Chih-Kang Han

Person

Hsin-Chu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,990,454
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 11,984,342
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,948,881
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,069,614
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 10,950,478
- Issue date Mar 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 10,867,973
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor structure
- Patent number 10,692,809
- Issue date Jun 23, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 10,529,697
- Issue date Jan 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and method of manufacturing the same
- Patent number 10,290,590
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 10,290,530
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 10,128,182
- Issue date Nov 13, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 9,922,896
- Issue date Mar 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Video generating system with multiple image sensors and related met...
- Patent number 9,456,147
- Issue date Sep 27, 2016
- PixArt Imaging Inc.
- Chih-Kang Han
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Video generating system with multiple image sensors and related met...
- Patent number 9,210,449
- Issue date Dec 8, 2015
- PixArt Imaging Inc.
- Chih-Kang Han
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and semiconductor assembly with lead-free solder
- Patent number 8,952,534
- Issue date Feb 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor assembly with lead-free solder
- Patent number 8,610,270
- Issue date Dec 17, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE MODULE WITH A MODULE STIFFENER AND METHODS OF FORMING THE SAME
- Publication number 20240297087
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Sheng-Kai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240266336
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Info Structure with Copper Pillar Having Reversed Profile
- Publication number 20230335426
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20210335708
- Publication date Oct 28, 2021
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- HSI-KUEI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Info Structure with Copper Pillar Having Reversed Profile
- Publication number 20210202290
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Method of Forming the Same
- Publication number 20210098434
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20200273795
- Publication date Aug 27, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- HSI-KUEI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Info Structure with Copper Pillar Having Reversed Profile
- Publication number 20190267274
- Publication date Aug 29, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190074248
- Publication date Mar 7, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- HSI-KUEI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Method of Forming the Same
- Publication number 20180350784
- Publication date Dec 6, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Info Structure with Copper Pillar Having Reversed Profile
- Publication number 20180174937
- Publication date Jun 21, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180151512
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- SHIN-PUU JENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20180082988
- Publication date Mar 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20180082917
- Publication date Mar 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180076129
- Publication date Mar 15, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- HSI-KUEI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIDEO GENERATING SYSTEM WITH MULTIPLE IMAGE SENSORS AND RELATED MET...
- Publication number 20150237267
- Publication date Aug 20, 2015
- PixArt Imaging Inc.
- Chih-Kang Han
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
VIDEO GENERATING SYSTEM WITH MULTIPLE IMAGE SENSORS AND RELATED MET...
- Publication number 20140192213
- Publication date Jul 10, 2014
- Chih-Kang Han
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH LEAD-FREE SOLDER
- Publication number 20140070409
- Publication date Mar 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH LEAD-FREE SOLDER
- Publication number 20110193219
- Publication date Aug 11, 2011
- TAIWAN SEIMCONDUCTOR MANUFACTURING COMPANY, LTD.
- Yi-Jen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Video-signal receiving apparatus and method
- Publication number 20090167944
- Publication date Jul 2, 2009
- NOVATEK MICROELECTRONICS CORP.
- Ching-Yuan Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Chih-Kang Han

Person

Patents Grantslast 30 patents

Info structure with copper pillar having reversed profile

Package structure and method of forming the same

Info structure with copper pillar having reversed profile

Semiconductor structure

Semiconductor package structure

Info structure with copper pillar having reversed profile

Package structure and method of forming the same

Manufacturing method for semiconductor structure

Package structure and method of forming the same

Stacked semiconductor device and method of manufacturing the same

Info structure with copper pillar having reversed profile

Semiconductor package structure and manufacturing method thereof

Info structure with copper pillar having reversed profile

Video generating system with multiple image sensors and related met...

Video generating system with multiple image sensors and related met...

Semiconductor device and semiconductor assembly with lead-free solder

Semiconductor device and semiconductor assembly with lead-free solder

Patents Applicationslast 30 patents

PACKAGE MODULE WITH A MODULE STIFFENER AND METHODS OF FORMING THE SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Info Structure with Copper Pillar Having Reversed Profile

SEMICONDUCTOR STRUCTURE

Info Structure with Copper Pillar Having Reversed Profile

Package Structure and Method of Forming the Same

SEMICONDUCTOR STRUCTURE

Info Structure with Copper Pillar Having Reversed Profile

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Package Structure and Method of Forming the Same

Info Structure with Copper Pillar Having Reversed Profile

STACKED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

VIDEO GENERATING SYSTEM WITH MULTIPLE IMAGE SENSORS AND RELATED MET...

VIDEO GENERATING SYSTEM WITH MULTIPLE IMAGE SENSORS AND RELATED MET...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH LEAD-FREE SOLDER

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR ASSEMBLY WITH LEAD-FREE SOLDER

Video-signal receiving apparatus and method