Chih-Yang PAI

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Metal-insulator-metal (MIM) capacitor structure and method for form...
- Patent number 11,031,458
- Issue date Jun 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal (MIM) capacitor structure and method for form...
- Patent number 10,468,478
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Fan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 9,614,025
- Issue date Apr 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yang Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 9,269,760
- Issue date Feb 23, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yang Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an embedded memory device
- Patent number 9,082,705
- Issue date Jul 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,969,937
- Issue date Mar 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yang Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 8,759,193
- Issue date Jun 24, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yang Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,643,074
- Issue date Feb 4, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yang Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual poly layer and method of manufacture
- Patent number 7,208,369
- Issue date Apr 24, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yang Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aqueous ammonium hydroxide amorphous silicon etch method for formin...
- Patent number 6,881,622
- Issue date Apr 19, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Hsing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming shallow trench isolation with rounded corners and...
- Patent number 6,670,279
- Issue date Dec 30, 2003
- Taiwan Semiconductor Manufacturing Company
- Chih-Yang Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a DRAM device featuring alternate fin type ca...
- Patent number 6,624,018
- Issue date Sep 23, 2003
- Taiwan Semiconductor Manufacturing Company
- Chih-Hsing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a self aligned capping layer
- Patent number 6,566,250
- Issue date May 20, 2003
- Taiwant Semiconductor Manufacturing Co., Ltd
- Yeur-Luen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming shallow trench isolation with rounded corner and...
- Patent number 6,555,442
- Issue date Apr 29, 2003
- Taiwan Semiconductor Manufacturing Company
- Chih-Yang Pai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR STRUCTURE AND METHOD FOR FORM...
- Publication number 20200035780
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Fan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL (MIM) CAPACITOR STRUCTURE AND METHOD FOR FORM...
- Publication number 20190131385
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Fan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20160172435
- Publication date Jun 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yang PAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Embedded Memory Device
- Publication number 20150318292
- Publication date Nov 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20150140774
- Publication date May 21, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yang PAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140264749
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yang PAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20140120689
- Publication date May 1, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yang PAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming an Embedded Memory Device
- Publication number 20140035020
- Publication date Feb 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING
- Publication number 20130292794
- Publication date Nov 7, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yang PAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for the same
- Publication number 20090051034
- Publication date Feb 26, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Yang Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming contact plugs for eliminating tungsten seam issue
- Publication number 20080217775
- Publication date Sep 11, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Yang Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrating a DRAM with an SRAM having butted contacts and resultin...
- Publication number 20080116496
- Publication date May 22, 2008
- Kuo-Chyuan Tzeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic capacitor structure and method for fabrication thereof
- Publication number 20050164449
- Publication date Jul 28, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Hsing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual poly layer and method of manufacture
- Publication number 20050056885
- Publication date Mar 17, 2005
- Chih-Yang Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AQUEOUS AMMONIUM HYDROXISE AMORPHOUS SILICON ETCH METHOD FOR FORMIN...
- Publication number 20030222298
- Publication date Dec 4, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Hsing Yu
- H01 - BASIC ELECTRIC ELEMENTS

Chih-Yang PAI

Person

Patents Grantslast 30 patents

Metal-insulator-metal (MIM) capacitor structure and method for form...

Metal-insulator-metal (MIM) capacitor structure and method for form...

Method of fabricating semiconductor device

Method of fabricating semiconductor device

Method of forming an embedded memory device

Semiconductor device

Method of fabricating semiconductor device

Semiconductor device

Dual poly layer and method of manufacture

Aqueous ammonium hydroxide amorphous silicon etch method for formin...

Method of forming shallow trench isolation with rounded corners and...

Method of fabricating a DRAM device featuring alternate fin type ca...

Method for forming a self aligned capping layer

Method of forming shallow trench isolation with rounded corner and...

Patents Applicationslast 30 patents

METAL-INSULATOR-METAL (MIM) CAPACITOR STRUCTURE AND METHOD FOR FORM...

METAL-INSULATOR-METAL (MIM) CAPACITOR STRUCTURE AND METHOD FOR FORM...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

Method of Forming an Embedded Memory Device

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

Method of Forming an Embedded Memory Device

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING

Semiconductor device and method for the same

Method of forming contact plugs for eliminating tungsten seam issue

Integrating a DRAM with an SRAM having butted contacts and resultin...

Microelectronic capacitor structure and method for fabrication thereof

Dual poly layer and method of manufacture

AQUEOUS AMMONIUM HYDROXISE AMORPHOUS SILICON ETCH METHOD FOR FORMIN...