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Chih-Ming Peng

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  • Taichung, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    FLIP CHIP PACKAGE AND SUBSTRATE THEREOF
    • Publication number 20240014118
    • Publication date Jan 11, 2024
    • Chipbond Technology Corporation
    • Chun-Te Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLIP-CHIP BONDING STRUCTURE AND CIRCUIT BOARD THEREOF
    • Publication number 20230380053
    • Publication date Nov 23, 2023
    • Chipbond Technology Corporation
    • Chun-Te Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DOUBLE-SIDED FLEXIBLE CIRCUIT BOARD
    • Publication number 20230039895
    • Publication date Feb 9, 2023
    • Chipbond Technology Corporation
    • Yin-Chen Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DOUBLE-SIDED FLEXIBLE CIRCUIT BOARD
    • Publication number 20230044473
    • Publication date Feb 9, 2023
    • Chipbond Technology Corporation
    • Yin-Chen Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    STORAGE DEVICE FOR FLEXIBLE CIRCUIT PACKAGES AND CARRIER THEREOF
    • Publication number 20220110209
    • Publication date Apr 7, 2022
    • Chipbond Technology Corporation
    • Shih-Chieh Chang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD TAPE AND JOINING METHOD THEREOF
    • Publication number 20220087017
    • Publication date Mar 17, 2022
    • Chipbond Technology Corporation
    • Yin-Chen Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20210267047
    • Publication date Aug 26, 2021
    • Chipbond Technology Corporation
    • Chia-En Fan
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE CIRCUIT BOARD
    • Publication number 20210267049
    • Publication date Aug 26, 2021
    • Chipbond Technology Corporation
    • Yin-Chen Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20210185800
    • Publication date Jun 17, 2021
    • Chipbond Technology Corporation
    • Yi-Chen Lien
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DOUBLE-SIDED FLEXIBLE CIRCUIT BOARD AND LAYOUT STRUCTURE THEREOF
    • Publication number 20210159159
    • Publication date May 27, 2021
    • Chipbond Technology Corporation
    • Chun-Te Lee
    • H01 - BASIC ELECTRIC ELEMENTS