Chihiro Ogawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
CCD-type solid state image sensor with a wiring arrangement that im...
- Patent number 6,380,977
- Issue date Apr 30, 2002
- NEC Corporation
- Chihiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of CCD type solid state image pickup device having doub...
- Patent number 6,312,970
- Issue date Nov 6, 2001
- NEC Corporation
- Chihiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state image sensing element improved in sensitivity and produ...
- Patent number 6,291,811
- Issue date Sep 18, 2001
- NEC Corporation
- Chihiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CCD type solid state image pickup device having double-structured c...
- Patent number 6,194,749
- Issue date Feb 27, 2001
- NEC Corporation
- Chihiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having barrier metal layer between a silicon e...
- Patent number 6,188,119
- Issue date Feb 13, 2001
- NEC Corporation
- Chihiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state image sensor and its fabrication
- Patent number 6,114,718
- Issue date Sep 5, 2000
- NEC Corporation
- Yasuaki Hokari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state image sensing element improved in sensitivity and produ...
- Patent number 6,104,021
- Issue date Aug 15, 2000
- NEC Corporation
- Chihiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state imaging apparatus having a plurality of metal wirings f...
- Patent number 6,097,433
- Issue date Aug 1, 2000
- NEC Corporation
- Shinichi Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making CCD-type solid-state pickup device
- Patent number 6,090,640
- Issue date Jul 18, 2000
- NEC Corporation
- Chihiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CCD-type solid-state pickup device and its fabrication method
- Patent number 6,013,925
- Issue date Jan 11, 2000
- NEC Corporation
- Chihiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process for solid-state image pick-up device with CCD r...
- Patent number 5,904,494
- Issue date May 18, 1999
- NEC Corporation
- Yasuaki Hokari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 5,510,642
- Issue date Apr 23, 1996
- NEC Corporation
- Chihiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device with reduced junction...
- Patent number 5,426,067
- Issue date Jun 20, 1995
- NEC Corporation
- Chihiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS

Chihiro Ogawa

Person

Patents Grantslast 30 patents

CCD-type solid state image sensor with a wiring arrangement that im...

Fabrication of CCD type solid state image pickup device having doub...

Solid state image sensing element improved in sensitivity and produ...

CCD type solid state image pickup device having double-structured c...

Semiconductor device having barrier metal layer between a silicon e...

Solid state image sensor and its fabrication

Solid state image sensing element improved in sensitivity and produ...

Solid state imaging apparatus having a plurality of metal wirings f...

Method of making CCD-type solid-state pickup device

CCD-type solid-state pickup device and its fabrication method

Fabrication process for solid-state image pick-up device with CCD r...

Semiconductor device

Method for manufacturing semiconductor device with reduced junction...