Chih-Peng Fan

Person

Taoyuan County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Connector
- Patent number 9,420,690
- Issue date Aug 16, 2016
- Unimicron Technology Corp.
- Chih-Peng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of connector
- Patent number 9,370,099
- Issue date Jun 14, 2016
- Unimicron Technology Corp.
- Chih-Peng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector
- Patent number 9,184,520
- Issue date Nov 10, 2015
- Unimicron Technology Corp.
- Chih-Peng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate having embedded capacitor
- Patent number 8,289,725
- Issue date Oct 16, 2012
- Unimicron Technology Corp.
- Chih-Peng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a circuit structure
- Patent number 8,186,049
- Issue date May 29, 2012
- Unimicron Technology Corp.
- Chih-Peng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply with regulation of voltage boosting time
- Patent number 8,129,941
- Issue date Mar 6, 2012
- Zippy Technology Corp.
- Chih-Fu Fan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Composite circuit substrate structure
- Patent number 7,906,200
- Issue date Mar 15, 2011
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package carrier and fabrication method thereof
- Patent number 7,700,986
- Issue date Apr 20, 2010
- Unimicron Technology Corp.
- Han-Pei Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backup-type power supply system
- Patent number 7,415,631
- Issue date Aug 19, 2008
- Zippy Technology Corp.
- Tsung-Chun Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Control circuit of power supply with selectable current-limiting modes
- Patent number 7,295,413
- Issue date Nov 13, 2007
- Zippy Technology Corp.
- Chih-Fu Fan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Control circuit of power supply with selectable current-limiting modes
- Patent number 7,177,131
- Issue date Feb 13, 2007
- Zippy Technology Corp.
- Tsung-Chun Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of fabricating inter-layer solid conductive rods
- Patent number 6,749,737
- Issue date Jun 15, 2004
- Unimicron Taiwan Corp.
- Jao-Chin Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming IC package having upward-facing chip cavity
- Patent number 6,709,897
- Issue date Mar 23, 2004
- Unimicron Technology Corp.
- Jao-Chin Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a multi-chip module package
- Patent number 6,506,633
- Issue date Jan 14, 2003
- Unimicron Technology Corp.
- Jao-Chin Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming IC package having downward-facing chip cavity
- Patent number 6,506,632
- Issue date Jan 14, 2003
- Unimicron Technology Corp.
- Jao-Chin Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming micro-via
- Patent number 6,395,633
- Issue date May 28, 2002
- World Wiser Electrics Inc.
- Jao-Chin Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Electrical Connector and Method of Making It
- Publication number 20170194721
- Publication date Jul 6, 2017
- Chih-Peng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrical Connector for USB and other external interface and metho...
- Publication number 20160380372
- Publication date Dec 29, 2016
- Ching-Ho Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Separable Electrical Connector and Method of Making It
- Publication number 20160344118
- Publication date Nov 24, 2016
- Ching-Ho (NMI) Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR
- Publication number 20150289374
- Publication date Oct 8, 2015
- Unimicron Technology Corp.
- Chih-Peng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CONNECTOR
- Publication number 20150289377
- Publication date Oct 8, 2015
- UNIMICRON TECHNOLOGY CORP.
- CHIH-PENG FAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTOR
- Publication number 20140335705
- Publication date Nov 13, 2014
- Chih-Peng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR
- Publication number 20140335706
- Publication date Nov 13, 2014
- Unimicron Technology Corp.
- Chih-Peng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR AND FABRICATION METHOD THEREOF
- Publication number 20130029500
- Publication date Jan 31, 2013
- Chih-Peng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20120073867
- Publication date Mar 29, 2012
- Unimicron Technology Corp.
- Chih-Peng Fan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR
- Publication number 20100319970
- Publication date Dec 23, 2010
- Unimicron Technology Corp.
- Chih-Peng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR
- Publication number 20100319973
- Publication date Dec 23, 2010
- Unimicron Technology Corp.
- Chih-Peng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR
- Publication number 20100294553
- Publication date Nov 25, 2010
- Unimicron Technology Corp.
- Chih-Peng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE CIRCUIT SUBSTRATE STRUCTURE
- Publication number 20100215927
- Publication date Aug 26, 2010
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-VOLTAGE POWER SUPPLY
- Publication number 20100115292
- Publication date May 6, 2010
- Chih-Fu FAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE CARRIER AND FABRICATION METHOD THEREOF
- Publication number 20100013068
- Publication date Jan 21, 2010
- Unimicron Technology Corp.
- Han-Pei Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20090288858
- Publication date Nov 26, 2009
- Unimicron Technology Corp.
- Chih-Peng Fan
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCUIT SUBSTRATE
- Publication number 20090008135
- Publication date Jan 8, 2009
- Unimicron Technology Corp.
- Chih-Peng Fan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT SUBSTRATE AND SURFACE TREATMENT PROCESS THEREOF
- Publication number 20080160334
- Publication date Jul 3, 2008
- Unimicron Technology Corp.
- Chih-Peng Fan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR
- Publication number 20080121417
- Publication date May 29, 2008
- Unimicron Technology Corp.
- Chih-Peng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Control circuit of power supply with selectable current-limiting modes
- Publication number 20060125419
- Publication date Jun 15, 2006
- Zippy Technology Corp.
- Tsung-Chun Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Control circuit of power supply with selectable current-limiting modes
- Publication number 20060126247
- Publication date Jun 15, 2006
- Zippy Technology Corp.
- Chih-Fu Fan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Method of laminating copper foil onto a printed circuit board
- Publication number 20050098262
- Publication date May 12, 2005
- Chia-Pin Lin
- B32 - LAYERED PRODUCTS
Information Patent Application
Method of forming IC package having upward-facing chip cavity
- Publication number 20030134455
- Publication date Jul 17, 2003
- Jao-Chin Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating inter-layer solid conductive rods
- Publication number 20030029729
- Publication date Feb 13, 2003
- Jao-Chin Cheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of laminating copper foil onto a printed circuit board
- Publication number 20030006007
- Publication date Jan 9, 2003
- Chia-Pin Lin
- B32 - LAYERED PRODUCTS

Chih-Peng Fan

Person

Patents Grantslast 30 patents

Connector

Manufacturing method of connector

Electrical connector

Package substrate having embedded capacitor

Method of making a circuit structure

Power supply with regulation of voltage boosting time

Composite circuit substrate structure

Chip package carrier and fabrication method thereof

Backup-type power supply system

Control circuit of power supply with selectable current-limiting modes

Control circuit of power supply with selectable current-limiting modes

Method of fabricating inter-layer solid conductive rods

Method of forming IC package having upward-facing chip cavity

Method of fabricating a multi-chip module package

Method of forming IC package having downward-facing chip cavity

Method of forming micro-via

Patents Applicationslast 30 patents

Electrical Connector and Method of Making It

Electrical Connector for USB and other external interface and metho...

Separable Electrical Connector and Method of Making It

CONNECTOR

MANUFACTURING METHOD OF CONNECTOR

ELECTRICAL CONNECTOR

ELECTRICAL CONNECTOR

CONNECTOR AND FABRICATION METHOD THEREOF

CIRCUIT STRUCTURE

PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR

PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR

PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR

COMPOSITE CIRCUIT SUBSTRATE STRUCTURE

MULTI-VOLTAGE POWER SUPPLY

CHIP PACKAGE CARRIER AND FABRICATION METHOD THEREOF

CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT SUBSTRATE

CIRCUIT SUBSTRATE AND SURFACE TREATMENT PROCESS THEREOF

PACKAGE SUBSTRATE HAVING EMBEDDED CAPACITOR

Control circuit of power supply with selectable current-limiting modes

Control circuit of power supply with selectable current-limiting modes

Method of laminating copper foil onto a printed circuit board

Method of forming IC package having upward-facing chip cavity

Method of fabricating inter-layer solid conductive rods

Method of laminating copper foil onto a printed circuit board