Chih-Ming Chung

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,908,819
- Issue date Feb 20, 2024
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging substrate fine pitch metal bump and reinfor...
- Patent number 11,545,455
- Issue date Jan 3, 2023
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out pop stacking process
- Patent number 9,754,924
- Issue date Sep 5, 2017
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced package-on-package structure
- Patent number 9,601,464
- Issue date Mar 21, 2017
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out system in package and method for forming the same
- Patent number 9,583,472
- Issue date Feb 28, 2017
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out PoP stacking process
- Patent number 9,379,097
- Issue date Jun 28, 2016
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PoP structure with electrically insulating material between packages
- Patent number 9,263,426
- Issue date Feb 16, 2016
- Apple Inc.
- Jie-Hua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PoP structure with electrically insulating material between packages
- Patent number 8,963,311
- Issue date Feb 24, 2015
- Apple Inc.
- Jie-Hua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin substrate PoP structure
- Patent number 8,766,424
- Issue date Jul 1, 2014
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin substrate PoP structure
- Patent number 8,546,932
- Issue date Oct 1, 2013
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chip Singulation Assisted Structures and Methods for Improving Bond...
- Publication number 20240421126
- Publication date Dec 19, 2024
- Apple Inc.
- Chi Nung Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...
- Publication number 20230115986
- Publication date Apr 13, 2023
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...
- Publication number 20200381383
- Publication date Dec 3, 2020
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT POP STACKING PROCESS
- Publication number 20160268236
- Publication date Sep 15, 2016
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT SYSTEM IN PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20160260695
- Publication date Sep 8, 2016
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT POP STACKING PROCESS
- Publication number 20160027766
- Publication date Jan 28, 2016
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20160013155
- Publication date Jan 14, 2016
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SYSTEM IN PACKAGE
- Publication number 20150255366
- Publication date Sep 10, 2015
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PoP STRUCTURE WITH ELECTRICALLY INSULATING MATERIAL BETWEEN PACKAGES
- Publication number 20150118795
- Publication date Apr 30, 2015
- Apple Inc.
- Jie-Hua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE ON PACKAGE SYSTEMS
- Publication number 20140210111
- Publication date Jul 31, 2014
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PoP STRUCTURE WITH ELECTRICALLY INSULATING MATERIAL BETWEEN PACKAGES
- Publication number 20140084487
- Publication date Mar 27, 2014
- Apple Inc.
- Jie-Hua Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SUBSTRATE PoP STRUCTURE
- Publication number 20140048957
- Publication date Feb 20, 2014
- Apple Inc.
- Chih-Ming Chung
- H01 - BASIC ELECTRIC ELEMENTS

Chih-Ming Chung

Person

Patents Grantslast 30 patents

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Semiconductor packaging substrate fine pitch metal bump and reinfor...

Fan-out pop stacking process

Thermally enhanced package-on-package structure

Fan out system in package and method for forming the same

Fan-out PoP stacking process

PoP structure with electrically insulating material between packages

PoP structure with electrically insulating material between packages

Thin substrate PoP structure

Thin substrate PoP structure

Patents Applicationslast 30 patents

Chip Singulation Assisted Structures and Methods for Improving Bond...

Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...

Semiconductor Packaging Substrate Fine Pitch Metal Bump and Reinfor...

FAN-OUT POP STACKING PROCESS

FAN OUT SYSTEM IN PACKAGE AND METHOD FOR FORMING THE SAME

FAN-OUT POP STACKING PROCESS

THERMALLY ENHANCED PACKAGE-ON-PACKAGE STRUCTURE

EMBEDDED SYSTEM IN PACKAGE

PoP STRUCTURE WITH ELECTRICALLY INSULATING MATERIAL BETWEEN PACKAGES

EMBEDDED PACKAGE ON PACKAGE SYSTEMS

PoP STRUCTURE WITH ELECTRICALLY INSULATING MATERIAL BETWEEN PACKAGES

THIN SUBSTRATE PoP STRUCTURE