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Ama-gun, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device including cooler
Patent number
9,070,666
Issue date
Jun 30, 2015
Denso Corporation
Kuniaki Mamitsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including cooler
Patent number
8,957,517
Issue date
Feb 17, 2015
Denso Corporation
Kuniaki Mamitsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device including cooler
Patent number
8,884,426
Issue date
Nov 11, 2014
Denso Corporation
Kuniaki Mamitsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package cooled by grounded cooler
Patent number
8,558,375
Issue date
Oct 15, 2013
Denso Corporation
Kuniaki Mamitsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Production method of semiconductor module with resin-molded assembl...
Patent number
8,530,281
Issue date
Sep 10, 2013
Denso Corporation
Chikage Noritake
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor module molded by resin with heat radiation plate open...
Patent number
7,944,045
Issue date
May 17, 2011
Denso Corporation
Chikage Noritake
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device having solder layer
Patent number
7,601,625
Issue date
Oct 13, 2009
Denso Corporation
Chikage Noritake
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having tin-based solder layer and method for m...
Patent number
7,579,212
Issue date
Aug 25, 2009
Denso Corporation
Kimiharu Kayukawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having tin-based solder layer and method for m...
Patent number
7,361,996
Issue date
Apr 22, 2008
Denso Corporation
Kimiharu Kayukawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor power device
Patent number
7,148,125
Issue date
Dec 12, 2006
Denso Corporation
Mikimasa Suzuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing semiconductor device having controlled sur...
Patent number
6,927,167
Issue date
Aug 9, 2005
Denso Corporation
Yutaka Fukuda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with bump structure
Patent number
5,656,858
Issue date
Aug 12, 1997
Nippondenso Co., Ltd.
Ichiharu Kondo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING COOLER
Publication number
20140361425
Publication date
Dec 11, 2014
Kuniaki MAMITSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING COOLER
Publication number
20140203426
Publication date
Jul 24, 2014
DENSO CORPORATION
Kuniaki MAMITSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE INCLUDING COOLER
Publication number
20140015120
Publication date
Jan 16, 2014
DENSO CORPORATION
Kuniaki MAMITSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20120001318
Publication date
Jan 5, 2012
DENSO CORPORATION
Kuniaki MAMITSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRODUCTION METHOD OF SEMICONDUCTOR MODULE WITH RESIN-MOLDED ASSEMBL...
Publication number
20110318884
Publication date
Dec 29, 2011
DENSO CORPORATION
Chikage NORITAKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE WITH RESIN-MOLDED PACKAGE OF HEAT SPREADER AND...
Publication number
20110316142
Publication date
Dec 29, 2011
DENSO CORPORATION
Chikage NORITAKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE WITH COOLING MECHANISM AND PRODUCTION METHOD T...
Publication number
20110316143
Publication date
Dec 29, 2011
DENSO CORPORATION
Chikage NORITAKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
Publication number
20090224398
Publication date
Sep 10, 2009
DENSO CORPORATION
Chikage NORITAKE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device having tin-based solder layer and method for m...
Publication number
20070176293
Publication date
Aug 2, 2007
DENSO CORPORATION
Kimiharu Kayukawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device having tin-based solder layer and method for m...
Publication number
20060049521
Publication date
Mar 9, 2006
DENSO CORPORATION
Kimiharu Kayukawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for manufacturing semiconductor device having solder layer
Publication number
20050233568
Publication date
Oct 20, 2005
Chikage Noritake
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device having controlled surface roughness and method...
Publication number
20040119088
Publication date
Jun 24, 2004
DENSO Corporation
Yutaka Fukuda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for manufacturing semiconductor power device
Publication number
20030119281
Publication date
Jun 26, 2003
Mikimasa Suzuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Transfer-molded power device and method for manufacturing transfer-...
Publication number
20030022464
Publication date
Jan 30, 2003
Naohiko Hirano
H01 - BASIC ELECTRIC ELEMENTS