Chii-Wen Chen

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices and method for forming the same
- Patent number 12,165,947
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with resistive element
- Patent number 12,119,262
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure with resistive ele...
- Patent number 12,040,178
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal dissipation in semiconductor devices
- Patent number 11,942,390
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned scheme for semiconductor device and method of forming...
- Patent number 11,901,228
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with resistive element
- Patent number 11,901,289
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned scheme for semiconductor device and method of forming...
- Patent number 11,830,770
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with resistive element
- Patent number 11,798,848
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer for conductive via to decrease contact resi...
- Patent number 11,742,291
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier free interface between beol interconnects
- Patent number 11,694,926
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with resistive elements
- Patent number 11,670,501
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-wire cavity for low capacitance
- Patent number 11,551,968
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with resistive element
- Patent number 11,404,369
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion barrier layer for conductive via to decrease contact resi...
- Patent number 11,362,035
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal dissipation in semiconductor devices
- Patent number 11,355,410
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned scheme for semiconductor device and method of forming...
- Patent number 11,342,222
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device with resistive element
- Patent number 11,217,482
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with resisti...
- Patent number 10,985,011
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with resisti...
- Patent number 10,515,852
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with resistive element
- Patent number 10,304,772
- Issue date May 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and layout method
- Patent number 10,164,002
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wan-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having smaller transition layer via
- Patent number 9,553,043
- Issue date Jan 24, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lee-Chung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of forming a via
- Patent number 9,496,217
- Issue date Nov 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frequency synthesizer with injection pulling/pushing suppression/mi...
- Patent number 9,473,157
- Issue date Oct 18, 2016
- Mediatek Inc.
- Chun-Ming Kuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Frequency synthesizer and related method for improving power effici...
- Patent number 9,300,305
- Issue date Mar 29, 2016
- MediaTek Inc.
- Chun-Ming Kuo
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Mask treatment for double patterning design
- Patent number 9,257,279
- Issue date Feb 9, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiing-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuits
- Patent number 9,153,484
- Issue date Oct 6, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chii-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of making integrated circuits including air gaps around int...
- Patent number 9,147,602
- Issue date Sep 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chii-Ping Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask assignment optimization
- Patent number 9,003,336
- Issue date Apr 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chun Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for measuring/compensating mismatches in digit...
- Patent number 8,994,467
- Issue date Mar 31, 2015
- MediaTek Singapore Pte Ltd.
- Wen-Chang Lee
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESI...
- Publication number 20240404953
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379436
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Communication Apparatus and Method for Handling Radio Link Monitoring
- Publication number 20240276255
- Publication date Aug 15, 2024
- MEDIATEK INC.
- Chii-Horng Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CONDUCTIVE STRUCTURE IN SEMICONDUCTOR STRUCTURE AND METHOD FOR FORM...
- Publication number 20240266279
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cai-Ling WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20240194559
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHOD FOR FORMING THE SAME
- Publication number 20240021494
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Sheh HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Communication Apparatus and Method for Handling a Tracking Referenc...
- Publication number 20240022385
- Publication date Jan 18, 2024
- MEDIATEK SINGAPORE PTE LTD
- BIWEI CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING...
- Publication number 20230411210
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING...
- Publication number 20230377966
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BARRIER LAYER AND METHOD FOR FO...
- Publication number 20230369226
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cai-Ling WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESI...
- Publication number 20230335499
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH RESISTIVE ELEMENT
- Publication number 20230326795
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Sheh HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FREE INTERFACE BETWEEN BEOL INTERCONNECTS
- Publication number 20230290678
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH RESISTIVE ELE...
- Publication number 20230268176
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Wen HSUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Interconnect Structures in Semiconductor Devices
- Publication number 20230060269
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Interconnect Structure And Method Of Forming The Same
- Publication number 20230011792
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-WIRE CAVITY FOR LOW CAPACITANCE
- Publication number 20220359266
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Scheme for Semiconductor Device and Method of Forming...
- Publication number 20220319922
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH RESISTIVE ELEMENT
- Publication number 20220319987
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Te CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Dissipation in Semiconductor Devices
- Publication number 20220310472
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESI...
- Publication number 20220310526
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Scheme for Semiconductor Device and Method of Forming...
- Publication number 20220277991
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH RESISTIVE ELEMENT
- Publication number 20220130727
- Publication date Apr 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Sheh HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHOD FOR FORMING THE SAME
- Publication number 20220028752
- Publication date Jan 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Sheh HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Dissipation in Semiconductor Devices
- Publication number 20210335690
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Sheh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FREE INTERFACE BETWEEN BEOL INTERCONNECTS
- Publication number 20210335663
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-WIRE CAVITY FOR LOW CAPACITANCE
- Publication number 20210335655
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESI...
- Publication number 20210287994
- Publication date Sep 16, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH RESISTIVE ELEMENTS
- Publication number 20210249251
- Publication date Aug 12, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Wen HSUEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Scheme for Semiconductor Device and Method of Forming...
- Publication number 20210098290
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS

Chii-Wen Chen

Person

Patents Grantslast 30 patents

Semiconductor devices and method for forming the same

Semiconductor device structure with resistive element

Method for manufacturing semiconductor structure with resistive ele...

Thermal dissipation in semiconductor devices

Self-aligned scheme for semiconductor device and method of forming...

Semiconductor device structure with resistive element

Self-aligned scheme for semiconductor device and method of forming...

Semiconductor device structure with resistive element

Diffusion barrier layer for conductive via to decrease contact resi...

Barrier free interface between beol interconnects

Semiconductor device structure with resistive elements

Inter-wire cavity for low capacitance

Semiconductor device structure with resistive element

Diffusion barrier layer for conductive via to decrease contact resi...

Thermal dissipation in semiconductor devices

Self-aligned scheme for semiconductor device and method of forming...

Method for forming semiconductor device with resistive element

Structure and formation method of semiconductor device with resisti...

Structure and formation method of semiconductor device with resisti...

Semiconductor device structure with resistive element

Semiconductor device and layout method

Interconnect structure having smaller transition layer via

Method and apparatus of forming a via

Frequency synthesizer with injection pulling/pushing suppression/mi...

Frequency synthesizer and related method for improving power effici...

Mask treatment for double patterning design

Methods of forming integrated circuits

Methods of making integrated circuits including air gaps around int...

Mask assignment optimization

Method and apparatus for measuring/compensating mismatches in digit...

Patents Applicationslast 30 patents

DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESI...

SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

Communication Apparatus and Method for Handling Radio Link Monitoring

CONDUCTIVE STRUCTURE IN SEMICONDUCTOR STRUCTURE AND METHOD FOR FORM...

THERMAL DISSIPATION IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICES AND METHOD FOR FORMING THE SAME

Communication Apparatus and Method for Handling a Tracking Referenc...

SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING...

SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING...

SEMICONDUCTOR DEVICE STRUCTURE WITH BARRIER LAYER AND METHOD FOR FO...

DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESI...

SEMICONDUCTOR DEVICE STRUCTURE WITH RESISTIVE ELEMENT

BARRIER FREE INTERFACE BETWEEN BEOL INTERCONNECTS

METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE WITH RESISTIVE ELE...

Forming Interconnect Structures in Semiconductor Devices

Self-Aligned Interconnect Structure And Method Of Forming The Same

INTER-WIRE CAVITY FOR LOW CAPACITANCE

Self-Aligned Scheme for Semiconductor Device and Method of Forming...

SEMICONDUCTOR DEVICE STRUCTURE WITH RESISTIVE ELEMENT

Thermal Dissipation in Semiconductor Devices

DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESI...

Self-Aligned Scheme for Semiconductor Device and Method of Forming...

SEMICONDUCTOR DEVICE STRUCTURE WITH RESISTIVE ELEMENT

SEMICONDUCTOR DEVICES AND METHOD FOR FORMING THE SAME

Thermal Dissipation in Semiconductor Devices

BARRIER FREE INTERFACE BETWEEN BEOL INTERCONNECTS

INTER-WIRE CAVITY FOR LOW CAPACITANCE

DIFFUSION BARRIER LAYER FOR CONDUCTIVE VIA TO DECREASE CONTACT RESI...

SEMICONDUCTOR DEVICE STRUCTURE WITH RESISTIVE ELEMENTS

Self-Aligned Scheme for Semiconductor Device and Method of Forming...