Chih-Wei Chi

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a contact structure
- Patent number 12,237,261
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer film device and method
- Patent number 12,166,128
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming interconnect structure having a barrier layer
- Patent number 12,165,975
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 12,159,838
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitrogen plasma treatment for improving interface between etch stop...
- Patent number 12,159,830
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a contact structure
- Patent number 11,996,361
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid conductive structures
- Patent number 11,894,437
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method and machine of manufacture
- Patent number 11,851,749
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective capping processes and structures formed thereby
- Patent number 11,830,742
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device
- Patent number 11,791,206
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer film device and method
- Patent number 11,777,035
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming thereof
- Patent number 11,742,290
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 11,682,624
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure and method of making
- Patent number 11,652,044
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitrogen plasma treatment for improving interface between etch stop...
- Patent number 11,532,548
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective capping processes and structures formed thereby
- Patent number 11,380,542
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer film device and method
- Patent number 11,374,127
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method and machine of manufacture
- Patent number 11,345,991
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnect structure and method
- Patent number 11,328,952
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect in a semiconductor device
- Patent number 11,152,258
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Hsuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 11,004,793
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method
- Patent number 10,840,134
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective capping processes and structures formed thereby
- Patent number 10,790,142
- Issue date Sep 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective capping processes and structures formed thereby
- Patent number 10,770,288
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chien Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer film device and method
- Patent number 10,727,350
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and pre-clean apparat...
- Patent number 10,727,118
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jung-Tang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an interconnect structure having an air gap and s...
- Patent number 10,340,223
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method
- Patent number 10,269,627
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel
- Patent number 10,209,578
- Issue date Feb 19, 2019
- AU Optronics Corp.
- Sheng-Shuo Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer film device and method
- Patent number 10,199,500
- Issue date Feb 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...
- Publication number 20250070027
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240429102
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yip LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Thereof
- Publication number 20240413087
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER FILM DEVICE AND METHOD
- Publication number 20240395939
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTANCE COPPER INTERCONNECTS
- Publication number 20240387382
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURES WITH BARRIERS AND LINERS OF VARYING THICKNESSES
- Publication number 20240387259
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION
- Publication number 20240387381
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME
- Publication number 20240379430
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nitrogen Plasma Treatment For Improving Interface Between Etch Stop...
- Publication number 20240379541
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Liners to Facilitate The Formation of Copper-Containing Via...
- Publication number 20240379556
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Free Tungsten Liner in Contact Plugs and The Method Forming...
- Publication number 20240355740
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Method and Machine of Manufacture
- Publication number 20240093357
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-LAYER FILM DEVICE AND METHOD
- Publication number 20230369500
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Thereof
- Publication number 20230361039
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION
- Publication number 20230299002
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Interconnect Structure Having an Air Gap and S...
- Publication number 20230275025
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ping Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Graphite-Based Interconnects And Methods Of Fabrication Thereof
- Publication number 20230275024
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CONTACT STRUCTURE
- Publication number 20230275019
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE LINERS AND CAPS FOR SEMICONDUCTOR STRUCTURES
- Publication number 20230154850
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURES WITH BARRIERS AND LINERS OF VARYING THICKNESSES
- Publication number 20230154792
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nitrogen Plasma Treatment For Improving Interface Between Etch Stop...
- Publication number 20230121958
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hui Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHOD FOR PASSIVATION LAYER FORM...
- Publication number 20230042277
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Pang KUO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MAKING A CONTACT STRUCTURE
- Publication number 20220384338
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID CONDUCTIVE STRUCTURES
- Publication number 20220367660
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure Including Graphite and Method Forming Same
- Publication number 20220367266
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Liners to Facilitate The Formation of Copper-Containing Via...
- Publication number 20220336367
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Film Device and Method
- Publication number 20220328690
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Capping Processes and Structures Formed Thereby
- Publication number 20220328309
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chien CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming Thereof
- Publication number 20220293528
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Cheng Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Method and Machine of Manufacture
- Publication number 20220290291
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Chun Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Chih-Wei Chi

Person

Patents Grantslast 30 patents

Semiconductor device having a contact structure

Multi-layer film device and method

Method of forming interconnect structure having a barrier layer

Method of forming an interconnect structure having an air gap and s...

Nitrogen plasma treatment for improving interface between etch stop...

Method of making a contact structure

Hybrid conductive structures

Semiconductor device, method and machine of manufacture

Selective capping processes and structures formed thereby

Method for forming semiconductor device

Multi-layer film device and method

Interconnect structure and method of forming thereof

Method of forming an interconnect structure having an air gap and s...

Contact structure and method of making

Nitrogen plasma treatment for improving interface between etch stop...

Selective capping processes and structures formed thereby

Multi-layer film device and method

Semiconductor device, method and machine of manufacture

Interconnect structure and method

Method of forming an interconnect in a semiconductor device

Method of forming an interconnect structure having an air gap and s...

Interconnect structure and method

Selective capping processes and structures formed thereby

Selective capping processes and structures formed thereby

Multi-layer film device and method

Method for manufacturing semiconductor device and pre-clean apparat...

Method of forming an interconnect structure having an air gap and s...

Interconnect structure and method

Display panel

Multi-layer film device and method

Patents Applicationslast 30 patents

METHOD OF FORMING AN INTERCONNECT STRUCTURE HAVING AN AIR GAP AND S...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Interconnect Structure and Method of Forming Thereof

MULTI-LAYER FILM DEVICE AND METHOD

LOW-RESISTANCE COPPER INTERCONNECTS

CONDUCTIVE STRUCTURES WITH BARRIERS AND LINERS OF VARYING THICKNESSES

SEMICONDUCTOR DEVICES AND METHODS OF FORMATION

INTERCONNECT STRUCTURE INCLUDING GRAPHITE AND METHOD FORMING SAME

Nitrogen Plasma Treatment For Improving Interface Between Etch Stop...

Forming Liners to Facilitate The Formation of Copper-Containing Via...

Barrier Free Tungsten Liner in Contact Plugs and The Method Forming...

Semiconductor Device, Method and Machine of Manufacture

MULTI-LAYER FILM DEVICE AND METHOD

Interconnect Structure and Method of Forming Thereof

SEMICONDUCTOR DEVICES AND METHODS OF FORMATION

Method of Forming an Interconnect Structure Having an Air Gap and S...

Graphite-Based Interconnects And Methods Of Fabrication Thereof

SEMICONDUCTOR DEVICE HAVING A CONTACT STRUCTURE

GRAPHENE LINERS AND CAPS FOR SEMICONDUCTOR STRUCTURES

CONDUCTIVE STRUCTURES WITH BARRIERS AND LINERS OF VARYING THICKNESSES

Nitrogen Plasma Treatment For Improving Interface Between Etch Stop...

SEMICONDUCTOR PROCESSING TOOL AND METHOD FOR PASSIVATION LAYER FORM...

METHOD OF MAKING A CONTACT STRUCTURE

HYBRID CONDUCTIVE STRUCTURES

Interconnect Structure Including Graphite and Method Forming Same

Forming Liners to Facilitate The Formation of Copper-Containing Via...

Multi-Layer Film Device and Method

Selective Capping Processes and Structures Formed Thereby

Interconnect Structure and Method of Forming Thereof

Semiconductor Device, Method and Machine of Manufacture