Chih-Ming Chung

Person

Dashe Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
LED light source module
- Patent number 11,686,896
- Issue date Jun 27, 2023
- RADIANT OPTO-ELECTRONICS(SUZHOU) CO., LTD.
- Chih-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED light source module and method for manufacturing the same
- Patent number 10,883,667
- Issue date Jan 5, 2021
- Radiant Opto-Electronics (Suzhou) Co., Ltd.
- Chih-Hsien Chung
- F21 - LIGHTING
Information Patent Grant
Advection fan and an impeller thereof
- Patent number 9,022,751
- Issue date May 5, 2015
- Sunonwealth Electric Machine Industry Co., Ltd.
- Yuan-Jie Zheng
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Advection-type fan and an impeller thereof
- Patent number 8,974,194
- Issue date Mar 10, 2015
- Sunonwealth Electric Machine Industry Co., Ltd.
- Tso-Kuo Yin
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Method for manufacturing semiconductor package
- Patent number 8,889,488
- Issue date Nov 18, 2014
- Advanced Semiconductor Engineering, Inc.
- Shin-Hua Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 8,546,950
- Issue date Oct 1, 2013
- Advanced Semiconductor Engineering Inc.
- Shin-Hua Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating assembly
- Patent number 8,391,009
- Issue date Mar 5, 2013
- Sunonwealth Electric Machine Industry Co., Ltd.
- Alex Horng
- F21 - LIGHTING
Information Patent Grant
Circuit carrier and semiconductor package using the same
- Patent number 8,384,204
- Issue date Feb 26, 2013
- Advanced Semiconductor Engineering, Inc.
- Chien Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lamp
- Patent number 8,292,465
- Issue date Oct 23, 2012
- Sunonwealth Electronic Machine Industry Co., Ltd.
- Alex Horng
- F21 - LIGHTING
Information Patent Grant
Cooling module assembly method
- Patent number 8,279,607
- Issue date Oct 2, 2012
- Sunonwealth Electric Machine Industry Co., Ltd.
- Alex Horng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitter with heat-dissipating module
- Patent number 7,905,633
- Issue date Mar 15, 2011
- Sunonwealth Electronic Machine Industry Co., Ltd.
- Alex Horng
- F21 - LIGHTING
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 7,902,650
- Issue date Mar 8, 2011
- Advanced Semiconductor Engineering, Inc.
- Chia Chien Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked type chip package structure including a chip package and a...
- Patent number 7,834,469
- Issue date Nov 16, 2010
- Advanced Semiconductor Engineering, Inc.
- Yao-Kai Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package substrate
- Patent number 7,565,737
- Issue date Jul 28, 2009
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabricating chip package structure
- Patent number 7,482,200
- Issue date Jan 27, 2009
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package structure
- Patent number 7,375,435
- Issue date May 20, 2008
- Advanced Semiconductor Engineering, Inc.
- Meng-Jen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure, package substrate and manufacturing method...
- Patent number 7,327,018
- Issue date Feb 5, 2008
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package structure
- Patent number 7,262,510
- Issue date Aug 28, 2007
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip package and manufacturing method thereof
- Patent number 7,163,840
- Issue date Jan 16, 2007
- Advanced Semiconductor Engineering, Inc.
- Yu-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package substrate for flip-chip and wire bonding
- Patent number 7,125,745
- Issue date Oct 24, 2006
- Advanced Semiconductor Engineering, Inc.
- Kun-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for flip chip bonding by utilizing an interposer with embedd...
- Patent number 7,098,071
- Issue date Aug 29, 2006
- Advanced Semiconductor Engineering, Inc.
- Ming-Lun Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked flip chip package
- Patent number 6,921,968
- Issue date Jul 26, 2005
- Advance Semiconductor Engineering, Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and manufacturing method thereof
- Patent number 6,673,656
- Issue date Jan 6, 2004
- Advanced Semiconductor Engineering, Inc.
- Chih Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure of BGA semiconductor package
- Patent number 6,201,299
- Issue date Mar 13, 2001
- Advanced Semiconductor Engineering, Inc.
- Su Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale semiconductor package
- Patent number 6,150,730
- Issue date Nov 21, 2000
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LED LIGHT SOURCE MODULE
- Publication number 20230275201
- Publication date Aug 31, 2023
- RADIANT OPTO-ELECTRONICS CORPORATION
- Chih-Hsien CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED light source module
- Publication number 20210088714
- Publication date Mar 25, 2021
- Radiant Opto-Electronics(Suzhou) Co., Ltd.
- Chih-Hsien CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED LIGHT SOURCE MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190128480
- Publication date May 2, 2019
- RADIANT OPTO-ELECTRONICS (SUZHOU) CO., LTD
- Chih-Hsien CHUNG
- F21 - LIGHTING
Information Patent Application
LIGHT BAR STRUCTURE, LIGHT SOURCE MODULE AND LAMP
- Publication number 20150211698
- Publication date Jul 30, 2015
- RADIANT OPTO-ELECTRONICS CORPORATION
- Hsiu-Hung YEH
- G02 - OPTICS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20140011325
- Publication date Jan 9, 2014
- Advanced Semiconductor Engineering, Inc.
- Shin-Hua CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advection Fan and An Impeller Thereof
- Publication number 20130243628
- Publication date Sep 19, 2013
- Sunonwealth Electric Machine Industry Co., Ltd.
- Yuan-Jie Zheng
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Advection-type Fan And An Impeller Thereof
- Publication number 20130149128
- Publication date Jun 13, 2013
- Tso-Kuo Yin
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
LAMP
- Publication number 20120081911
- Publication date Apr 5, 2012
- Alex HORNG
- F21 - LIGHTING
Information Patent Application
BLDC Motor with Dual Rotation Directions
- Publication number 20120049698
- Publication date Mar 1, 2012
- Alex Horng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20120032341
- Publication date Feb 9, 2012
- Shin-Hua CHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipating Assembly
- Publication number 20110310559
- Publication date Dec 22, 2011
- Alex Horng
- F21 - LIGHTING
Information Patent Application
Cooling Module Assembly Method
- Publication number 20110292614
- Publication date Dec 1, 2011
- Alex Horng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling Module
- Publication number 20110284199
- Publication date Nov 24, 2011
- Alex Horng
- G05 - CONTROLLING REGULATING
Information Patent Application
Heat Dissipating Assembly
- Publication number 20110279981
- Publication date Nov 17, 2011
- Alex Horng
- F21 - LIGHTING
Information Patent Application
LAMP
- Publication number 20100295436
- Publication date Nov 25, 2010
- Alex Horng
- F21 - LIGHTING
Information Patent Application
LIGHT EMITTER WITH HEAT-DISSIPATING MODULE
- Publication number 20100259932
- Publication date Oct 14, 2010
- Alex HORNG
- F21 - LIGHTING
Information Patent Application
CIRCUIT CARRIER AND SEMICONDUCTOR PACKAGE USING THE SAME
- Publication number 20100213598
- Publication date Aug 26, 2010
- Advanced Semiconductor Engineering, Inc.
- Chien Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090289338
- Publication date Nov 26, 2009
- Advanced Semiconductor Engineering, Inc.
- Chia Chien HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090289339
- Publication date Nov 26, 2009
- Advanced Semiconductor Engineering, Inc.
- Chia Chien HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE...
- Publication number 20090278243
- Publication date Nov 12, 2009
- Advanced Semiconductor Engineering, Inc.
- Yao-Kai Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TYPE CHIP PACKAGE STRUCTURE
- Publication number 20090278242
- Publication date Nov 12, 2009
- Advanced Semiconductor Engineering, Inc.
- Yao-Kai Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20090267210
- Publication date Oct 29, 2009
- Yao-Kai CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE SUBSTRATE
- Publication number 20080066302
- Publication date Mar 20, 2008
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR FABRICATING CHIP PACKAGE STRUCTURE
- Publication number 20070259481
- Publication date Nov 8, 2007
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Chung
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FLIP CHIP PACKAGE
- Publication number 20070085218
- Publication date Apr 19, 2007
- Advanced Semiconductor Engineering, Inc.
- Yu-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE STRUCTURE
- Publication number 20070052082
- Publication date Mar 8, 2007
- Cheng-Yin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging method and package using the same
- Publication number 20060281223
- Publication date Dec 14, 2006
- Accton Technology Corporation
- Chien Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for flip chip bonding by utilizing an interposer with embedd...
- Publication number 20060088953
- Publication date Apr 27, 2006
- Advanced Semiconductor Engineering, Inc.
- Ming-Lun Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE STRUCTURE, PACKAGE SUBSTRATE AND MANUFACTURING METHOD...
- Publication number 20060076659
- Publication date Apr 13, 2006
- Chih-Ming Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE STRUCTURE AND PROCESS FOR FABRICATING THE SAME
- Publication number 20060024863
- Publication date Feb 2, 2006
- Chih-Ming Chung
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Chih-Ming Chung

Person

Patents Grantslast 30 patents

LED light source module

LED light source module and method for manufacturing the same

Advection fan and an impeller thereof

Advection-type fan and an impeller thereof

Method for manufacturing semiconductor package

Semiconductor package and manufacturing method thereof

Heat dissipating assembly

Circuit carrier and semiconductor package using the same

Lamp

Cooling module assembly method

Light emitter with heat-dissipating module

Semiconductor package and method for manufacturing the same

Stacked type chip package structure including a chip package and a...

Manufacturing method of package substrate

Process for fabricating chip package structure

Chip package structure

Chip package structure, package substrate and manufacturing method...

Chip package structure

Flip chip package and manufacturing method thereof

Multi-chip package substrate for flip-chip and wire bonding

Method for flip chip bonding by utilizing an interposer with embedd...

Stacked flip chip package

Semiconductor chip package and manufacturing method thereof

Substrate structure of BGA semiconductor package

Chip-scale semiconductor package

Patents Applicationslast 30 patents

LED LIGHT SOURCE MODULE

LED light source module

LED LIGHT SOURCE MODULE AND METHOD FOR MANUFACTURING THE SAME

LIGHT BAR STRUCTURE, LIGHT SOURCE MODULE AND LAMP

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Advection Fan and An Impeller Thereof

Advection-type Fan And An Impeller Thereof

LAMP

BLDC Motor with Dual Rotation Directions

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Heat Dissipating Assembly

Cooling Module Assembly Method

Cooling Module

Heat Dissipating Assembly

LAMP

LIGHT EMITTER WITH HEAT-DISSIPATING MODULE

CIRCUIT CARRIER AND SEMICONDUCTOR PACKAGE USING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE...

STACKED TYPE CHIP PACKAGE STRUCTURE

INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF PACKAGE SUBSTRATE

PROCESS FOR FABRICATING CHIP PACKAGE STRUCTURE

FLIP CHIP PACKAGE

MULTI-CHIP PACKAGE STRUCTURE

Packaging method and package using the same

Method for flip chip bonding by utilizing an interposer with embedd...

CHIP PACKAGE STRUCTURE, PACKAGE SUBSTRATE AND MANUFACTURING METHOD...

CHIP PACKAGE STRUCTURE AND PROCESS FOR FABRICATING THE SAME