Chii Shang Hong

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 12,094,793
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with releasable isolation layer protection
- Patent number 12,080,625
- Issue date Sep 3, 2024
- Infineon Technologies Austria AG
- Li Fong Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear spacer for spacing a carrier of a package
- Patent number 11,942,383
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with dual heat dissipation structures
- Patent number 11,908,771
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 11,876,028
- Issue date Jan 16, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device by using different co...
- Patent number 11,804,424
- Issue date Oct 31, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with releasable isolation layer protection
- Patent number 11,791,238
- Issue date Oct 17, 2023
- Infineon Technologies Austria AG
- Li Fong Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a laser-activatable mold compound
- Patent number 11,289,436
- Issue date Mar 29, 2022
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multi-level conductive clip for top side...
- Patent number 11,075,185
- Issue date Jul 27, 2021
- Infineon Technologies AG
- Chii Shang Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with multi-level conductive clip for top side...
- Patent number 10,978,380
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Chii Shang Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-branch terminal for integrated circuit (IC) package
- Patent number 10,971,436
- Issue date Apr 6, 2021
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded package with single piece exposed heat slug and leads
- Patent number 10,840,164
- Issue date Nov 17, 2020
- Infineon Technologies AG
- Chii Shang Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-branch terminal for integrated circuit (IC) package
- Patent number 10,354,943
- Issue date Jul 16, 2019
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240395646
- Publication date Nov 28, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING
- Publication number 20240145340
- Publication date May 2, 2024
- INFINEON TECHNOLOGIES AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240038612
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED...
- Publication number 20230298956
- Publication date Sep 21, 2023
- INFINEON TECHNOLOGIES AG
- Chii Shang HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL FUNCTIONAL THERMAL PERFORMANCE SEMICONDUCTOR PACKAGE AND RELAT...
- Publication number 20230154827
- Publication date May 18, 2023
- INFINEON TECHNOLOGIES AG
- Jayaganasan Narayanasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Releasable Isolation Layer Protection
- Publication number 20220415753
- Publication date Dec 29, 2022
- Li Fong Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20220157682
- Publication date May 19, 2022
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINEAR SPACER FOR SPACING A CARRIER OF A PACKAGE
- Publication number 20220148934
- Publication date May 12, 2022
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Device by Using Different Co...
- Publication number 20210175157
- Publication date Jun 10, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having a Laser-Activatable Mold Compound
- Publication number 20200381380
- Publication date Dec 3, 2020
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Multi-Level Conductive Clip for Top Side...
- Publication number 20200350238
- Publication date Nov 5, 2020
- Chii Shang Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Multi-Level Conductive Clip for Top Side...
- Publication number 20200350272
- Publication date Nov 5, 2020
- Chii Shang Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-BRANCH TERMINAL FOR INTEGRATED CIRCUIT (IC) PACKAGE
- Publication number 20200020618
- Publication date Jan 16, 2020
- INFINEON TECHNOLOGIES AG
- Thomas STOEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonded Package with Single Piece Exposed Heat Slug and Leads
- Publication number 20190355643
- Publication date Nov 21, 2019
- INFINEON TECHNOLOGIES AG
- Chii Shang Hong
- H01 - BASIC ELECTRIC ELEMENTS

Chii Shang Hong

Person

Patents Grantslast 30 patents

Package with electrically insulated carrier and at least one step o...

Semiconductor package with releasable isolation layer protection

Linear spacer for spacing a carrier of a package

Power semiconductor device with dual heat dissipation structures

Package with electrically insulated carrier and at least one step o...

Method for fabricating a semiconductor device by using different co...

Semiconductor package with releasable isolation layer protection

Semiconductor package having a laser-activatable mold compound

Semiconductor package with multi-level conductive clip for top side...

Semiconductor package with multi-level conductive clip for top side...

Multi-branch terminal for integrated circuit (IC) package

Wire bonded package with single piece exposed heat slug and leads

Multi-branch terminal for integrated circuit (IC) package

Patents Applicationslast 30 patents

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

SEMICONDUCTOR PACKAGE AND RELATED METHODS OF MANUFACTURING

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED...

DUAL FUNCTIONAL THERMAL PERFORMANCE SEMICONDUCTOR PACKAGE AND RELAT...

Semiconductor Package with Releasable Isolation Layer Protection

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

LINEAR SPACER FOR SPACING A CARRIER OF A PACKAGE

Method for Fabricating a Semiconductor Device by Using Different Co...

Semiconductor Package Having a Laser-Activatable Mold Compound

Semiconductor Package with Multi-Level Conductive Clip for Top Side...

Semiconductor Package with Multi-Level Conductive Clip for Top Side...

MULTI-BRANCH TERMINAL FOR INTEGRATED CIRCUIT (IC) PACKAGE

Wire Bonded Package with Single Piece Exposed Heat Slug and Leads