Chih-Yung Hu

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 12,170,264
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D and flash memory device and method of fabricating the same
- Patent number 12,156,402
- Issue date Nov 26, 2024
- Macronix International Co., Ltd.
- Chih-Wei Hu
- G11 - INFORMATION STORAGE
Information Patent Grant
System and method for aligned stitching
- Patent number 12,154,862
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating passive devices in package structures
- Patent number 12,132,029
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Far infrared (FIR) sensor device and manufacturing method thereof a...
- Patent number 12,123,779
- Issue date Oct 22, 2024
- Pixart Imaging Incorporation
- Ming-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-dielectric vias for direct connection and method forming same
- Patent number 12,125,820
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,036
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 12,094,518
- Issue date Sep 17, 2024
- Macronix International Co., Ltd.
- Teng-Hao Yeh
- G11 - INFORMATION STORAGE
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 12,080,629
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of resistor device and system for measuring resistance of...
- Patent number 12,068,092
- Issue date Aug 20, 2024
- Cyntec Co., Ltd.
- Chih Yu Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ALD coating for critical components in process chamber
- Patent number 12,049,697
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ren-Guan Duan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
3D AND flash memory device and method of fabricating the same
- Patent number 12,052,869
- Issue date Jul 30, 2024
- Macronix International Co., Ltd.
- Chih-Wei Hu
Information Patent Grant
Calibration kit for an optical scanning device
- Patent number 12,044,844
- Issue date Jul 23, 2024
- QISDA Corporation
- Tzu-Huan Hsu
- G02 - OPTICS
Information Patent Grant
Multiple-mask multiple-exposure lithography and masks
- Patent number 12,044,977
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Peter Yu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Memory device
- Patent number 11,985,822
- Issue date May 14, 2024
- Macronix International Co., Ltd.
- Teng-Hao Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of dies with dangling bonds
- Patent number 11,908,817
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring between interconnected chips mounted on an integrated cir...
- Patent number 11,854,918
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device
- Patent number 11,825,654
- Issue date Nov 21, 2023
- Macronix International Co., Ltd.
- Chih-Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,791,243
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring for hybrid-bond
- Patent number 11,756,901
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated circuit having through-substrate...
- Patent number 11,748,544
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,735,536
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,728,247
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple-mask multiple-exposure lithography and masks
- Patent number 11,726,408
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Peter Yu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
System and method for aligned stitching
- Patent number 11,676,908
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring between interconnected chips mounted on an integrated cir...
- Patent number 11,574,847
- Issue date Feb 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming the same
- Patent number 11,562,982
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating circuit components in matrix batches
- Patent number 11,521,862
- Issue date Dec 6, 2022
- Chih-liang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring for hybrid-bond
- Patent number 11,482,499
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER ALD COATING FOR CRITICAL COMPONENTS IN PROCESS CHAMBER
- Publication number 20240384401
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ren-Guan Duan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MEMORY DEVICE
- Publication number 20240379136
- Publication date Nov 14, 2024
- Macronix International Co., Ltd.
- Teng-Hao Yeh
- G11 - INFORMATION STORAGE
Information Patent Application
MULTIPLE-MASK MULTIPLE-EXPOSURE LITHOGRAPHY AND MASKS
- Publication number 20240377755
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Peter Yu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371801
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND CLUSTER FOR TESTING ORCHESTRATION
- Publication number 20240330164
- Publication date Oct 3, 2024
- American Megatrends International, LLC
- Chih-Kai HU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY DEVICE AND COMPENSATION METHOD OF DATA RETENTION THEREOF
- Publication number 20240304264
- Publication date Sep 12, 2024
- Macronix International Co., Ltd.
- Chih-Wei Hu
- G11 - INFORMATION STORAGE
Information Patent Application
BIOMASS EPOXY RESIN COMPOSITION AND METHOD OF FORMING THE SAME AND...
- Publication number 20240287245
- Publication date Aug 29, 2024
- Industrial Technology Research Institute
- Yi-Syuan WANG
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MEMORY DEVICE
- Publication number 20240282386
- Publication date Aug 22, 2024
- Macronix International Co., Ltd.
- Chih-Wei Hu
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE AND TEST METHOD THEREOF
- Publication number 20240221855
- Publication date Jul 4, 2024
- MACRONIX INTERNATIONAL CO, LTD.
- Chih-Wei Hu
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE
- Publication number 20240170046
- Publication date May 23, 2024
- Macronix International Co., Ltd.
- Teng-Hao Yeh
- G11 - INFORMATION STORAGE
Information Patent Application
Bonding Structure of Dies with Dangling Bonds
- Publication number 20240153899
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240121954
- Publication date Apr 11, 2024
- Macronix International Co., Ltd.
- Chih-Wei Hu
- G11 - INFORMATION STORAGE
Information Patent Application
MULTILAYER ALD COATING FOR CRITICAL COMPONENTS IN PROCESS CHAMBER
- Publication number 20240043992
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ren-Guan Duan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THROUGH-DIELECTRIC VIAS FOR DIRECT CONNECTION AND METHOD FORMING SAME
- Publication number 20240021576
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING FOR HYBRID-BOND
- Publication number 20240021544
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE-MASK MULTIPLE-EXPOSURE LITHOGRAPHY AND MASKS
- Publication number 20230367229
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Peter Yu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20230369170
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufaturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING INTEGRATED CIRCUIT HAVING THROUGH-SUBSTRATE...
- Publication number 20230351086
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chia Hu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230343728
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D AND FLASH MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230337422
- Publication date Oct 19, 2023
- Macronix International Co., Ltd.
- Chih-Wei Hu
- G11 - INFORMATION STORAGE
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20230335468
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF RESISTOR DEVICE AND SYSTEM FOR MEASURING RESISTANCE OF...
- Publication number 20230326633
- Publication date Oct 12, 2023
- CYNTEC CO., LTD.
- Chih Yu Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Bonding Active Dies and Dummy Dies and Structures Thereof
- Publication number 20230275031
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Aligned Stitching
- Publication number 20230268285
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing, Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20230260941
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL SCANNING APPARATUS
- Publication number 20230204348
- Publication date Jun 29, 2023
- Qisda Corporation
- Ching-Huey Wang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR PACKAGES WITH SHORTENED TALKING PATH
- Publication number 20230154810
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seamless Bonding Layers In Semiconductor Packages and Methods of Fo...
- Publication number 20230139919
- Publication date May 4, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20230113285
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR A BRIDGE INTERCONNECT
- Publication number 20230095134
- Publication date Mar 30, 2023
- Taiwanj Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Chih-Yung Hu

Person

Patents Grantslast 30 patents

Integrated circuit packages and methods of forming the same

3D and flash memory device and method of fabricating the same

System and method for aligned stitching

Integrating passive devices in package structures

Far infrared (FIR) sensor device and manufacturing method thereof a...

Through-dielectric vias for direct connection and method forming same

Semiconductor package and manufacturing method thereof

Memory device

Manufacturing method of semiconductor structure

Structure of resistor device and system for measuring resistance of...

Multilayer ALD coating for critical components in process chamber

3D AND flash memory device and method of fabricating the same

Calibration kit for an optical scanning device

Multiple-mask multiple-exposure lithography and masks

Memory device

Semiconductor device and method of manufacturing

Bonding structure of dies with dangling bonds

Seal ring between interconnected chips mounted on an integrated cir...

Memory device

Semiconductor device and method of manufacture

Seal ring for hybrid-bond

Method of manufacturing integrated circuit having through-substrate...

Semiconductor package and manufacturing method thereof

Manufacturing method of semiconductor structure

Multiple-mask multiple-exposure lithography and masks

System and method for aligned stitching

Seal ring between interconnected chips mounted on an integrated cir...

Integrated circuit packages and methods of forming the same

Process for fabricating circuit components in matrix batches

Seal ring for hybrid-bond

Patents Applicationslast 30 patents

MULTILAYER ALD COATING FOR CRITICAL COMPONENTS IN PROCESS CHAMBER

MEMORY DEVICE

MULTIPLE-MASK MULTIPLE-EXPOSURE LITHOGRAPHY AND MASKS

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD AND CLUSTER FOR TESTING ORCHESTRATION

MEMORY DEVICE AND COMPENSATION METHOD OF DATA RETENTION THEREOF

BIOMASS EPOXY RESIN COMPOSITION AND METHOD OF FORMING THE SAME AND...

MEMORY DEVICE

MEMORY DEVICE AND TEST METHOD THEREOF

MEMORY DEVICE

Bonding Structure of Dies with Dangling Bonds

MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

MULTILAYER ALD COATING FOR CRITICAL COMPONENTS IN PROCESS CHAMBER

THROUGH-DIELECTRIC VIAS FOR DIRECT CONNECTION AND METHOD FORMING SAME

SEAL RING FOR HYBRID-BOND

MULTIPLE-MASK MULTIPLE-EXPOSURE LITHOGRAPHY AND MASKS

Semiconductor Device and Method of Manufacture

METHOD OF MANUFACTURING INTEGRATED CIRCUIT HAVING THROUGH-SUBSTRATE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

3D AND FLASH MEMORY DEVICE AND METHOD OF FABRICATING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

STRUCTURE OF RESISTOR DEVICE AND SYSTEM FOR MEASURING RESISTANCE OF...

Method of Bonding Active Dies and Dummy Dies and Structures Thereof

System and Method for Aligned Stitching

Semiconductor Device and Method

THREE DIMENSIONAL SCANNING APPARATUS

SEMICONDUCTOR PACKAGES WITH SHORTENED TALKING PATH

Seamless Bonding Layers In Semiconductor Packages and Methods of Fo...

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

METHOD AND STRUCTURE FOR A BRIDGE INTERCONNECT