Chih-Kung Huang

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Yi-Lan, TW

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Patents Grantslast 30 patents

Information Patent Grant
Tape structure and manufacturing method
- Patent number 6,677,055
- Issue date Jan 13, 2004
- Kingtron Electronics Co., Ltd.
- Chin-Fu Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip scale package of semiconductor
- Patent number 6,392,305
- Issue date May 21, 2002
- Chih-Kung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-chip packaging
- Patent number 6,344,687
- Issue date Feb 5, 2002
- Chih-Kung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package of semiconductor
- Patent number 6,177,719
- Issue date Jan 23, 2001
- Chih-Kung Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD ON CHIP PACKAGE AND LEADFRAME THEREOF
- Publication number 20040207066
- Publication date Oct 21, 2004
- Chung-Liang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE LEADFRAME-BASED PACKAGING STRUCTURE AND MANUFACTURING PROCES...
- Publication number 20040036151
- Publication date Feb 26, 2004
- Chung-Liang Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal stud array packaging
- Publication number 20010001069
- Publication date May 10, 2001
- Chih-Kung Huang
- H01 - BASIC ELECTRIC ELEMENTS