Chiho Ogihara

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Kanagawa, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with lid bonded on wiring board and method of...
- Patent number 8,519,529
- Issue date Aug 27, 2013
- Renesas Electronics Corporation
- Chiho Ogihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a substrate, substrate, device provided wit...
- Patent number 8,309,859
- Issue date Nov 13, 2012
- Renesas Electronics Corporation
- Chiho Ogihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate for a semiconductor device having thermoplastic r...
- Patent number 7,378,745
- Issue date May 27, 2008
- NEC Electronics Corporation
- Akimori Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR APPARATUS WITH LID BONDED ON WIRING BOARD AND METHOD...
- Publication number 20110169155
- Publication date Jul 14, 2011
- RENESAS ELECTRONICS CORPORATION
- Chiho OGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a substrate, substrate, device provided wit...
- Publication number 20100035021
- Publication date Feb 11, 2010
- NEC Electronics Corporation
- Chiho Ogihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package substrate for a semiconductor device, a fabrication method...
- Publication number 20060044735
- Publication date Mar 2, 2006
- NEC ELECTRONICS CORPORATION
- Akimori Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR