi-Ching Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC ELEMENT
- Publication number 20200313051
- Publication date Oct 1, 2020
- EPISTAR CORPORATION
- Cheng-Nan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND THE FORMING METHOD THEREOF
- Publication number 20200152647
- Publication date May 14, 2020
- WINBOND ELECTRONICS CORP.
- Chih-Jung NI
- G11 - INFORMATION STORAGE
Information Patent Application
OPTOELECTRONIC ELEMENT
- Publication number 20180254391
- Publication date Sep 6, 2018
- EPISTAR CORPORATION
- Cheng-Nan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC ELEMENT
- Publication number 20180019382
- Publication date Jan 18, 2018
- EPISTAR CORPORATION
- Cheng-Nan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC ELEMENT
- Publication number 20170365750
- Publication date Dec 21, 2017
- EPISTAR CORPORATION
- Cheng-Nan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-emitting device
- Publication number 20160225955
- Publication date Aug 4, 2016
- EPISTAR CORPORATION
- Hung-Hsuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160190205
- Publication date Jun 30, 2016
- EPISTAR CORPORATION
- Rong-Ren LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC ELEMENT
- Publication number 20160013371
- Publication date Jan 14, 2016
- EPISTAR CORPORATION
- Cheng-Nan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC ELEMENT
- Publication number 20150214449
- Publication date Jul 30, 2015
- EPISTAR CORPORATION
- Cheng-Nan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140193932
- Publication date Jul 10, 2014
- EPISTAR CORPORATION
- Rong-Ren LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20140027905
- Publication date Jan 30, 2014
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND LEAD FRAME THEREOF
- Publication number 20130334671
- Publication date Dec 19, 2013
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130334551
- Publication date Dec 19, 2013
- EPISTAR CORPORATION
- Rong-Ren LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20130334681
- Publication date Dec 19, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC ELEMENT AND MANUFACTURING METHOD THEREOF
- Publication number 20130313594
- Publication date Nov 28, 2013
- EPISTAR CORPORATION
- Cheng-Nan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20130249070
- Publication date Sep 26, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC ELEMENT AND MANUFACTURING METHOD THEREOF
- Publication number 20110291145
- Publication date Dec 1, 2011
- EPISTAR CORPORATION
- Cheng-Nan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING BONDING PAD OPENING
- Publication number 20090181542
- Publication date Jul 16, 2009
- WINBOND ELECTRONICS CORP.
- Wen-Shun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING GATE DIELECTRIC LAYER
- Publication number 20080160768
- Publication date Jul 3, 2008
- WINBOND ELECTRONICS CORP.
- Chih-Jung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLASH MEMORY CELL AND FABRICATION THEREOF
- Publication number 20040191992
- Publication date Sep 30, 2004
- Chih-Jung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for removing Si-needles of wafer
- Publication number 20030170997
- Publication date Sep 11, 2003
- WINBOND ELECTRONICS CORP.
- Chih-Jung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of spiking mixed acid liquid in reactor
- Publication number 20030143860
- Publication date Jul 31, 2003
- Chih-Jung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clean equipment for removing polymer residues on sidewalls of metal...
- Publication number 20030140948
- Publication date Jul 31, 2003
- Chih-Jung Ni
- B08 - CLEANING

Chih-Hsien Ni

Person

Patents Grantslast 30 patents

Double-patterning method to improve sidewall uniformity

Semiconductor device and method of fabricating the same

Semiconductor structure and the forming method thereof

Optoelectronic element having reflective layer in contact with tran...

Semiconductor structure and the forming method thereof

Optoelectronic element

Optoelectronic element

Light-emitting device with metallized mounting support structure

Light-emitting device and method for manufacturing the same

Optoelectronic element

Optoelectronic element

Light-emitting device and method for manufacturing the same

Semiconductor package structure and method for making the same

Optoelectronic element and manufacturing method thereof

Optoelectronic element and manufacturing method thereof

Semiconductor package and lead frame thereof

Semiconductor package structure and method for making the same

Semiconductor package structure

Method for fabricating shallow trench isolation structures

Method of forming bonding pad opening

Flash memory cell and fabrication thereof

Method of spiking mixed acid liquid in reactor

Method for removing Si-needles of wafer

Patents Applicationslast 30 patents

FLASH MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE AND THE FORMING METHOD THEREOF

PATTERNING METHOD

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

OPTOELECTRONIC ELEMENT

SEMICONDUCTOR STRUCTURE AND THE FORMING METHOD THEREOF

OPTOELECTRONIC ELEMENT

OPTOELECTRONIC ELEMENT

OPTOELECTRONIC ELEMENT

Light-emitting device

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

OPTOELECTRONIC ELEMENT

OPTOELECTRONIC ELEMENT

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR PACKAGE AND LEAD FRAME THEREOF

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME

OPTOELECTRONIC ELEMENT AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE

OPTOELECTRONIC ELEMENT AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING BONDING PAD OPENING

METHOD OF MANUFACTURING GATE DIELECTRIC LAYER

FLASH MEMORY CELL AND FABRICATION THEREOF

Method for removing Si-needles of wafer

Method of spiking mixed acid liquid in reactor

Clean equipment for removing polymer residues on sidewalls of metal...