Chihon Ho

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Hybrid bonding structure and hybrid bonding method
- Patent number 11,756,922
- Issue date Sep 12, 2023
- Huawei Technologies Co., Ltd.
- Ran He
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230031151
- Publication date Feb 2, 2023
- Huawei Technologies Co., Ltd
- Ran HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING STRUCTURE AND HYBRID BONDING METHOD
- Publication number 20220077105
- Publication date Mar 10, 2022
- Huawei Technologies Co.,Ltd.
- Ran He
- H01 - BASIC ELECTRIC ELEMENTS