Chih-Jui Pan

Person

Taoyuan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming package structure and package structure therefrom
- Patent number 12,218,117
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 12,211,818
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 12,170,236
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control method and circuitry of receiver
- Patent number 11,950,016
- Issue date Apr 2, 2024
- Mediatek Inc.
- Chun-Chia Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit package and method
- Patent number 11,942,403
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,901,255
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 11,894,287
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming package structure
- Patent number 11,855,054
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 11,804,468
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,742,323
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method for fabricating the same
- Patent number 11,723,294
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsia-Wei Chen
Information Patent Grant
Method for forming package structure
- Patent number 11,664,286
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 11,626,344
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell and fabricating method of the same
- Patent number 11,600,709
- Issue date Mar 7, 2023
- United Microelectronics Corp.
- Chih-Hao Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,495,526
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,456,287
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,424,174
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell and fabricating method of the same
- Patent number 11,417,742
- Issue date Aug 16, 2022
- United Microelectronics Corp.
- Chih-Hao Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating gate structures
- Patent number 11,374,109
- Issue date Jun 28, 2022
- United Microelectronics Corp.
- Chih-Hao Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical signal processing package structure
- Patent number 11,302,683
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 11,239,136
- Issue date Feb 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,205,612
- Issue date Dec 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a biomedical material by a supercritical fluid
- Patent number 11,191,873
- Issue date Dec 7, 2021
- National Sun Yat-sen University
- Ting-Chang Chang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor packages and method of manufacturing the same
- Patent number 11,121,051
- Issue date Sep 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing defects of electronic components by a supercrit...
- Patent number 11,101,141
- Issue date Aug 24, 2021
- NATIONAL SUN YAT-SEN UNIVERSITY KZ
- Ting-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 11,062,968
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 10,796,976
- Issue date Oct 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 10,580,780
- Issue date Mar 3, 2020
- United Microelectronics Corp.
- Zi-Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printing module, printing method and system of forming a printed st...
- Patent number 10,535,627
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 10,504,824
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240387446
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...
- Publication number 20240371722
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Chien Pan
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282661
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVE...
- Publication number 20240234244
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE
- Publication number 20240105865
- Publication date Mar 28, 2024
- National Tsing-Hua University
- Cheng-Yao LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREFROM
- Publication number 20240079399
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071857
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230378130
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG
- Publication number 20230369283
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE WITH BOTTOM ELECTRODE
- Publication number 20230329128
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsia-Wei CHEN
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230290714
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20230253276
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVE...
- Publication number 20230230898
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20230052821
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming the Same
- Publication number 20220359331
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220359476
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220344304
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL AND FABRICATING METHOD OF THE SAME
- Publication number 20220336606
- Publication date Oct 20, 2022
- UNITED MICROELECTRONICS CORP.
- Chih-Hao Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL AND FABRICATING METHOD OF THE SAME
- Publication number 20220271137
- Publication date Aug 25, 2022
- UNITED MICROELECTRONICS CORP.
- Chih-Hao Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20220231005
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG FOR MANUFACTURING SEMICONDCUTOR PACKAGE AND MANUFACTURING METHO...
- Publication number 20220230985
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVE...
- Publication number 20220139802
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AN ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES C...
- Publication number 20220037229
- Publication date Feb 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20210408373
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsia-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE
- Publication number 20210343611
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL METHOD AND CIRCUITRY OF RECEIVER
- Publication number 20210329191
- Publication date Oct 21, 2021
- MEDIATEK INC.
- Chun-Chia Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20210313304
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20210249343
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING GATE STRUCTURES
- Publication number 20210134979
- Publication date May 6, 2021
- United Microelectronics Corp.
- Chih-Hao Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210118758
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Chih-Jui Pan

Person

Patents Grantslast 30 patents

Method of forming package structure and package structure therefrom

Manufacturing method of semiconductor package using jig

Method for forming package structure

Control method and circuitry of receiver

Integrated circuit package and method

Semiconductor device and method of forming the same

Adhesive and thermal interface material on a plurality of dies cove...

Method of forming package structure

Manufacturing method of semiconductor package using jig

Semiconductor structure and method of forming the same

Memory device and method for fabricating the same

Method for forming package structure

Adhesive and thermal interface material on a plurality of dies cove...

Memory cell and fabricating method of the same

Integrated circuit package and method

Package structure and method of fabricating the same

Semiconductor device and method of forming the same

Memory cell and fabricating method of the same

Method for fabricating gate structures

Optical signal processing package structure

Adhesive and thermal interface material on a plurality of dies cove...

Integrated circuit package and method

Method for processing a biomedical material by a supercritical fluid

Semiconductor packages and method of manufacturing the same

Method for reducing defects of electronic components by a supercrit...

Package structure and method for forming the same

Semiconductor device and method of forming the same

Semiconductor structure and method of forming the same

Printing module, printing method and system of forming a printed st...

Integrated circuit package and method

Patents Applicationslast 30 patents

JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE

THERMAL INTERFACE MATERIAL INCLUDING A MULTI-LAYER STRUCTURE AND ME...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVE...

OPTOELECTRONIC DEVICE

METHOD OF FORMING PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREFROM

SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE USING JIG

MEMORY DEVICE WITH BOTTOM ELECTRODE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR FORMING PACKAGE STRUCTURE

ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVE...

Integrated Circuit Package and Method

Semiconductor Device and Method of Forming the Same

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

MEMORY CELL AND FABRICATING METHOD OF THE SAME

MEMORY CELL AND FABRICATING METHOD OF THE SAME

METHOD OF FORMING PACKAGE STRUCTURE

JIG FOR MANUFACTURING SEMICONDCUTOR PACKAGE AND MANUFACTURING METHO...

ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES COVE...

AN ADHESIVE AND THERMAL INTERFACE MATERIAL ON A PLURALITY OF DIES C...

MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD FOR FORMING PACKAGE STRUCTURE

CONTROL METHOD AND CIRCUITRY OF RECEIVER

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Integrated Circuit Package and Method

METHOD FOR FABRICATING GATE STRUCTURES

SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME