Chihiro Araki

Follow

Person

Shuuchi-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bonding method and apparatus therefor
- Patent number 7,464,851
- Issue date Dec 16, 2008
- Yamaha Motor Electronics Co Ltd
- Chihiro Araki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip soldering land pattern
- Patent number 6,841,887
- Issue date Jan 11, 2005
- Kabushiki Kaisha Moric
- Chihiro Araki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,525,418
- Issue date Feb 25, 2003
- Kabushiki Kaisha Moric
- Chihiro Araki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor chip soldering land pattern
- Publication number 20020179327
- Publication date Dec 5, 2002
- Chihiro Araki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20020180065
- Publication date Dec 5, 2002
- Chihiro Araki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding method and apparatus therefor
- Publication number 20020179678
- Publication date Dec 5, 2002
- Chihiro Araki
- H01 - BASIC ELECTRIC ELEMENTS